Infineon Technologies CY8C6137BZI-F34
- Part No.:
- CY8C6137BZI-F34
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6137BZI-F34.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 124BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,145
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Product details
Overview
CY8C6137BZI-F34 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system management, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, USB full-speed device/host interface, and QSPI/XIP support - deployed in industrial IoT edge nodes requiring secure, low-power, sensor-fused operation.
For engineers reviewing the CY8C6137BZI-F34 datasheet, CY8C6137BZI-F34 pinout, CY8C6137BZI-F34 application, or CY8C6137BZI-F34 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip SIMO DC-DC (<1 µA quiescent), Deep Sleep current (7 µA with 64-KB SRAM retention), and hardware crypto acceleration for TLS/OTA firmware updates.
Technical Context
The CY8C6137BZI-F34 implements a tightly coupled dual-CPU subsystem where the Cortex-M4 executes application code while the Cortex-M0+ handles secure boot, interrupt routing, and peripheral arbitration - both cores share memory-mapped peripherals via a unified AXI bus. Clocking is managed through hierarchical sources: an 8-MHz IMO (±2%), 32-kHz ILO, external crystal oscillators (16–35 MHz & 32 kHz), and configurable PLL/FLL multipliers.
Its programmable analog subsystem includes a 12-bit 1-Msps SAR ADC with 16-channel sequencer and result averaging, two deep-sleep-capable comparators, a 12-bit DAC (<2-µs settling), and two opamps with low-power modes. The digital fabric integrates twelve UDBs (8 macrocells each), Smart I/O Boolean logic, and thirty-two TCPWM blocks supporting center-aligned PWM and comparator-triggered kill signals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, with independent MPUs and DMA controllers |
| Memory | 1-MB application flash (RWW), 32-KB AUXFlash, 32-KB SFlash, 288-KB SRAM with retention control |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9-V M4 core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer, averaging), 12-bit DAC (<2-µs settling), 2 opamps, 2 LP comparators |
| Connectivity | 9 SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep SCB), USB full-speed device/host, QSPI/SMIF with XIP & encryption |
| Security | Hardware crypto accelerator (AES-128/256, SHA-256, ECC), TRNG, 8 protection contexts, debug/test path disable |
| Package | 124-ball BGA (8 × 8 mm, 0.5-mm pitch), RoHS-compliant, moisture sensitivity level 3 |
Pinout & Package
CY8C6137BZI-F34 is housed in a 124-ball BGA package (8 mm × 8 mm, 0.5-mm pitch) with exposed thermal pad. Pin functions are organized into power domains (VDDIO, VDDD, VCCD, VBAT), clock inputs (XTAL_IN/OUT, IMO, ILO), dual-CPU debug (SWDIO/SWCLK), and programmable GPIO banks supporting Smart I/O Boolean operations during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDD / VDDIO | Core & I/O supply rails | Separate 1.7–3.6-V domains enable mixed-voltage I/O interfacing and dynamic voltage scaling |
| SWDIO / SWCLK | JTAG/SWD debug interface | Two-pin serial wire debug supports firmware validation, secure programming, and real-time trace |
| XTAL_IN / XTAL_OUT | External crystal oscillator terminals | Supports 16–35 MHz crystals for high-accuracy timing; optional 32-kHz crystal for RTC backup domain |
| USB_DP / USB_DM | Full-speed USB differential pair | Integrated PHY enables host/device operation without external transceiver; supports CDC/HID class drivers |
| P0[0]–P0[7] | Programmable GPIO bank 0 | Eight pins with Smart I/O capability - perform Boolean logic (AND/OR/XOR) in Deep Sleep without CPU wake-up |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Gating | Independent voltage scaling (0.9 V or 1.1 V) per core enables fine-grained trade-off between performance and µA/MHz efficiency |
| On-Chip SIMO DC-DC | Single-inductor, multi-output buck converter delivers VDDD/VDDIO/VCCD from single input; <1 µA quiescent current extends battery life |
| CAPSENSE™ with SmartSense | Hardware-accelerated capacitive sensing with automatic tuning, liquid-tolerant operation, and proximity detection up to 25 mm |
| QSPI/XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption and 4-KB cache - eliminates boot latency and external RAM |
| Deep Sleep SCB | Dedicated serial block retains SPI/I²C functionality in Deep Sleep mode, enabling sensor polling without waking CPUs |
Applications
| Smart Home Hub | Industrial Wireless Sensor Node |
|---|---|
|
Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices, running local AI inference and OTA updates. IC Role / Device Role / Timing Role: Dual-CPU orchestrates real-time protocol stacks (M0+) while M4 runs TensorFlow Lite Micro and encrypted cloud comms. Use Value: 7 µA Deep Sleep + SIMO DC-DC enables >5-year coin-cell operation; hardware crypto ensures signed firmware validation. |
Use Scenario: Battery-powered vibration/temperature node in predictive maintenance systems, transmitting data via LoRaWAN. IC Role / Device Role / Timing Role: M0+ manages ultra-low-power sensor sampling and wake-on-event; M4 processes FFT-based anomaly detection pre-transmission. Use Value: 12-bit SAR ADC with sequencer and averaging delivers ±0.5°C temp accuracy; Smart I/O filters noise before CPU wake-up. |
| Medical Wearable Monitor | Secure Access Control Terminal |
