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Infineon Technologies CY8C6036BZI-F04

Part No.:
CY8C6036BZI-F04
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
124-VFBGA
Datasheet:
AetrixCY8C6036BZI-F04.pdf
Description:
IC MCU 32BIT 512KB FLASH 124BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,701

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Product details

Overview

CY8C6036BZI-F04 from Infineon is a PSOC™ 61 MCU featuring a 150-MHz Arm® Cortex®-M4F CPU with floating-point unit and MPU, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, and dual-core architecture (M4 + reserved M0+). It operates from 1.7 V to 3.6 V, supports Deep Sleep at 7 µA with 64-KB SRAM retention, and integrates SIMO DC-DC converter (<1 µA quiescent current). Used in battery-powered IoT edge nodes requiring secure, low-power sensor fusion and capacitive touch.

For engineers reviewing the CY8C6036BZI-F04 datasheet, CY8C6036BZI-F04 pinout, CY8C6036BZI-F04 application, or CY8C6036BZI-F04 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V core), on-chip cryptographic acceleration (AES/SHA/TRNG), QSPI XIP support up to 640 Mbps, and CAPSENSE™ liquid-tolerant proximity sensing capability.

Technical Context

The CY8C6036BZI-F04 implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application execution while the Cortex-M0+ is dedicated to system-level services (e.g., BLE stack, security monitor) and not user-accessible. Clocking uses a hierarchical tree with FLL (IMO-based), PLL (external crystal-based), and fractional dividers enabling precise peripheral clock tuning.

Analog subsystem integration includes a 12-bit 1-Msps SAR ADC with 16-channel sequencer and hardware averaging, two Deep Sleep-capable comparators, a 12-bit DAC with <2-µs settling time, and two opamps with configurable low-power modes - all accessible via programmable routing to up to 100 GPIOs including six overvoltage-tolerant pins.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core 150-MHz Arm® Cortex®-M4F with FPU and MPU; primary application processor with single-cycle multiply
Memory 1-MB flash (RWW), 288-KB SRAM (with retention control), 1-Kb OTP eFuse for secure key storage
Power Efficiency Deep Sleep current = 7 µA with 64-KB SRAM retention; active slope = 22 µA/MHz @ 0.9 V core
Analog Peripherals 12-bit 1-Msps SAR ADC (16-channel sequencer + averaging), 12-bit DAC (<2 µs settling), 2 opamps, 2 LP comparators
Security Hardware crypto accelerator (AES-128/256, SHA-1/256, ECC), TRNG, 8 protection contexts, debug disable capability
Interface Support 9 SCBs (configurable as SPI/I²C/UART), USB FS device/host, QSPI/SMIF (XIP + encryption), PDM/I²S/TDM audio
Capacitive Sensing CAPSENSE™ with SmartSense auto-tuning, >100:1 SNR, mutual/self-sensing, liquid-tolerant operation

Pinout & Package

The CY8C6036BZI-F04 is housed in a 124-ball BGA package (6 × 6 mm, 0.5 mm pitch) with 100 usable GPIOs, including six overvoltage-tolerant (OVT) pins and two Smart I/O ports (16 pins total) supporting Boolean logic during Deep Sleep.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO Bank 0 Programmable drive strength/slew rate; supports CAPSENSE™ self-capacitance and analog input
P12[0]–P12[7] GPIO Bank 12 OVT-capable; suitable for direct connection to 5-V sensors or industrial I/O without level shifters
XTAL_IN / XTAL_OUT External Crystal Oscillator Supports 16–35 MHz crystals for high-accuracy clock source; enables PLL-based system clock generation
VDDA / VSSA Analog Power Supply Independent 1.7–3.6 V analog domain; decoupling required for ADC/DAC accuracy and noise immunity
SWDIO / SWCLK Debug Interface 2-pin SWD interface for programming and real-time debugging; JTAG ID = 0x1E4B0069 (die revision 1)

Key Features

Feature Design Value
Dual-CPU Power Gating Independent voltage scaling (0.9 V / 1.1 V) and clock gating per core enable dynamic power optimization across workloads
QSPI XIP with Encryption Execute-in-place from external flash with on-the-fly AES decryption and 4-KB cache reduces boot latency and memory footprint
Smart I/O Logic 16 GPIOs support Boolean operations (AND/OR/XOR) in Deep Sleep, enabling wake-on-pattern detection without CPU wake-up
CAPSENSE™ SmartSense Hardware-accelerated auto-tuning eliminates manual calibration; maintains >95% touch accuracy under water or condensation
Programmable Digital (UDBs) 12 universal digital blocks (8 macrocells each) implement custom peripherals (e.g., LIN, S/PDIF) or waveform generators in Verilog

Applications

Wearable Health Monitor Smart Home Hub Controller

Use Scenario: Continuous ECG/PPG signal acquisition with on-device motion artifact filtering and BLE transmission.

IC Role / Device Role / Timing Role: Primary application MCU managing analog front-end sampling, DSP preprocessing, CAPSENSE™ button/gesture interface, and BLE stack offload via M0+.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends coin-cell life beyond 12 months; integrated ADC + DAC eliminates external signal chain components.

