Infineon Technologies CY8C6136BZI-F14

Overview

CY8C6136BZI-F14 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system functions, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, and hardware cryptography acceleration. It operates from 1.7 V to 3.6 V with deep-sleep current as low as 7 µA (64-KB SRAM retention), targeting secure, ultra-low-power IoT edge nodes with capacitive touch and wireless connectivity.

For engineers reviewing the CY8C6136BZI-F14 datasheet, CY8C6136BZI-F14 pinout, CY8C6136BZI-F14 application, or CY8C6136BZI-F14 equivalent, this device supports real-time sensor fusion, secure firmware updates via encrypted XIP from external QSPI Flash, and concurrent BLE/Wi-Fi coexistence through configurable SCBs and Smart I/O in Deep Sleep - critical for battery-powered smart home hubs and industrial condition monitors.

Technical Context

The CY8C6136BZI-F14 implements a tightly coupled dual-CPU architecture where the M4 executes application code with FPU and MPU enforcement, while the M0+ handles secure boot, power management, and inter-processor communication via IPC channels. Its clock system integrates an 8-MHz IMO (±2%), 32-kHz ILO, PLL/FLL frequency synthesis, and fractional peripheral dividers enabling precise timing for TCPWM and USB.

Analog subsystem includes a 12-bit 1-Msps SAR ADC with 16-channel sequencer and result averaging, two Deep Sleep-capable comparators, a 12-bit DAC (<2-µs settling), and two opamps with CTBm configuration. Programmable digital resources comprise twelve UDBs (8 macrocells each) and two Smart I/O ports supporting Boolean logic during Deep Sleep.

Key Specifications

Pinout & Package

This device is housed in a 124-ball BGA package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments are defined per the official Infineon pinout diagram for CY8C6136BZI-F14 (Rev. *R, p.33–42), supporting dual-voltage I/O (1.7–3.6 V), six overvoltage-tolerant pins, and dedicated SWD/JTAG debug interface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Compared with CY8C6247BZI-D54 and STM32WBA52CGU6, the CY8C6136BZI-F14 uniquely balances ultra-low-power operation (7 µA Deep Sleep), on-die programmable analog/digital logic, and robust security - making it optimal for resource-constrained, sensor-rich IoT edge nodes requiring field-upgradable trust anchors.

Availability

CY8C6136BZI-F14 is available at Aetrix Electronics and suitable for smart home hubs, industrial predictive maintenance sensors, medical wearables, and automotive cabin controls requiring stable component supply across multi-year production cycles.

Supply support for CY8C6136BZI-F14 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and microcontroller solutions for industrial, automotive, and IoT markets.

The PSOC™ 6 product line delivers programmable, secure, and ultra-low-power MCUs built around dual Arm cores, targeting next-generation IoT endpoints that demand hardware-enforced security, analog flexibility, and energy efficiency.

FAQ

What is the core voltage configuration for CY8C6136BZI-F14?

The CY8C6136BZI-F14 operates its core logic at either 1.1 V or 0.9 V, determined by the specific part variant selected at order time. This dual-voltage option enables optimization between performance (150-MHz M4 at 1.1 V) and ultra-low-power operation (22 µA/MHz M4 current slope at 0.9 V), with corresponding VDDA analog supply tracking the core voltage.

Does CY8C6136BZI-F14 support external QSPI Flash execution with encryption?

Yes - the QSPI/SMIF interface supports Execute-in-Place (XIP) from external flash with on-the-fly AES-128 decryption using keys stored in protected eFuse or secure SRAM. The 4-KB instruction cache reduces power consumption during XIP access, and RWW capability allows background firmware updates without halting execution.

How many GPIOs support Deep Sleep Boolean operations?

32 GPIOs - organized as two Smart I/O ports (P0[0:7], P1[0:7] and their mirrored banks) - retain full Boolean logic capability (AND/OR/XOR/NOT) during Deep Sleep mode. These pins can trigger CPU wake events based on programmable patterns without M4/M0+ activation, reducing average system power.

Is CAPSENSE™ tuning fully automated in production?

Yes - SmartSense auto-tuning runs entirely in hardware during initialization and runtime, adjusting IDAC, scan speed, and filtering parameters to maintain >100 dB SNR across temperature, voltage, and environmental variations. No host CPU intervention or factory calibration is required, enabling zero-touch manufacturing of touch interfaces.