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Infineon Technologies CY8C6117BZI-F34

Part No.:
CY8C6117BZI-F34
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
124-VFBGA
Datasheet:
AetrixCY8C6117BZI-F34.pdf
Description:
IC MCU 32BIT 1MB FLASH 124BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:179

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Product details

Overview

CY8C6117BZI-F34 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system control, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, USB FS device/host interface, and QSPI/XIP support - deployed in IoT edge nodes requiring secure, low-power, sensor-rich operation with real-time responsiveness.

For engineers reviewing the CY8C6117BZI-F34 datasheet, CY8C6117BZI-F34 pinout, CY8C6117BZI-F34 application, or CY8C6117BZI-F34 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz M4 @ 0.9 V), on-chip SIMO DC-DC converter (<1 µA quiescent), Deep Sleep current (7 µA w/64-KB SRAM retention), and hardware crypto acceleration for TLS/OTA updates.

Technical Context

The CY8C6117BZI-F34 implements a tightly coupled dual-CPU architecture where the Cortex®-M4F handles application workloads while the Cortex®-M0+ manages security services, peripheral offload, and boot integrity - both cores share memory-mapped peripherals via a high-bandwidth interconnect. Its clock system integrates an 8-MHz IMO (±2%), 32-kHz ILO, PLL/FLL frequency synthesis, and integer/fractional dividers to drive TCPWM, SCB, and USB timing domains independently.

Power management includes six operational modes, a backup domain with RTC and 64-byte memory, and a SIMO buck converter enabling single-supply 1.7–3.6-V operation. The programmable analog subsystem delivers 12-bit SAR ADC (1-Msps, 16-channel sequencer), two Deep Sleep-capable comparators, and two opamps - all accessible without waking the main CPU.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex®-M4F + 100-MHz Cortex®-M0+, with independent MPUs and DMA controllers
Memory 1-MB application flash (RWW), 32-KB AUXFlash, 32-KB SFlash, 288-KB SRAM with retention control
Power Efficiency 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9-V core
Analog Peripherals 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, two opamps, 12-bit DAC (<2 µs settling)
Connectivity Nine configurable SCBs (SPI/I²C/UART), USB Full-Speed device/host, QSPI/SMIF with XIP & on-the-fly encryption
Security Hardware crypto accelerator (AES-128/256, SHA-256, ECC, TRNG), eight protection contexts, debug disable capability
Capacitive Sensing CAPSENSE™ with SmartSense auto-tuning, liquid tolerance, and self/mutual sensing support up to 99 segments

Pinout & Package

The CY8C6117BZI-F34 is housed in a 124-ball BGA package (8 × 8 mm, 0.5-mm pitch) with exposed thermal pad, supporting fine-pitch PCB assembly and thermal dissipation for sustained 150-MHz operation.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO5 I/O Power Supply Banks Independent 1.7–3.6-V supplies per bank enable mixed-voltage interfacing (e.g., 1.8-V sensors + 3.3-V radios)
VDDD / VDDA Digital & Analog Core Supplies Separate 1.1-V or 0.9-V core rails optimized for performance vs. ultra-low-power modes
XRES External Reset Input Active-low asynchronous reset with internal pull-up; initiates cold boot or system recovery sequence
SWDCLK / SWDIO ARM Serial Wire Debug Interface Two-pin debug path supporting firmware update, trace, and secure lock/unlock via SWJ-DP
USB_DP / USB_DM USB Full-Speed Differential Pair On-die transceivers compliant with USB 2.0 FS; no external PHY required for device/host enumeration
QSPI0_[0:3] Quad SPI Data Lines Direct connection to external flash for Execute-In-Place (XIP); supports octal mode up to 640 Mbps

Key Features

Feature Design Value
Dual-CPU Power Gating Independent clock and power gating per core enables selective wake/sleep - e.g., M0+ monitors sensors while M4 remains off
Smart I/O Boolean Logic 16 GPIOs grouped into two Smart I/O ports that execute AND/OR/XOR on pin states during Deep Sleep - no CPU involvement
Hardware Crypto Acceleration Dedicated engine performs AES-128/256 encryption/decryption, SHA-256 hashing, and ECC signing in <100 cycles - accelerates TLS handshake by 5×
Programmable UDBs Twelve universal digital blocks (8 macrocells each) implement custom logic (e.g., LIN bus, PRS generators) without consuming CPU cycles or flash
Integrated SIMO Buck Converter Single-inductor, multi-output DC-DC reduces external BOM count; <1 µA quiescent current preserves battery life in always-on sensors

Applications

Smart Home Sensor Hub Industrial Predictive Maintenance Node

Use Scenario: Central hub aggregating temperature, humidity, motion, and touch inputs from multiple wireless endpoints.

IC Role / Device Role / Timing Role: Main application processor, CAPSENSE™ touch controller, USB host for dongle-based Zigbee/Thread gateways, and QSPI XIP executor for OTA firmware images.

Use Value: Dual-core separation allows real-time sensor fusion on M4 while M0+ handles secure boot and radio stack scheduling - reducing latency below 10 ms.

Use Scenario: Vibration and temperature monitoring on rotating machinery with local FFT analysis and alert triggering.

