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Infineon Technologies CY8C6136BZI-F34
- Part No.:
- CY8C6136BZI-F34
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6136BZI-F34.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 124BGA
- Quantity:
- Payment:
- Shipping:
Inventory:477
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Product details
Overview
CY8C6136BZI-F34 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system functions, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, USB full-speed interface, and hardware cryptography acceleration. It targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion, touch UI, and encrypted wireless connectivity.
For engineers reviewing the CY8C6136BZI-F34 datasheet, CY8C6136BZI-F34 pinout, CY8C6136BZI-F34 application, or CY8C6136BZI-F34 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz M4 @ 0.9 V), on-chip SIMO DC-DC converter (<1 µA quiescent), Deep Sleep current (7 µA with 64-KB SRAM retention), and QSPI XIP with on-the-fly encryption support.
Technical Context
The CY8C6136BZI-F34 implements a tightly coupled dual-CPU architecture where the Cortex-M4 executes application firmware while the Cortex-M0+ handles low-level system services including interrupt routing, IPC, and security monitor tasks-enabling deterministic real-time response without software overhead. Its clock system integrates FLL, PLL, and fractional dividers to independently scale CPU, peripheral, and SMIF domains.
Power management leverages six discrete modes with hardware-controlled retention domains: Deep Sleep retains 64-KB SRAM and enables wake-up via LP comparators or CAPSENSE™, while Hibernate preserves only 64 bytes plus RTC. The on-chip SIMO buck converter supports single-inductor multi-rail regulation with sub-µA quiescent operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, with MPU and separate DMA controllers for deterministic real-time task partitioning |
| Memory | 1-MB application flash (RWW), 288-KB SRAM with configurable retention, 1-Kb OTP eFuse for secure key storage |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9-V core voltage |
| Security | Hardware crypto accelerator (AES-256, ECC, SHA-256), TRNG, eight protection contexts, debug disable capability |
| Peripherals | 9 SCBs (SPI/I2C/UART), USB FS device/host, 32 TCPWMs, 12-bit 1-Msps SAR ADC with 16-channel sequencer, CAPSENSE™ |
| QSPI/SMIF | Up to 640 Mbps octal interface with Execute-In-Place, 4-KB cache, and on-the-fly AES-128 decryption |
| Package | 124-ball BGA (7 mm × 7 mm, 0.5-mm pitch), RoHS-compliant, industrial temperature range (–40°C to +85°C) |
Pinout & Package
Package: 124-ball BGA (7 mm × 7 mm, 0.5-mm pitch), ball grid layout optimized for signal integrity and thermal dissipation in compact IoT modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply Rails | Independent 1.7–3.6-V supplies per I/O bank enable mixed-voltage interfacing (e.g., 1.8-V sensors + 3.3-V radios) |
| VDDD/VDDA | Digital/Analog Core Supplies | Separate regulated inputs allow analog subsystem isolation and noise-sensitive ADC/DAC operation |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; supports external watchdog or power-on reset sequencing |
| SWDCLK/SWDIO | ARM Serial Wire Debug Interface | Two-pin debug port supporting firmware update, real-time trace, and secure debug lock configuration |
| USB_DP/USB_DM | USB Full-Speed Differential Pair | Integrated transceiver with internal termination; requires no external PHY for HID, CDC, or MSC class implementations |
| QSPI_IO0–QSPI_IO3 | Quad SPI Data Lines | Bi-directional data lanes supporting XIP execution and on-the-fly decryption from external flash memory |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Gating | Independent clock and power gating per CPU enables selective core shutdown-M0+ remains active in Deep Sleep to manage wake events while M4 stays off |
| CAPSENSE™ SmartSense | Hardware-accelerated auto-tuning eliminates manual calibration; achieves >100:1 SNR and liquid-tolerant touch detection on PCB-mounted electrodes |
| Programmable Digital (UDBs) | Twelve universal digital blocks (8 macrocells each) implement custom logic (e.g., LIN bus, PRBS generator) without consuming CPU cycles or flash space |
| Smart I/O Ports | Two 16-pin Smart I/O banks perform Boolean operations (AND/OR/XOR) in Deep Sleep-enabling low-power GPIO event filtering before waking CPU |
| Audio Subsystem | Two PDM microphone inputs + one I2S/TDM channel support voice preprocessing and multi-mic beamforming with zero CPU load |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices, running local voice assistant inference and OTA updates. IC Role / Device Role / Timing Role: Dual-core application processor with secure boot, encrypted flash, and USB host for firmware staging. Use Value: On-chip crypto accelerator enables AES-256 decryption of OTA payloads at line rate; 7 µA Deep Sleep extends battery life during idle periods between polling intervals. |
Use Scenario: Battery-powered vibration/temperature node in predictive maintenance systems with LoRaWAN backhaul. IC Role / Device Role / Timing Role: Low-power sensor fusion controller with 12-bit ADC, LP comparators, and wake-on-event capability. Use Value: 22 µA/MHz M4 efficiency allows real-time FFT processing on 1-Msps ADC samples; SIMO DC-DC extends 2-year battery life by minimizing conversion losses. |
