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Infineon Technologies CY8C6117BZI-F34T
- Part No.:
- CY8C6117BZI-F34T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6117BZI-F34T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,935
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Product details
Overview
CY8C6117BZI-F34T from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system functions, 1-MB flash/288-KB SRAM, integrated CAPSENSE™, hardware cryptography accelerator, and ultra-low-power Deep Sleep mode (7 µA with 64-KB SRAM retention). It targets secure, battery-operated IoT edge nodes requiring real-time sensor fusion, touch interface, and encrypted wireless connectivity.
For engineers reviewing the CY8C6117BZI-F34T datasheet, CY8C6117BZI-F34T pinout, CY8C6117BZI-F34T application, or CY8C6117BZI-F34T equivalent, key selection criteria include dual-CPU partitioning (M4 for application, M0+ reserved), SIMO DC-DC converter (<1 µA quiescent), QSPI XIP with on-the-fly encryption, 32 TCPWM blocks, and 12-bit SAR ADC with 16-channel sequencer and result averaging.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex®-M4F executes application firmware with FPU and MPU support, while the Cortex®-M0+ handles low-level system services including interrupt dispatch, power mode transitions, and debug security enforcement. Core voltages are configurable at 1.1 V or 0.9 V to optimize active current slope (22 µA/MHz @ 0.9 V for M4).
Its programmable analog subsystem integrates a 12-bit 1-Msps SAR ADC with differential input support and hardware-averaged sequencing, two deep-sleep-capable comparators, a 12-bit DAC with <2-µs settling time, and two opamps in CTBm blocks. The digital fabric includes twelve UDBs (8 macrocells each) and Smart I/O ports enabling Boolean logic during Deep Sleep.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm® Cortex®-M4F + 100-MHz Cortex®-M0+ (M0+ reserved for system functions) |
| Memory | 1-MB application flash (RWW), 288-KB SRAM with retention control, 1-Kb OTP eFuse array |
| Power Modes | Six modes including Deep Sleep at 7 µA (64-KB SRAM retained); on-chip SIMO DC-DC with <1 µA quiescent current |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer, result averaging), two LP comparators (Deep Sleep active), 12-bit DAC (<2 µs settling) |
| Digital Interfaces | Nine SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep SCB), USB full-speed device/host, QSPI/SMIF with XIP & AES encryption |
| Programmable Logic | Twelve UDBs (8 macrocells + 8-bit data path each); Smart I/O (16 pins) supports Boolean operations in Deep Sleep |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, eight protection contexts, debug/test ingress disable capability |
Pinout & Package
The CY8C6117BZI-F34T is housed in a 124-ball BGA package (6 × 6 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments follow Infineon's standard PSOC™ 61 ball map, supporting flexible GPIO routing, dedicated analog inputs, and high-speed QSPI/USB signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | General-purpose I/O bank 0 | Supports capacitive sensing, programmable drive strength/slew rate, and overvoltage tolerance on select pins |
| P12[0]–P12[7] | General-purpose I/O bank 12 | Includes Smart I/O capability; enables Boolean logic execution during Deep Sleep mode |
| QSPI0_D0–QSPI0_D3 | Quad SPI data lines | Enable XIP from external flash with on-the-fly AES decryption and 4-KB cache for low-power execution |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver supports device/host operation without external PHY; requires 1.2-V LDO supply |
| VDDIO0 / VDDIO1 | I/O power domains | Independent 1.7–3.6-V supplies per bank allow mixed-voltage interfacing (e.g., 1.8-V sensors + 3.3-V peripherals) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Partitioning | M4 runs application code with FPU/MPU; M0+ manages power states, interrupts, and security - no application access required |
| On-Chip SIMO DC-DC | Single-inductor, multi-output buck converter delivers core, I/O, and analog rails from single input; <1 µA quiescent current extends battery life |
| CAPSENSE™ with SmartSense | Hardware-accelerated self/mutual sensing with automatic tuning; achieves >100:1 SNR and liquid-tolerant touch in wearable and industrial HMI |
| QSPI XIP with Encryption | Execute-in-place from external flash with real-time AES-128 decryption; eliminates boot latency and external memory controller overhead |
| Deep Sleep Programmability | Smart I/O and Deep Sleep SCB remain active with only 7 µA draw; enables always-on sensor preprocessing and wake-on-event logic |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
|
Use Scenario: Continuous ECG/PPG acquisition, motion sensing, BLE transmission, and capacitive button interface in compact, coin-cell-powered wristband. IC Role / Device Role / Timing Role: Central MCU managing analog front-end sampling, CAPSENSE™ touch controls, BLE co-processor handshaking, and ultra-low-power scheduling via MCWDT. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context across hours of sensor sleep; on-chip SIMO DC-DC eliminates discrete PMIC area and BOM cost. |
Use Scenario: Multi-sensor aggregation (temp/humidity/PIR/VOC), local decision logic, Zigbee/Thread radio interfacing, and LCD display control in wall-mounted environmental node. IC Role / Device Role / Timing Role: Dual-CPU orchestrates concurrent sensor polling (M4), radio stack timing (M0+), and LCD segment driving with built-in CAPSENSE™ proximity wake. Use Value: Integrated 12-bit SAR ADC with hardware-averaged 16-channel sequencing reduces firmware overhead; QSPI XIP enables secure OTA updates from encrypted external flash. |
