Infineon Technologies CY8C5868LTI-LP039

Overview

CY8C5868LTI-LP039 from Infineon Technologies (formerly Cypress) is a 32-bit Arm Cortex-M3-based programmable system-on-chip (PSoC® 5LP) integrating configurable analog/digital peripherals, 256 KB flash, 64 KB RAM, and USB 2.0 Full-Speed interface. It operates from 1.71–5.5 V across –40 to +85 °C, supports CapSense® up to 62 sensors, and delivers ultra-low-power operation with 300 nA hibernate mode. Used in embedded human-interface and sensor-fusion applications requiring mixed-signal reconfigurability.

For engineers reviewing the CY8C5868LTI-LP039 datasheet, CY8C5868LTI-LP039 pinout, CY8C5868LTI-LP039 application, or CY8C5868LTI-LP039 equivalent, key selection criteria include its 68-pin QFN package, dual SAR + delta-sigma ADC architecture, full CAN 2.0b support, programmable UDB array for custom logic, and integrated USB PHY with internal oscillator compliance (TID#10840032).

Technical Context

The CY8C5868LTI-LP039 implements a tightly coupled mixed-signal SoC architecture where the Arm Cortex-M3 core (up to 80 MHz) orchestrates independently configurable analog and digital subsystems via a unified routing fabric. Its digital subsystem includes 24 UDBs supporting hardware synthesis of UART, SPI, PWM, CRC, PRS, and gate-level logic - all routable to any GPIO.

Analog resources include four opamps, four comparators, four 8-bit DACs, two 12-bit SAR ADCs, one 8–20-bit delta-sigma ADC, and four SC/CT blocks enabling PGA, TIA, mixer, and sample-and-hold functions. Clocking combines IMO (1–74 MHz), PLL, ILO (1/33/100 kHz), and 32.768-kHz RTC crystal support with 12 programmable dividers.

Key Specifications

Pinout & Package

Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, thermally enhanced with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable SoC applications.

Compared with CY8C5868LTI-LP039, the AXI variant trades package size for thermal resilience and I/O scalability, while the LTI-LP039 variant sacrifices memory and USB to reduce cost - making the original optimal for USB-integrated, battery-powered HMI designs within commercial temperature range.

Availability

CY8C5868LTI-LP039 is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical sensors, automotive body controllers, and smart home gateways requiring stable component supply and long-term lifecycle assurance.

Supply support for CY8C5868LTI-LP039 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full PSoC® portfolio, delivering high-performance, configurable mixed-signal solutions for embedded systems.

The CY8C58LP family targets applications demanding reconfigurable analog/digital integration - especially human-machine interfaces, sensor hubs, and low-power industrial controllers where hardware flexibility reduces time-to-market.

FAQ

Does CY8C5868LTI-LP039 support USB device enumeration without an external crystal?

Yes. The device integrates a USB 2.0 Full-Speed PHY compliant with TID#10840032 and uses its internal main oscillator (IMO) for USB clock generation. No external crystal is required, simplifying layout and reducing BOM cost while maintaining USB specification compliance.

What is the maximum number of CapSense® electrodes supported on this part?

CY8C5868LTI-LP039 supports up to 62 self- or mutual-capacitance sensors using its dedicated CapSense® subsystem. Electrodes can be assigned to any GPIO, and the hardware-accelerated scanning engine handles baseline tracking, noise filtering, and gesture recognition without CPU intervention.

Can the delta-sigma ADC and SAR ADC operate simultaneously?

Yes. The two 12-bit SAR ADCs and the single 8–20-bit delta-sigma ADC share no critical resources and can run concurrently. Their outputs are routed independently through the DSI fabric, enabling synchronized acquisition of fast transient signals (e.g., motor current) and high-resolution slow signals (e.g., temperature).

Is the 300 nA hibernate mode verified across the full temperature range?

Yes. The 300 nA hibernate current (with RAM retention) is specified and tested from –40 to +85 °C per the datasheet's Device Level Specifications table (Section 11.2). This value includes leakage and regulator quiescent current under worst-case process/voltage corners.