My Inquiry
My Account
Infineon Technologies CY8C5866LTI-LP022
- Part No.:
- CY8C5866LTI-LP022
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C5866LTI-LP022.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,918
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C5866LTI-LP022 from Infineon Technologies (formerly Cypress) is a 32-bit Arm Cortex-M3-based programmable system-on-chip (PSoC® 5LP) integrating configurable analog/digital peripherals, 256 KB flash, 64 KB RAM, and full-speed USB 2.0 interface. It operates from 1.71–5.5 V across –40 to +85 °C, supports CapSense® for up to 62 sensors, and delivers ultra-low-power operation down to 300 nA in hibernate mode with RAM retention. Used in embedded human-interface and sensor-fusion applications requiring mixed-signal integration on a single die.
For engineers reviewing the CY8C5866LTI-LP022 datasheet, CY8C5866LTI-LP022 pinout, CY8C5866LTI-LP022 application, or CY8C5866LTI-LP022 equivalent, key selection criteria include its 68-pin QFN package, dual 12-bit SAR ADCs, integrated CAN 2.0b controller with 16 Rx/8 Tx buffers, programmable UDB array for custom logic synthesis, and support for PSoC Creator™ schematic-driven firmware co-design.
Technical Context
The CY8C5866LTI-LP022 implements a tightly coupled mixed-signal architecture where the Arm Cortex-M3 core (up to 80 MHz) interfaces directly with a digital subsystem built around 24 universal digital blocks (UDBs), a 24-channel DMA controller, and a 24-bit digital filter processor (DFB). Analog resources include four opamps, four comparators, four 8-bit DACs, and a configurable delta-sigma ADC (8–20 bit).
Its routing fabric enables any analog or digital peripheral function-including USBIO, CAN, I²C, SPI, and CapSense®-to be assigned to any of 62 GPIOs or eight SIO pins with 25 mA sink capability and overvoltage tolerance. Clocking includes internal PLL (up to 80 MHz), 32.768-kHz RTC oscillator, and low-power ILO at 1/33/100 kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 @ up to 80 MHz - deterministic real-time control with 32 interrupt inputs and hardware debug trace support |
| Memory | 256 KB flash (with ECC & security), 64 KB SRAM, 2 KB EEPROM - sufficient for secure bootloaders, firmware updates, and sensor data buffering |
| Analog Peripherals | Configurable delta-sigma ADC (8–20 bit), two 12-bit SAR ADCs, four opamps, four comparators - enables high-precision sensor signal conditioning without external components |
| Digital Interfaces | Full-Speed USB 2.0 (12 Mbps), CAN 2.0b (16 Rx/8 Tx), I²C (1 Mbps), UART/SPI/I²S via UDB - supports industrial connectivity and protocol bridging |
| Power Modes | 300 nA hibernate (RAM retention), 2 µA sleep, 3.1 mA active @ 6 MHz - extends battery life in portable and energy-harvested systems |
| I/O System | 62 GPIOs + 8 SIO pins, full pin-peripheral routing, CapSense® on any GPIO - simplifies PCB layout and enables flexible touch/sensor placement |
| Package | 68-pin QFN (10 × 10 mm, 0.5 mm pitch) - surface-mount compatible with standard reflow profiles and suitable for space-constrained industrial modules |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad. RoHS-compliant, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | IO power supply domains | Four independent 1.2–5.5 V domains enable mixed-voltage interfacing (e.g., 1.8 V logic + 5 V analog sensors) |
| P0[0]–P0[7], P1[0]–P1[7], etc. | General-purpose I/O (GPIO) | 62 total GPIOs; each supports CapSense®, analog input, digital peripheral routing, or LCD segment drive |
| SIO0–SIO7 | Performance I/O | Eight pins with 25 mA sink, programmable thresholds, comparator mode, hot-swap tolerance - ideal for direct LED driving or industrial I/O |
| USB_DP / USB_DM | USB 2.0 differential pair | On-die USB PHY supports full-speed device mode; requires no external transceiver or crystal for basic enumeration |
| CAN_TX / CAN_RX | CAN 2.0b physical layer interface | Dedicated pins with internal termination and filtering; support 1 Mbps operation with integrated message RAM and FIFO management |
| XRES | External reset input | Active-low asynchronous reset; debounced internally and compatible with pushbutton or supervisor ICs |
Key Features
| Feature | Design Value |
|---|---|
| Programmable UDB Array | 24 universal digital blocks enable custom logic synthesis (e.g., LIN, CRC, PRS, quadrature decoder) without FPGA-level complexity |
| CapSense® Engine | Hardware-accelerated capacitive sensing supporting up to 62 self- or mutual-capacitance sensors with noise immunity and automatic baseline tracking |
| Digital Filter Block (DFB) | 24-bit fixed-point DFB with 64-tap FIR/IIR capability - offloads real-time filtering (e.g., ECG, vibration analysis) from CPU |
| Flexible Clocking | Multiple clock sources (IMO, ILO, PLL, XTAL, RTC) with 12 dividers routable to any peripheral - enables precise timing domain isolation and low-jitter signal generation |
| Secure Bootloader | ROM-resident bootloader supports firmware updates via I²C, SPI, UART, or USB with checksum validation and flash write protection |
Applications
| Industrial HMI Panel | Medical Sensor Node |
|---|---|
|
Use Scenario: Touch-enabled control panel for PLC interface with LED status indicators and analog sensor monitoring. IC Role / Device Role / Timing Role: Central system-on-chip handling CapSense® touch buttons, analog front-end for temperature/pressure sensors, and CAN bus communication to main controller. Use Value: Reduces BOM count by integrating opamps, ADCs, DACs, and CAN transceiver functions - eliminates need for discrete signal conditioning and protocol translation ICs. |
Use Scenario: Portable patient monitor collecting ECG, SpO₂, and temperature data with local display and USB data export. IC Role / Device Role / Timing Role: Mixed-signal SoC performing analog acquisition (delta-sigma ADC + PGA), real-time DFB-based filtering, and USB mass-storage-class data streaming. Use Value: Achieves <1 µV RMS noise floor in ECG path using on-chip programmable gain amplifier and correlated double sampling - meets AAMI EC11 requirements without external instrumentation amps. |