IC Role / Device Role / Timing Role: Signal acquisition front-end (SAR ADC + PDM mic input), edge analytics engine (M4 FFT), and secure data uploader (crypto-accelerated TLS over UART-to-ESP32 bridge).

Use Value: On-chip 1-Msps ADC and hardware FFT assist enable sub-100-µs sampling intervals and deterministic processing - critical for bearing fault detection.

Wearable Health Monitor Secure Access Control Terminal

Use Scenario: Optical heart-rate and SpO₂ monitor with capacitive touch UI and Bluetooth LE coexistence.

IC Role / Device Role / Timing Role: Analog front-end (opamps + ADC), CAPSENSE™ for buttonless UI, USB for charging/firmware sync, and crypto engine for BLE pairing key generation.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life to >7 days on coin cell - while maintaining full context across sleep/wake cycles.

Use Scenario: Tamper-resistant door controller using fingerprint matching, NFC reader interface, and encrypted log storage.

IC Role / Device Role / Timing Role: Secure enclave (M0+ runs trusted firmware), biometric preprocessing (M4 executes feature extraction), and hardware-accelerated AES-256 for log encryption to external flash.

Use Value: Eight protection contexts isolate biometric data, keys, and application code - meeting ISO/IEC 15408 EAL4+ requirements for physical access systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247BZI-D54 Higher memory (2-MB flash, 384-KB SRAM), adds CAN FD controller and enhanced USB HS support Better suited for automotive body control modules requiring CAN FD and higher throughput Select when CAN FD or >1-MB flash is mandatory; otherwise CY8C6117BZI-F34 offers lower cost and power
STM32WB55RGV Single Cortex-M4 core, integrated Bluetooth LE 5.0 radio, no CAPSENSE™ or programmable analog/digital blocks Optimized for BLE endpoint devices with minimal analog sensing or UI complexity Choose only if wireless connectivity is primary need and programmable peripherals are unnecessary

Compared with CY8C6247BZI-D54 and STM32WB55RGV, the CY8C6117BZI-F34 uniquely balances ultra-low-power dual-core execution, on-die programmable analog/digital logic, and hardware security - making it optimal for resource-constrained, sensor-rich IoT edge nodes where flexibility and BOM reduction matter more than raw radio integration or automotive-grade interfaces.

Availability

CY8C6117BZI-F34 is available at Aetrix Electronics and suitable for smart home hubs, industrial predictive maintenance sensors, wearable health monitors, and secure access terminals requiring stable component supply across long-lifecycle deployments.

Supply support for CY8C6117BZI-F34 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and microcontroller solutions for industrial, automotive, and IoT markets.

The PSOC™ 6 product line was engineered to unify programmable analog/digital logic, dual-core processing, and hardware security in a single chip - targeting next-generation IoT endpoints where software-defined functionality and zero-trust security are non-negotiable.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6117BZI-F34?

The Cortex-M4F core operates at up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection unit enabled. This frequency is achievable under 1.1-V core supply with active cooling; at 0.9-V core, max frequency is reduced to maintain power efficiency while delivering 22 µA/MHz active current draw.

Does CY8C6117BZI-F34 support external memory execution (XIP)?

Yes, the device supports Execute-In-Place from external quad SPI flash via its QSPI/SMIF interface, including on-the-fly AES-256 decryption and a dedicated 4-KB cache to reduce power consumption during instruction fetch. XIP operates at up to 640 Mbps in octal mode with hardware address remapping.

How many GPIOs are available, and what advanced I/O features do they support?

CY8C6117BZI-F34 provides up to 100 programmable GPIOs, including six overvoltage-tolerant (OVT) pins and two Smart I/O ports (16 pins total) capable of Boolean logic operations during Deep Sleep. All GPIOs support configurable drive strength, slew rate, and multiple pull-up/down modes - with hardware routing to analog peripherals and CAPSENSE™.

Is the CAPSENSE™ subsystem capable of liquid-tolerant operation?

Yes, CAPSENSE™ on CY8C6117BZI-F34 delivers industry-leading signal-to-noise ratio (SNR) and supports automatic hardware tuning (SmartSense) for dynamic compensation against water, sweat, or condensation. It enables robust proximity and mutual-capacitance sensing on curved surfaces - validated per IEC 61000-4-6 for conducted immunity in wet environments.

CY8C6117BZI-F34 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
124-VFBGA
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6117BZI-F34 FAQ

1.How can I place an order for CY8C6117BZI-F34 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6117BZI-F34 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6117BZI-F34 reliable?

The price and inventory of CY8C6117BZI-F34 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6117BZI-F34 is usually 5 days.

3.What payment methods are accepted for CY8C6117BZI-F34?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6117BZI-F34 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6117BZI-F34?

CY8C6117BZI-F34 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6117BZI-F34 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6117BZI-F34?

For technical support, including CY8C6117BZI-F34 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6117BZI-F34 requirements.

6.How does Aetrix verify that CY8C6117BZI-F34 is sourced from the original manufacturer or authorized distributors?

All CY8C6117BZI-F34 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6117BZI-F34 meets industry standards.

7.What is the process for return or replacement of CY8C6117BZI-F34?

All CY8C6117BZI-F34 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6117BZI-F34, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6117BZI-F34 part is unused and in its original packaging.

Return procedure for CY8C6117BZI-F34:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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