Use Scenario: Central coordinator for Zigbee/Z-Wave sub-GHz radios, local voice processing, and multi-sensor environmental monitoring.

IC Role / Device Role / Timing Role: System host controller interfacing with external radio modules via UART/SPI, managing secure OTA updates using crypto accelerator and protected flash regions.

Use Value: Hardware AES-256 and SHA-256 accelerate firmware signature verification; QSPI XIP enables fast boot from encrypted external flash.

Industrial Wireless Sensor Node Capacitive Touch Remote Control

Use Scenario: Battery-powered vibration/temperature node with LoRaWAN backhaul and predictive maintenance analytics.

IC Role / Device Role / Timing Role: Edge AI inference engine running lightweight ML models on Cortex-M4F, using TCPWM for PWM-driven sensor excitation and Smart I/O for wake-on-event detection.

Use Value: 22 µA/MHz active current at 0.9 V core enables >5-year operation on AA batteries; programmable analog supports direct piezo/vibration sensor interface.

Use Scenario: Waterproof TV remote with gesture recognition, backlight control, and proximity wake-up.

IC Role / Device Role / Timing Role: CAPSENSE™ subsystem driver with liquid-tolerant mutual capacitance scanning; M4F executes proximity-to-gesture state machine and IR LED timing control.

Use Value: SmartSense auto-calibration maintains consistent touch response across humidity ranges (20–95% RH); OVT pins simplify direct connection to IR LED drivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6137BZI-F14 Higher memory: 2-MB flash, 384-KB SRAM; adds USB HS PHY and additional SCBs Better suited for USB host applications and larger firmware images; same 124-BGA footprint Select when needing USB high-speed host capability or >1-MB code space; pin-compatible but requires updated power sequencing
STM32WB55RGV Single Cortex-M4 @ 64 MHz; integrated BLE 5.0 radio; no CAPSENSE™ or programmable analog/digital Optimized for Bluetooth-centric designs; lacks hardware crypto diversity and analog flexibility Choose for pure BLE endpoint use cases where RF integration outweighs need for capacitive sensing or analog configurability

Compared with CY8C6036BZI-F04, CY8C6137BZI-F14 offers expanded memory and USB HS at identical package size, while STM32WB55RGV trades programmable analog/digital and CAPSENSE™ for integrated BLE radio - making CY8C6036BZI-F04 optimal for mixed-signal, multi-interface, and liquid-tolerant UI applications.

Availability

CY8C6036BZI-F04 is available at Aetrix Electronics and suitable for wearable health monitors, smart home hubs, industrial wireless sensor nodes, and capacitive touch remotes requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.

Supply support for CY8C6036BZI-F04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and microcontroller solutions for industrial, automotive, and IoT markets.

The PSOC™ 6 product line targets secure, ultra-low-power edge devices demanding heterogeneous processing, configurable analog/digital peripherals, and hardware-enforced trust - exemplified by the CY8C6036BZI-F04's dual-core architecture and CAPSENSE™ integration.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6036BZI-F04?

The Cortex-M4F core operates at up to 150 MHz, verified under 1.1-V core voltage conditions per Infineon's 002-21414 Rev. *R datasheet. At 0.9-V core, maximum frequency is reduced to maintain timing closure and power efficiency, with active current slope specified at 22 µA/MHz.

Does CY8C6036BZI-F04 support external memory execution (XIP)?

Yes - it supports Execute-In-Place from external quad SPI flash via its QSPI/SMIF interface, with on-the-fly AES-128 decryption and a dedicated 4-KB cache to reduce latency and power consumption during code fetch operations.

Can the Cortex-M0+ core be used for application code development?

No - in the CY8C6036BZI-F04 (PSOC™ 61 series), the Cortex-M0+ is reserved exclusively for system functions including BLE stack handling, security monitoring, and inter-processor communication; it is not accessible to user application firmware.

What is the role of the SIMO DC-DC converter in this MCU?

The on-chip Single-In Multiple-Out (SIMO) buck converter delivers regulated voltages to multiple internal domains (CPU, analog, I/O) with <1 µA quiescent current, enabling efficient power conversion from a single input supply and eliminating need for external PMIC in space-constrained designs.

CY8C6036BZI-F04 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
124-VFBGA
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6036BZI-F04 FAQ

1.How can I place an order for CY8C6036BZI-F04 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6036BZI-F04 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6036BZI-F04 reliable?

The price and inventory of CY8C6036BZI-F04 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6036BZI-F04 is usually 5 days.

3.What payment methods are accepted for CY8C6036BZI-F04?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6036BZI-F04 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6036BZI-F04?

CY8C6036BZI-F04 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6036BZI-F04 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6036BZI-F04?

For technical support, including CY8C6036BZI-F04 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6036BZI-F04 requirements.

6.How does Aetrix verify that CY8C6036BZI-F04 is sourced from the original manufacturer or authorized distributors?

All CY8C6036BZI-F04 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6036BZI-F04 meets industry standards.

7.What is the process for return or replacement of CY8C6036BZI-F04?

All CY8C6036BZI-F04 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6036BZI-F04, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6036BZI-F04 part is unused and in its original packaging.

Return procedure for CY8C6036BZI-F04:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6036BZI-F04 Tags

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