| Medical Wearable | Secure Access Terminal |
|
Use Scenario: ECG/PPG patch with capacitive touch UI, Bluetooth LE, and local anomaly detection. IC Role / Device Role / Timing Role: CAPSENSE™-enabled touch controller + analog front-end + secure key vault for HIPAA-compliant data handling. Use Value: Hardware TRNG and eFuse-backed key storage prevent side-channel extraction; Smart I/O filters touch gestures in Deep Sleep to reduce average current to <10 µA. |
Use Scenario: Tamper-resistant credential reader using NFC and biometric verification in physical access control. IC Role / Device Role / Timing Role: Secure enclave managing cryptographic operations, secure boot, and debug lockdown for FIPS 140-2 Level 3 compliance. Use Value: Eight protection contexts isolate NFC stack, fingerprint driver, and secure bootloader; debug disable prevents JTAG-based probing during field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55RG | Single Cortex-M4 core with Bluetooth LE radio; no M0+ companion core or CAPSENSE™; 1-MB flash, 256-KB SRAM | Lacks hardware-accelerated touch sensing and dual-CPU task partitioning; suitable for BLE-centric designs without complex UI or analog sensing | Select when RF integration outweighs need for programmable analog/digital blocks and ultra-low-power Deep Sleep retention |
| Nordic nRF5340 DK | Arm Cortex-M33 dual-core (app/network), no integrated SMIF/QSPI XIP, no on-chip DC-DC, 1-MB flash, 256-KB RAM | Requires external PMIC and flash; lacks CAPSENSE™ and hardware crypto acceleration for AES-256/ECC | Prefer for Thread/Zigbee mesh applications needing network core isolation but not analog subsystem or embedded power conversion |
Compared with STM32WB55RG and nRF5340, CY8C6136BZI-F34 uniquely combines dual-CPU deterministic scheduling, on-die SIMO buck, CAPSENSE™, and SMIF XIP-making it optimal for battery-constrained, sensor-rich, touch-enabled IoT endpoints requiring both performance and sub-µA quiescent operation.
Availability
CY8C6136BZI-F34 is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, medical wearables, and secure access terminals requiring stable component supply across long-lifecycle deployments.
Supply support for CY8C6136BZI-F34 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and R&D infrastructure.
The PSOC™ 6 product line delivers programmable, secure, ultra-low-power MCUs purpose-built for intelligent edge devices-integrating analog, digital, and RF capabilities into a single chip for rapid IoT system development.
FAQ
What is the maximum operating frequency of the Cortex-M4 core in CY8C6136BZI-F34?
The Cortex-M4F core operates at up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection unit enabled. This frequency is sustained under 1.1-V core supply; at 0.9-V operation, maximum frequency is reduced to maintain timing closure and power efficiency.
Does CY8C6136BZI-F34 support external quad SPI flash execution (XIP)?
Yes-it features a dedicated Serial Memory Interface (SMIF) supporting Execute-In-Place from external QSPI flash at up to 640 Mbps using octal mode. The 4-KB SMIF cache and on-the-fly AES-128 decryption enable secure, low-latency code execution without loading into internal RAM.
How many GPIOs support overvoltage tolerance (OVT) in this device?
Six GPIO pins are overvoltage-tolerant (OVT), rated to withstand voltages up to 5.5 V regardless of VDDIO level. These pins are designated in the datasheet's pinout table and support direct interfacing with legacy 5-V peripherals without level-shifting circuitry.
Can the CAPSENSE™ subsystem operate during Deep Sleep mode?
Yes-CAPSENSE™ can run autonomously in Deep Sleep mode using the dedicated low-power clock domain. It supports wake-on-touch with hardware-based SmartSense tuning and maintains >100:1 SNR without CPU intervention, drawing only ~1.2 µA during scanning.
CY8C6136BZI-F34 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6136BZI-F34 FAQ
1.How can I place an order for CY8C6136BZI-F34 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6136BZI-F34 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6136BZI-F34 reliable?
The price and inventory of CY8C6136BZI-F34 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6136BZI-F34 is usually 5 days.
3.What payment methods are accepted for CY8C6136BZI-F34?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6136BZI-F34 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6136BZI-F34?
CY8C6136BZI-F34 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6136BZI-F34 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6136BZI-F34?
For technical support, including CY8C6136BZI-F34 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6136BZI-F34 requirements.
6.How does Aetrix verify that CY8C6136BZI-F34 is sourced from the original manufacturer or authorized distributors?
All CY8C6136BZI-F34 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6136BZI-F34 meets industry standards.
7.What is the process for return or replacement of CY8C6136BZI-F34?
All CY8C6136BZI-F34 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6136BZI-F34, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6136BZI-F34 part is unused and in its original packaging.
Return procedure for CY8C6136BZI-F34:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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