Infineon Technologies CY8C6137BZI-F14

Overview

CY8C6137BZI-F14 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system functions, 1-MB flash, 288-KB SRAM, integrated SIMO DC-DC converter (<1 µA quiescent), and CAPSENSE™ capacitive sensing-designed for secure, ultra-low-power IoT edge nodes with local sensor processing and BLE connectivity.

For engineers reviewing the CY8C6137BZI-F14 datasheet, CY8C6137BZI-F14 pinout, CY8C6137BZI-F14 application, or CY8C6137BZI-F14 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz M4 @ 0.9 V), on-chip security (TRNG, crypto accelerator, 8 protection contexts), QSPI XIP support up to 640 Mbps, and Deep Sleep current of 7 µA with 64-KB SRAM retention.

Technical Context

The CY8C6137BZI-F14 implements a tightly coupled dual-CPU architecture where the Cortex-M4 executes application firmware while the Cortex-M0+ handles low-level system tasks including interrupt routing, IPC, and boot management-enabling deterministic real-time response without software arbitration. Its clock system integrates FLL, PLL, IMO (±2%), ILO (32 kHz), and crystal oscillators (16–35 MHz) with fractional dividers for precise peripheral timing.

Power management includes six configurable modes, a hardware-managed backup domain with RTC and 64-byte memory, and a SIMO buck converter supporting 1.7–3.6-V operation. The programmable analog subsystem delivers 12-bit SAR ADC (1 Msps, 16-channel sequencer), two deep-sleep comparators, and two opamps-each with independent low-power modes.

Key Specifications

Pinout & Package

This device is housed in a 124-ball BGA package (8 × 8 mm, 0.5-mm pitch) with exposed thermal pad. Pin assignments are defined per the Infineon CY8C61x6/7 pinout specification (Rev. *R, p.33), supporting dual-voltage I/O (1.7–3.6 V), six overvoltage-tolerant (OVT) pins, and two Smart I/O ports (16 GPIOs) enabling Boolean logic during Deep Sleep.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core, secure MCU applications.

Compared with CY8C6137BZI-F14, CY8C6247BZI-D54 trades integrated power conversion for higher memory density, while STM32WB55RGV replaces dual-CPU flexibility and analog/digital programmability with a hardened BLE radio-making CY8C6137BZI-F14 optimal for sensor-fusion edge nodes requiring hardware-accelerated security and mixed-signal customization.

Availability

CY8C6137BZI-F14 is available at Aetrix Electronics and suitable for smart home hubs, wearable health monitors, industrial predictive maintenance nodes, and secure asset trackers requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for CY8C6137BZI-F14 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure embedded solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.

The PSOC™ 6 family targets secure, ultra-low-power IoT endpoints-combining Arm dual-core processing, programmable analog/digital fabric, and hardware-enforced security to replace discrete sensor interface, signal conditioning, and protocol translation components.

FAQ

What is the core voltage configuration for CY8C6137BZI-F14?

The CY8C6137BZI-F14 operates its Cortex-M4 and Cortex-M0+ cores at either 1.1 V or 0.9 V, selected at manufacturing based on speed/power binning. At 0.9 V, active current is 22 µA/MHz (M4) and 15 µA/MHz (M0+); at 1.1 V, it is 40 µA/MHz (M4) and 20 µA/MHz (M0+). This dual-voltage option enables design optimization for battery life versus peak performance.

Does CY8C6137BZI-F14 support execute-in-place (XIP) from external flash?

Yes, the QSPI/SMIF interface supports XIP from external quad SPI flash with on-the-fly AES-128 encryption and decryption. It includes a dedicated 4-KB cache to reduce instruction fetch latency and lower power consumption during code execution, achieving throughput up to 640 Mbps in octal mode.

How does CAPSENSE™ on CY8C6137BZI-F14 handle wet or conductive environments?

CAPSENSE™ uses mutual capacitance scanning combined with SmartSense auto-tuning to dynamically adjust scan parameters-including frequency, resolution, and baseline tracking-enabling reliable touch detection through water films or condensation. Its >100:1 signal-to-noise ratio and hardware-based liquid tolerance eliminate need for mechanical buttons in outdoor or medical enclosures.

Can the programmable analog blocks operate in Deep Sleep mode?

Yes, two low-power comparators and the built-in temperature sensor remain functional in Deep Sleep mode, allowing wake-on-event (e.g., threshold crossing) without CPU activation. The 12-bit SAR ADC and opamps require wakeup to Active or Sleep mode for full operation, but their configuration registers retain state across power modes.