Infineon Technologies CY8C6117BZI-F34
- Part No.:
- CY8C6117BZI-F34
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6117BZI-F34.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 124BGA
- Quantity:
- Payment:

- Shipping:

Inventory:179
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Product details
Overview
CY8C6117BZI-F34 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system control, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, USB FS device/host interface, and QSPI/XIP support - deployed in IoT edge nodes requiring secure, low-power, sensor-rich operation with real-time responsiveness.
For engineers reviewing the CY8C6117BZI-F34 datasheet, CY8C6117BZI-F34 pinout, CY8C6117BZI-F34 application, or CY8C6117BZI-F34 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz M4 @ 0.9 V), on-chip SIMO DC-DC converter (<1 µA quiescent), Deep Sleep current (7 µA w/64-KB SRAM retention), and hardware crypto acceleration for TLS/OTA updates.
Technical Context
The CY8C6117BZI-F34 implements a tightly coupled dual-CPU architecture where the Cortex®-M4F handles application workloads while the Cortex®-M0+ manages security services, peripheral offload, and boot integrity - both cores share memory-mapped peripherals via a high-bandwidth interconnect. Its clock system integrates an 8-MHz IMO (±2%), 32-kHz ILO, PLL/FLL frequency synthesis, and integer/fractional dividers to drive TCPWM, SCB, and USB timing domains independently.
Power management includes six operational modes, a backup domain with RTC and 64-byte memory, and a SIMO buck converter enabling single-supply 1.7–3.6-V operation. The programmable analog subsystem delivers 12-bit SAR ADC (1-Msps, 16-channel sequencer), two Deep Sleep-capable comparators, and two opamps - all accessible without waking the main CPU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex®-M4F + 100-MHz Cortex®-M0+, with independent MPUs and DMA controllers |
| Memory | 1-MB application flash (RWW), 32-KB AUXFlash, 32-KB SFlash, 288-KB SRAM with retention control |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9-V core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, two opamps, 12-bit DAC (<2 µs settling) |
| Connectivity | Nine configurable SCBs (SPI/I²C/UART), USB Full-Speed device/host, QSPI/SMIF with XIP & on-the-fly encryption |
| Security | Hardware crypto accelerator (AES-128/256, SHA-256, ECC, TRNG), eight protection contexts, debug disable capability |
| Capacitive Sensing | CAPSENSE™ with SmartSense auto-tuning, liquid tolerance, and self/mutual sensing support up to 99 segments |
Pinout & Package
The CY8C6117BZI-F34 is housed in a 124-ball BGA package (8 × 8 mm, 0.5-mm pitch) with exposed thermal pad, supporting fine-pitch PCB assembly and thermal dissipation for sustained 150-MHz operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply Banks | Independent 1.7–3.6-V supplies per bank enable mixed-voltage interfacing (e.g., 1.8-V sensors + 3.3-V radios) |
| VDDD / VDDA | Digital & Analog Core Supplies | Separate 1.1-V or 0.9-V core rails optimized for performance vs. ultra-low-power modes |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; initiates cold boot or system recovery sequence |
| SWDCLK / SWDIO | ARM Serial Wire Debug Interface | Two-pin debug path supporting firmware update, trace, and secure lock/unlock via SWJ-DP |
| USB_DP / USB_DM | USB Full-Speed Differential Pair | On-die transceivers compliant with USB 2.0 FS; no external PHY required for device/host enumeration |
| QSPI0_[0:3] | Quad SPI Data Lines | Direct connection to external flash for Execute-In-Place (XIP); supports octal mode up to 640 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Gating | Independent clock and power gating per core enables selective wake/sleep - e.g., M0+ monitors sensors while M4 remains off |
| Smart I/O Boolean Logic | 16 GPIOs grouped into two Smart I/O ports that execute AND/OR/XOR on pin states during Deep Sleep - no CPU involvement |
| Hardware Crypto Acceleration | Dedicated engine performs AES-128/256 encryption/decryption, SHA-256 hashing, and ECC signing in <100 cycles - accelerates TLS handshake by 5× |
| Programmable UDBs | Twelve universal digital blocks (8 macrocells each) implement custom logic (e.g., LIN bus, PRS generators) without consuming CPU cycles or flash |
| Integrated SIMO Buck Converter | Single-inductor, multi-output DC-DC reduces external BOM count; <1 µA quiescent current preserves battery life in always-on sensors |
Applications
| Smart Home Sensor Hub | Industrial Predictive Maintenance Node |
|---|---|
|
Use Scenario: Central hub aggregating temperature, humidity, motion, and touch inputs from multiple wireless endpoints. IC Role / Device Role / Timing Role: Main application processor, CAPSENSE™ touch controller, USB host for dongle-based Zigbee/Thread gateways, and QSPI XIP executor for OTA firmware images. Use Value: Dual-core separation allows real-time sensor fusion on M4 while M0+ handles secure boot and radio stack scheduling - reducing latency below 10 ms. |
Use Scenario: Vibration and temperature monitoring on rotating machinery with local FFT analysis and alert triggering. IC Role / Device Role / Timing Role: Signal acquisition front-end (SAR ADC + PDM mic input), edge analytics engine (M4 FFT), and secure data uploader (crypto-accelerated TLS over UART-to-ESP32 bridge). Use Value: On-chip 1-Msps ADC and hardware FFT assist enable sub-100-µs sampling intervals and deterministic processing - critical for bearing fault detection. |
| Wearable Health Monitor | Secure Access Control Terminal |
|
