Infineon Technologies CY8C6016BZI-F04

Overview

CY8C6016BZI-F04 from Infineon is a PSOC™ 61 MCU featuring a 150-MHz Arm® Cortex®-M4F CPU with FPU and MPU, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, and dual-core architecture (M4 + system-reserved M0+). It operates from 1.7 V to 3.6 V, supports Deep Sleep at 7 µA with 64-KB SRAM retention, and integrates SIMO DC-DC converter (<1 µA quiescent current), targeting ultra-low-power IoT edge nodes with secure sensor fusion and human interface.

For engineers reviewing the CY8C6016BZI-F04 datasheet, CY8C6016BZI-F04 pinout, CY8C6016BZI-F04 application, or CY8C6016BZI-F04 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip cryptographic acceleration (AES/SHA/RSA/TRNG), QSPI XIP with hardware encryption, and 100 GPIOs with Smart I/O Boolean logic in Deep Sleep.

Technical Context

The CY8C6016BZI-F04 implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application execution while the Cortex-M0+ is dedicated to system-level services (e.g., BLE stack, security monitor) and is not user-accessible. Clocking combines an 8-MHz IMO (±2%), 32-kHz ILO, programmable PLL/FLL, and fractional peripheral dividers for precise timing across analog, digital, and communication blocks.

Analog integration includes a 12-bit 1-Msps SAR ADC with 16-channel sequencer and result averaging, two deep-sleep-capable comparators, a 12-bit DAC (<2 µs settling), and two opamps in CTBm blocks. Programmable digital resources comprise twelve UDBs (8 macrocells each) and two Smart I/O ports enabling GPIO-level Boolean operations during Deep Sleep.

Key Specifications

Pinout & Package

This device is packaged in a 80-ball Wafer-Level Chip-Scale Package (WLCSP) with 0.43 mm height, optimized for space-constrained IoT endpoints. Pin assignments follow Infineon's standardized CY8C61x6 pinout layout, supporting flexible I/O configuration including six overvoltage-tolerant (OVT) pins and dedicated SWD/JTAG debug interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power secure MCU applications.

Compared with CY8C6016BZI-F04, CY8C6247BZI-D54 delivers expanded memory and CAN FD but increases active power and cost, while STM32WB55RGV integrates BLE radio but sacrifices programmable analog/digital resources and advanced security features essential for robust IoT edge processing.

Availability

CY8C6016BZI-F04 is available at Aetrix Electronics and suitable for smart home sensor hubs, wearable health monitors, industrial wireless nodes, and secure edge gateways requiring stable component supply, long-term lifecycle support, and qualified wafer-level packaging.

Supply support for CY8C6016BZI-F04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

The PSoC™ 6 family targets secure, ultra-low-power IoT endpoints, combining ARM dual-core processing with programmable analog/digital fabric and hardware security - designed specifically for battery-operated, sensor-rich, and cloud-connected devices.

FAQ

Is CY8C6016BZI-F04 pin-compatible with other CY8C61xx devices?

Yes - it shares the 80-ball WLCSP (0.43 mm height) package and pinout with CY8C61xx series variants such as CY8C6147BZI-D54. Pin functions (e.g., GPIO banks, SCB mappings, power domains) are consistent across the CY8C61x6/7 product line, enabling drop-in replacement within the same package variant.

Does CY8C6016BZI-F04 support USB device and host modes simultaneously?

No - the USB Full-Speed interface supports device mode or host mode, but not both concurrently. Mode selection is configured at boot via the USB configuration register; switching requires firmware reinitialization and is not runtime-dynamic. External USB transceivers or OTG switches are needed for dual-role operation.

What is the maximum operating temperature for CY8C6016BZI-F04?

The CY8C6016BZI-F04 is rated for industrial temperature range: –40 °C to +85 °C ambient. This is validated per Infineon's qualification standards for the 80-WLCSP package and applies to all operating modes including active, Deep Sleep, and Hibernate - no derating required within this range.

Can the on-chip SIMO DC-DC converter power external circuitry?

No - the SIMO buck converter is strictly for internal core and analog domain regulation (VDDD, VCC). Its output is not exposed to pins and cannot source external loads. External regulators must be used for powering sensors, radios, or other peripherals outside the MCU die.