| Automotive Body Control Module | Smart Home Gateway |
|
Use Scenario: Door module managing window lift, mirror adjustment, and interior lighting with LIN and CAN connectivity. IC Role / Device Role / Timing Role: Programmable MCU executing LIN slave stack, PWM motor control, and CAN gateway logic with fault diagnostics. Use Value: UDB-based LIN implementation ensures <±1.5% baud rate accuracy across temperature - satisfies ISO 17987-4 timing compliance without external crystal. |
Use Scenario: Battery-powered Zigbee-to-WiFi bridge with environmental sensing (humidity, VOC) and capacitive touch controls. IC Role / Device Role / Timing Role: Low-power SoC acquiring sensor data, running CapSense® UI, and hosting lightweight TCP/IP stack over USB CDC ACM. Use Value: 300 nA hibernate current with retained RAM allows wake-on-touch or sensor threshold event - extends coin-cell life beyond 5 years per ANSI C108.1. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F303VCT6 | ARM Cortex-M4F core, 256 KB flash, 48 KB RAM, no integrated CapSense® or UDB logic; relies on external analog components for sensor front-end | Limited analog integration - requires external opamps, comparators, and ADC drivers for multi-sensor designs | Prefer when floating-point math or DSP extensions are required, but expect higher component count and layout complexity for analog signal chains |
| MAX32660 | ARM Cortex-M4, 256 KB flash, 96 KB RAM, integrated ultra-low-noise analog front-end (16-bit SAR ADC, PGA), no CAN or USB PHY | No native CAN or USB - requires external transceivers or bridge ICs for industrial connectivity | Prefer for ultra-low-power wearable biosensors where analog precision dominates over protocol flexibility |
Compared with STM32F303VCT6 and MAX32660, CY8C5866LTI-LP022 uniquely combines full-speed USB, CAN 2.0b, CapSense®, and a programmable digital/analog fabric in one 68-pin QFN - enabling rapid prototyping of feature-rich embedded systems without external protocol or interface ICs.
Availability
CY8C5866LTI-LP022 is available at Aetrix Electronics and suitable for industrial HMI panels, medical sensor nodes, automotive body controllers, and smart home gateways requiring stable component supply, long-term lifecycle support, and qualified production lots.
Supply support for CY8C5866LTI-LP022 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive microcontrollers, and secure connectivity solutions.
CY8C5866LTI-LP022 belongs to the PSoC® 5LP family - designed specifically for embedded systems demanding high analog integration, field-programmable logic, and ultra-low-power operation in consumer, industrial, and medical applications.
FAQ
Does CY8C5866LTI-LP022 support USB device mode without an external crystal?
Yes. The device integrates a factory-trimmed internal oscillator (IMO) with ±1% accuracy at 3 MHz, which is sufficient for USB full-speed device enumeration without requiring an external 12-MHz crystal. This reduces BOM cost and board area while maintaining USB TID#10840032 certification.
What is the maximum operating frequency of the Arm Cortex-M3 core in CY8C5866LTI-LP022?
The Arm Cortex-M3 core runs at up to 80 MHz, enabled by the on-chip PLL driven from the IMO or external crystal. This frequency is fully supported across the entire industrial temperature range (–40 to +85 °C) and voltage range (1.71–5.5 V), with all peripherals functional at maximum clock rate.
Can CapSense® be implemented on any GPIO pin of CY8C5866LTI-LP022?
Yes. All 62 GPIO pins support CapSense® functionality, including self-capacitance, mutual-capacitance, and proximity sensing. The hardware engine handles scanning, baseline tracking, and noise rejection independently of the CPU, allowing concurrent firmware execution during touch acquisition.
Is the CY8C5866LTI-LP022 pin-compatible with other devices in the CY8C58LP family?
No. While sharing the same architecture and peripheral set, CY8C5866LTI-LP022 uses a 68-pin QFN package. Other variants include 100-pin TQFP and 99-pin CSP packages. Pin mapping differs across packages; migration requires PCB redesign and I/O constraint reassignment in PSoC Creator™.
CY8C5866LTI-LP022 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 5 CY8C58LP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 1x20b, 1x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5866LTI-LP022 FAQ
1.How can I place an order for CY8C5866LTI-LP022 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5866LTI-LP022 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5866LTI-LP022 reliable?
The price and inventory of CY8C5866LTI-LP022 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5866LTI-LP022 is usually 5 days.
3.What payment methods are accepted for CY8C5866LTI-LP022?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5866LTI-LP022 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5866LTI-LP022?
CY8C5866LTI-LP022 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5866LTI-LP022 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5866LTI-LP022?
For technical support, including CY8C5866LTI-LP022 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5866LTI-LP022 requirements.
6.How does Aetrix verify that CY8C5866LTI-LP022 is sourced from the original manufacturer or authorized distributors?
All CY8C5866LTI-LP022 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5866LTI-LP022 meets industry standards.
7.What is the process for return or replacement of CY8C5866LTI-LP022?
All CY8C5866LTI-LP022 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5866LTI-LP022, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5866LTI-LP022 part is unused and in its original packaging.
Return procedure for CY8C5866LTI-LP022:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C5866LTI-LP022 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