Use Scenario: Optical heart-rate and SpO₂ monitor with capacitive touch UI and Bluetooth LE coexistence. IC Role / Device Role / Timing Role: Analog front-end (opamps + ADC), CAPSENSE™ for buttonless UI, USB for charging/firmware sync, and crypto engine for BLE pairing key generation. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life to >7 days on coin cell - while maintaining full context across sleep/wake cycles. |
Use Scenario: Tamper-resistant door controller using fingerprint matching, NFC reader interface, and encrypted log storage. IC Role / Device Role / Timing Role: Secure enclave (M0+ runs trusted firmware), biometric preprocessing (M4 executes feature extraction), and hardware-accelerated AES-256 for log encryption to external flash. Use Value: Eight protection contexts isolate biometric data, keys, and application code - meeting ISO/IEC 15408 EAL4+ requirements for physical access systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247BZI-D54 | Higher memory (2-MB flash, 384-KB SRAM), adds CAN FD controller and enhanced USB HS support | Better suited for automotive body control modules requiring CAN FD and higher throughput | Select when CAN FD or >1-MB flash is mandatory; otherwise CY8C6117BZI-F34 offers lower cost and power |
| STM32WB55RGV | Single Cortex-M4 core, integrated Bluetooth LE 5.0 radio, no CAPSENSE™ or programmable analog/digital blocks | Optimized for BLE endpoint devices with minimal analog sensing or UI complexity | Choose only if wireless connectivity is primary need and programmable peripherals are unnecessary |
Compared with CY8C6247BZI-D54 and STM32WB55RGV, the CY8C6117BZI-F34 uniquely balances ultra-low-power dual-core execution, on-die programmable analog/digital logic, and hardware security - making it optimal for resource-constrained, sensor-rich IoT edge nodes where flexibility and BOM reduction matter more than raw radio integration or automotive-grade interfaces.
Availability
CY8C6117BZI-F34 is available at Aetrix Electronics and suitable for smart home hubs, industrial predictive maintenance sensors, wearable health monitors, and secure access terminals requiring stable component supply across long-lifecycle deployments.
Supply support for CY8C6117BZI-F34 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and microcontroller solutions for industrial, automotive, and IoT markets.
The PSOC™ 6 product line was engineered to unify programmable analog/digital logic, dual-core processing, and hardware security in a single chip - targeting next-generation IoT endpoints where software-defined functionality and zero-trust security are non-negotiable.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6117BZI-F34?
The Cortex-M4F core operates at up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection unit enabled. This frequency is achievable under 1.1-V core supply with active cooling; at 0.9-V core, max frequency is reduced to maintain power efficiency while delivering 22 µA/MHz active current draw.
Does CY8C6117BZI-F34 support external memory execution (XIP)?
Yes, the device supports Execute-In-Place from external quad SPI flash via its QSPI/SMIF interface, including on-the-fly AES-256 decryption and a dedicated 4-KB cache to reduce power consumption during instruction fetch. XIP operates at up to 640 Mbps in octal mode with hardware address remapping.
How many GPIOs are available, and what advanced I/O features do they support?
CY8C6117BZI-F34 provides up to 100 programmable GPIOs, including six overvoltage-tolerant (OVT) pins and two Smart I/O ports (16 pins total) capable of Boolean logic operations during Deep Sleep. All GPIOs support configurable drive strength, slew rate, and multiple pull-up/down modes - with hardware routing to analog peripherals and CAPSENSE™.
Is the CAPSENSE™ subsystem capable of liquid-tolerant operation?
Yes, CAPSENSE™ on CY8C6117BZI-F34 delivers industry-leading signal-to-noise ratio (SNR) and supports automatic hardware tuning (SmartSense) for dynamic compensation against water, sweat, or condensation. It enables robust proximity and mutual-capacitance sensing on curved surfaces - validated per IEC 61000-4-6 for conducted immunity in wet environments.
CY8C6117BZI-F34 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6117BZI-F34 FAQ
1.How can I place an order for CY8C6117BZI-F34 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6117BZI-F34 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6117BZI-F34 reliable?
The price and inventory of CY8C6117BZI-F34 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6117BZI-F34 is usually 5 days.
3.What payment methods are accepted for CY8C6117BZI-F34?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6117BZI-F34 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6117BZI-F34?
CY8C6117BZI-F34 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6117BZI-F34 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6117BZI-F34?
For technical support, including CY8C6117BZI-F34 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6117BZI-F34 requirements.
6.How does Aetrix verify that CY8C6117BZI-F34 is sourced from the original manufacturer or authorized distributors?
All CY8C6117BZI-F34 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6117BZI-F34 meets industry standards.
7.What is the process for return or replacement of CY8C6117BZI-F34?
All CY8C6117BZI-F34 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6117BZI-F34, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6117BZI-F34 part is unused and in its original packaging.
Return procedure for CY8C6117BZI-F34:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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