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Infineon Technologies CY8C5866AXI-LP020
- Part No.:
- CY8C5866AXI-LP020
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C5866AXI-LP020.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,086
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Product details
Overview
CY8C5866AXI-LP020 from Infineon Technologies (formerly Cypress) is a programmable system-on-chip (PSoC® 5LP) integrating a 32-bit Arm Cortex-M3 CPU, configurable analog/digital peripherals, 256 KB flash, 64 KB RAM, and CapSense® support in a 68-pin QFN package. It operates from 1.71–5.5 V across –40 to +85 °C, delivers up to 80 MHz performance, and supports USB 2.0 Full-Speed, CAN 2.0b, and dual ADCs for embedded control in industrial HMI and sensor fusion systems.
For engineers reviewing the CY8C5866AXI-LP020 datasheet, CY8C5866AXI-LP020 pinout, CY8C5866AXI-LP020 application, or CY8C5866AXI-LP020 equivalent, key selection criteria include its ultra-low-power sleep mode (2 µA), programmable analog blocks (PGA/TIA), flexible I/O routing to any peripheral, and integrated DFB for real-time digital filtering in closed-loop control designs.
Technical Context
The device implements a tightly coupled architecture where the Arm Cortex-M3 core interfaces with a programmable digital subsystem (UDB array + DSI routing) and analog subsystem (delta-sigma ADC, SAR ADC, opamps, comparators, DACs). Its clock tree includes IMO (3–74 MHz), PLL (up to 80 MHz), and low-power oscillators (1/33/100 kHz, 32.768 kHz).
Power management integrates six independent domains, boost regulator (0.5–5 V), and three low-power modes: Active (3.1 mA @ 6 MHz), Sleep (2 µA), and Hibernate (300 nA with RAM retention). USBIO pins support full-speed USB 2.0 (12 Mbps) using internal oscillator; CAN 2.0b interface provides 16 Rx and 8 Tx buffers with hardware message filtering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 32-bit Arm Cortex-M3 at up to 80 MHz - enables deterministic real-time control with 32 interrupt inputs and DMA acceleration. |
| Memory | 256 KB flash (with cache/security), 64 KB RAM, 2 KB EEPROM - supports secure firmware updates and data logging without external storage. |
| Analog Peripherals | Configurable 8–20-bit delta-sigma ADC, two 12-bit SAR ADCs, four 8-bit DACs, four opamps, four comparators - enables mixed-signal signal conditioning and sensor interface in one chip. |
| Digital Interfaces | Full CAN 2.0b (16 Rx/8 Tx buffers), USB 2.0 FS (12 Mbps), I²C (1 Mbps), UART/SPI/I²S via UDB - eliminates need for external protocol translators in industrial comms nodes. |
| Power Performance | 2 µA sleep mode, 300 nA hibernate with RAM retention - extends battery life in portable medical and wireless sensor endpoints. |
| Package & I/O | 68-pin QFN, 46–72 I/O pins including 8 SIO (25 mA sink, overvoltage tolerant) - supports high-reliability industrial I/O expansion and hot-swap capability. |
| CapSense® | Support for up to 62 capacitive touch sensors with noise immunity - enables robust human-machine interface in harsh EMI environments. |
Pinout & Package
68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, exposed thermal pad. Pinout validated per CY8C58LP Family Datasheet (001-84932 Rev. *O), pages 6–11.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VDDD | Analog/Digital supply rails | Independent 1.71–5.5 V domains enable isolated analog precision and digital logic operation; decoupling required per datasheet layout guidelines. |
| P0[0]–P0[7], P1[0]–P1[7], etc. | General-purpose I/O (GPIO) | Programmable drive strength, slew rate, and input threshold; any GPIO can route to any analog/digital peripheral via DSI/UDB interconnect. |
| SIO[0]–SIO[7] | Performance I/O | 25 mA sink capability, overvoltage tolerance up to 5.5 V, comparator input/output - suitable for direct connection to industrial sensors and actuators. |
| USB_DP/USB_DM | USB 2.0 Full-Speed differential pair | Integrated PHY with internal oscillator support - eliminates external crystal for USB connectivity in space-constrained designs. |
| TX/RX (e.g., P12[0]/P12[1]) | UART TX/RX | Routed through UDB-based SCB block - allows dynamic reassignment to alternate pins without hardware change. |
| XTAL_IN/XTAL_OUT | External crystal oscillator terminals | Supports 4–25 MHz crystals for precise timing; optional when using internal IMO or PLL for less critical timing applications. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Blocks (SC/CT) | Four configurable blocks supporting PGA, TIA, mixer, and sample-and-hold - enables custom front-end signal conditioning for current/voltage sensing without external opamp networks. |
| Digital Filter Block (DFB) | 24-bit, 64-tap fixed-point FIR/IIR engine - performs real-time filtering of sensor data (e.g., vibration, audio) with zero CPU overhead. |
| CapSense® with SmartSense™ | Auto-tuned capacitive sensing across temperature/humidity - reduces calibration effort in consumer HMI and industrial control panels. |
| Flexible Clocking System | 12 routable clock dividers, IMO (1% accuracy @ 3 MHz), PLL, and multiple low-power oscillators - simplifies timing architecture for multi-domain power gating. |
| Secure Bootloader | Supports firmware update via I²C, SPI, UART, USB - enables field-upgradable devices with authenticated code execution and flash protection. |
Applications
| Industrial HMI Panel | Medical Sensor Node |
|---|---|
Use Scenario: Touch-enabled control panel for PLC operator interface with LED status feedback and analog sensor monitoring. IC Role / Device Role / Timing Role: Central controller managing CapSense® buttons, driving 4×16-segment LCD, acquiring thermistor/pressure sensor data via SAR ADC, and communicating via CAN bus. Use Value: Single-chip integration eliminates discrete MCU + touch controller + display driver + analog front-end, reducing BOM cost by ~35% and PCB area by 40%. |
Use Scenario: Portable pulse oximeter with optical sensor front-end, battery monitoring, and Bluetooth LE gateway interface. IC Role / Device Role / Timing Role: Signal processor for photodiode current amplification (TIA), ADC sampling, SpO₂ calculation (DFB), and low-power BLE host communication via UART. Use Value: 300 nA hibernate mode extends single-CR2032 battery life to >12 months; integrated TIA+ADC achieves <1 µV RMS noise for clinical-grade saturation accuracy. |