|
Use Scenario: ECG/PPG patch with touchless UI, Bluetooth LE, and local biometric authentication. IC Role / Device Role / Timing Role: CAPSENSE™ drives proximity wake-up and gesture UI; USB enables clinical firmware update and data export. Use Value: Integrated opamps condition analog biosignals; TRNG + AES engine meets HIPAA-compliant data-at-rest requirements. |
Use Scenario: Tamper-resistant door controller using fingerprint + NFC, logging access events to encrypted flash. IC Role / Device Role / Timing Role: Hardware crypto accelerator performs PKI signing of audit logs; eFuse array stores immutable device identity. Use Value: 8 protection contexts isolate secure bootloader, app, and credential storage; debug disable prevents physical extraction attacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247BZI-D54 | Same package and dual-core architecture, but adds 2-MB flash, 512-KB SRAM, and enhanced USB HS PHY | Better suited for edge AI gateways requiring larger firmware partitions and higher-bandwidth peripheral bridging | Select when >1-MB flash or USB high-speed host capability is required; otherwise CY8C6137BZI-F34 offers optimal cost/power balance |
| STM32WB55RGV | Single Cortex-M4 core (64 MHz), integrated BLE 5.0 radio, no programmable analog/digital fabric, 1-MB flash, 256-KB SRAM | Targeted at BLE-centric wireless endpoints, not programmable logic or CAPSENSE™-based HMI | Choose only if BLE SoC integration outweighs need for dual-CPU determinism, analog flexibility, or hardware crypto diversity |
Compared with CY8C6247BZI-D54 and STM32WB55RGV, CY8C6137BZI-F34 uniquely balances ultra-low-power dual-core execution, on-die programmable analog/digital logic, and field-proven CAPSENSE™ - making it optimal for resource-constrained, sensor-rich, and security-critical embedded designs where flexibility and power efficiency are co-primary constraints.
Availability
CY8C6137BZI-F34 is available at Aetrix Electronics and suitable for industrial IoT gateways, medical wearables, smart home hubs, and secure access terminals requiring stable component supply across multi-year production cycles.
Supply support for CY8C6137BZI-F34 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and R&D infrastructure.
The PSoC™ 6 family was designed specifically for secure, ultra-low-power IoT endpoints - integrating programmable analog/digital fabric, dual-CPU isolation, and hardware-rooted trust to simplify certification and reduce system-level BOM count.
FAQ
What is the maximum operating frequency of the Cortex-M4 core in CY8C6137BZI-F34?
The Arm Cortex-M4F core operates at up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection unit enabled. This frequency is sustained under 1.1-V core supply; at 0.9 V, maximum frequency is reduced to maintain timing closure and power efficiency - verified in Infineon's characterization across temperature and voltage corners.
Does CY8C6137BZI-F34 support execute-in-place (XIP) from external flash?
Yes - the QSPI/SMIF interface supports XIP with on-the-fly AES-128 decryption and a dedicated 4-KB cache. External quad-SPI flash is mapped directly into the M4 instruction space, eliminating boot ROM copy overhead and reducing SRAM pressure during firmware execution.
Can the CAPSENSE™ subsystem operate during Deep Sleep mode?
Yes - CAPSENSE™ can run autonomously in Deep Sleep using the 32-kHz ILO clock and dedicated low-power sensing circuitry. It supports self- and mutual-capacitance scanning, automatic SmartSense tuning, and wake-on-touch event generation without waking either CPU core.
Is the USB interface limited to device-only operation?
No - the integrated USB full-speed PHY supports both device and host roles. Firmware-selectable configuration enables CDC, HID, or MSC class operation as a device, or enumeration of USB peripherals (e.g., keyboards, flash drives) as a host - all without external transceivers or level shifters.
CY8C6137BZI-F34 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6137BZI-F34 FAQ
1.How can I place an order for CY8C6137BZI-F34 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6137BZI-F34 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6137BZI-F34 reliable?
The price and inventory of CY8C6137BZI-F34 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6137BZI-F34 is usually 5 days.
3.What payment methods are accepted for CY8C6137BZI-F34?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6137BZI-F34 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6137BZI-F34?
CY8C6137BZI-F34 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6137BZI-F34 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6137BZI-F34?
For technical support, including CY8C6137BZI-F34 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6137BZI-F34 requirements.
6.How does Aetrix verify that CY8C6137BZI-F34 is sourced from the original manufacturer or authorized distributors?
All CY8C6137BZI-F34 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6137BZI-F34 meets industry standards.
7.What is the process for return or replacement of CY8C6137BZI-F34?
All CY8C6137BZI-F34 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6137BZI-F34, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6137BZI-F34 part is unused and in its original packaging.
Return procedure for CY8C6137BZI-F34:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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