| Industrial Predictive Maintenance Node | Secure Edge Gateway Controller |
|
Use Scenario: Vibration analysis via PDM microphone array, temperature monitoring, and LoRaWAN uplink in factory-floor equipment with 10-year battery life target. IC Role / Device Role / Timing Role: Real-time audio preprocessing using two PDM channels and I²S/TDM interface; TCPWM blocks generate precise PWM for actuator feedback. Use Value: Hardware crypto accelerator offloads AES-128 and ECC-256 for secure sensor data signing; 32 TCPWM blocks support simultaneous motor control and timing-critical diagnostics. |
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT endpoint, with TLS termination, secure boot, and tamper-evident logging. IC Role / Device Role / Timing Role: Root-of-trust MCU executing verified firmware, enforcing eight protection contexts, and managing cryptographic keys in isolated eFuse/OTP regions. Use Value: Eight protection contexts enable strict separation of radio stack, protocol parser, and cloud agent; TRNG + hardware accelerators meet NIST SP 800-90A/B/C requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247BZI-D54 | Higher memory (2-MB flash, 384-KB SRAM), adds CAN FD controller and enhanced USB HS support; same 124-BGA footprint | Targeted at automotive body electronics and industrial gateways requiring CAN FD and higher throughput | Select when CAN FD interface or >1-MB flash is mandatory; pin-compatible but requires layout review for USB HS routing |
| STM32WB55RGV | Single-core Cortex-M4 @ 64 MHz, integrated Bluetooth LE 5.0 radio, 1-MB flash/256-KB SRAM, no dual-CPU or CAPSENSE™ | Battery-powered BLE endpoints where RF integration outweighs need for programmable analog or dual-CPU isolation | Choose for simplified BLE-centric designs; lacks PSOC™ 61's analog flexibility, security granularity, and Deep Sleep programmability |
Compared with CY8C6117BZI-F34T, CY8C6247BZI-D54 offers expanded memory and CAN FD at identical package size, while STM32WB55RGV trades dual-CPU architecture and CAPSENSE™ for integrated BLE radio - making the former suitable for complex industrial gateways and the latter for cost-sensitive, RF-first edge nodes.
Availability
CY8C6117BZI-F34T is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and secure edge gateway controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C6117BZI-F34T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive ICs, and secure microcontrollers, with global manufacturing and R&D infrastructure.
The PSOC™ 6 family was designed specifically for secure, ultra-low-power IoT endpoints - integrating dual CPUs, programmable analog/digital fabric, and hardware-rooted security into a single chip for edge intelligence without compromise.
FAQ
What is the core voltage configuration for CY8C6117BZI-F34T?
The device operates at either 1.1 V or 0.9 V core voltage depending on speed/power trade-off selection. At 0.9 V, the Cortex-M4F draws 22 µA/MHz and the M0+ draws 15 µA/MHz - optimized for extended battery life in Deep Sleep and active modes. Voltage selection is fixed per orderable part number and cannot be dynamically switched.
Does CY8C6117BZI-F34T support execute-in-place (XIP) from external flash?
Yes - its QSPI/SMIF interface supports XIP with on-the-fly AES-128 decryption and a dedicated 4-KB cache. This enables direct code execution from external quad SPI flash while maintaining security and reducing SRAM usage, with throughput up to 640 Mbps in octal mode.
Can the Cortex-M0+ core be used for application firmware?
No - in the CY8C6117BZI-F34T, the Cortex-M0+ is reserved exclusively for system-level functions including interrupt handling, power mode transitions, and security enforcement. Application code must run solely on the Cortex-M4F core; the M0+ is not accessible to user firmware.
How many capacitive sensing channels does CAPSENSE™ support on this device?
CAPSENSE™ supports up to 99 segments and 8 commons, enabling large-button arrays or proximity-sensing surfaces. It includes hardware-accelerated SmartSense auto-tuning, differential noise rejection, and liquid-tolerance features - all operating independently of the main CPU to reduce firmware load and power consumption.
CY8C6117BZI-F34T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR; D/A 2x7b, 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6117BZI-F34T FAQ
1.How can I place an order for CY8C6117BZI-F34T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6117BZI-F34T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6117BZI-F34T reliable?
The price and inventory of CY8C6117BZI-F34T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6117BZI-F34T is usually 5 days.
3.What payment methods are accepted for CY8C6117BZI-F34T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6117BZI-F34T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6117BZI-F34T?
CY8C6117BZI-F34T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6117BZI-F34T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6117BZI-F34T?
For technical support, including CY8C6117BZI-F34T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6117BZI-F34T requirements.
6.How does Aetrix verify that CY8C6117BZI-F34T is sourced from the original manufacturer or authorized distributors?
All CY8C6117BZI-F34T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6117BZI-F34T meets industry standards.
7.What is the process for return or replacement of CY8C6117BZI-F34T?
All CY8C6117BZI-F34T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6117BZI-F34T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6117BZI-F34T part is unused and in its original packaging.
Return procedure for CY8C6117BZI-F34T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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