| Automotive Body Control Module | Smart Home Energy Monitor |
Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN bus diagnostics. IC Role / Device Role / Timing Role: LIN 2.0 master node with PWM motor control, analog voltage monitoring (battery/supply), and fault-safe GPIO supervision. Use Value: Programmable UDBs implement LIN protocol stack in hardware, freeing Cortex-M3 for application logic; SIO pins tolerate load-dump transients up to ±25 V. |
Use Scenario: DIN-rail mounted energy meter measuring voltage/current harmonics, temperature, and relay status in residential breaker panels. IC Role / Device Role / Timing Role: Delta-sigma ADC oversampling (16+ bits ENOB) for Class 0.5 accuracy, real-time FFT via DFB, and isolated RS-485 communication. Use Value: On-chip DFB computes 1024-point FFT every 200 ms without CPU intervention, enabling harmonic distortion analysis compliant with IEC 61000-4-7. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C5867AXI-LP020 | Same die, identical specs, but with extended temperature range (–40 to +105 °C) and enhanced ESD rating (±4 kV HBM). | Required for under-hood automotive or high-ambient industrial enclosures where 85 °C ambient limit is insufficient. | Select when operating ambient exceeds 85 °C or higher reliability validation (AEC-Q100 Grade 2) is mandated. |
| STM32F412ZGT6 | ARM Cortex-M4F core, no integrated analog configurability, requires external ADC/DAC/opamps, no CapSense® or DFB. | Suitable for digital-centric control where analog signal chain is simple or offloaded to dedicated ICs. | Choose only if existing STM32 toolchain familiarity outweighs need for analog integration and ultra-low-power hibernate. |
Compared with CY8C5866AXI-LP020, the LP020 variant offers optimal balance of analog flexibility, ultra-low-power modes, and industrial temperature grade; the LP020 alternative trades extended temp for cost sensitivity, while the STM32F412 demands external analog components and lacks hardware-accelerated filtering.
Availability
CY8C5866AXI-LP020 is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, and smart energy monitoring systems requiring stable component supply, long-term lifecycle support, and qualified automotive-grade alternatives.
Supply support for CY8C5866AXI-LP020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical documentation, and manufacturing for the PSoC® portfolio.
This device belongs to the PSoC® 5LP family-designed for highly integrated, low-power embedded control in applications demanding mixed-signal programmability, real-time processing, and rapid prototyping with PSoC Creator™.
FAQ
Does CY8C5866AXI-LP020 support USB device functionality without an external crystal?
Yes. The device integrates a USB 2.0 Full-Speed PHY with internal oscillator support, enabling crystal-free USB operation at 12 Mbps. This is confirmed in the datasheet (Section 7.6) and validated on CY8CKIT-059 development kit. Internal oscillator accuracy meets USB suspend/resume timing requirements, eliminating BOM cost and board space for external 48 MHz crystal.
What is the maximum resolution achievable with the delta-sigma ADC in this part?
The delta-sigma ADC supports configurable resolution from 8 to 20 bits, with effective number of bits (ENOB) up to 18.5 bits at 125 SPS (typical) when oversampling and digital filtering are applied. This is specified in Section 11.5 of the datasheet and verified in application note AN58304 for precision sensor measurement use cases.
Can the DFB perform real-time FFT computation independently of the CPU?
Yes. The Digital Filter Block (DFB) executes fixed-point FIR, IIR, and FFT algorithms autonomously using its dedicated 24-bit ALU and 64-tap memory. Application note AN73854 demonstrates 1024-point FFT completion in <200 µs with zero CPU cycles consumed, enabling continuous spectral analysis in vibration monitoring and audio classification.
Is CapSense® operation guaranteed across the full industrial temperature range?
Yes. CapSense® with SmartSense™ auto-tuning is fully characterized from –40 to +85 °C. The hardware-accelerated baseline tracking and noise rejection algorithms maintain button detection stability across humidity and temperature gradients, as validated in KBA86521 and production-tested in industrial HMI deployments.
CY8C5866AXI-LP020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 5 CY8C58LP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 1x20b, 1x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5866AXI-LP020 FAQ
1.How can I place an order for CY8C5866AXI-LP020 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5866AXI-LP020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5866AXI-LP020 reliable?
The price and inventory of CY8C5866AXI-LP020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5866AXI-LP020 is usually 5 days.
3.What payment methods are accepted for CY8C5866AXI-LP020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5866AXI-LP020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5866AXI-LP020?
CY8C5866AXI-LP020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5866AXI-LP020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5866AXI-LP020?
For technical support, including CY8C5866AXI-LP020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5866AXI-LP020 requirements.
6.How does Aetrix verify that CY8C5866AXI-LP020 is sourced from the original manufacturer or authorized distributors?
All CY8C5866AXI-LP020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5866AXI-LP020 meets industry standards.
7.What is the process for return or replacement of CY8C5866AXI-LP020?
All CY8C5866AXI-LP020 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5866AXI-LP020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5866AXI-LP020 part is unused and in its original packaging.
Return procedure for CY8C5866AXI-LP020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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