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Infineon Technologies CY8C6137BZI-F34

Part No.:
CY8C6137BZI-F34
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
124-VFBGA
Datasheet:
AetrixCY8C6137BZI-F34.pdf
Description:
IC MCU 32BIT 1MB FLASH 124BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,145

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Product details

Overview

CY8C6137BZI-F34 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system management, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, USB full-speed device/host interface, and QSPI/XIP support - deployed in industrial IoT edge nodes requiring secure, low-power, sensor-fused operation.

For engineers reviewing the CY8C6137BZI-F34 datasheet, CY8C6137BZI-F34 pinout, CY8C6137BZI-F34 application, or CY8C6137BZI-F34 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip SIMO DC-DC (<1 µA quiescent), Deep Sleep current (7 µA with 64-KB SRAM retention), and hardware crypto acceleration for TLS/OTA firmware updates.

Technical Context

The CY8C6137BZI-F34 implements a tightly coupled dual-CPU subsystem where the Cortex-M4 executes application code while the Cortex-M0+ handles secure boot, interrupt routing, and peripheral arbitration - both cores share memory-mapped peripherals via a unified AXI bus. Clocking is managed through hierarchical sources: an 8-MHz IMO (±2%), 32-kHz ILO, external crystal oscillators (16–35 MHz & 32 kHz), and configurable PLL/FLL multipliers.

Its programmable analog subsystem includes a 12-bit 1-Msps SAR ADC with 16-channel sequencer and result averaging, two deep-sleep-capable comparators, a 12-bit DAC (<2-µs settling), and two opamps with low-power modes. The digital fabric integrates twelve UDBs (8 macrocells each), Smart I/O Boolean logic, and thirty-two TCPWM blocks supporting center-aligned PWM and comparator-triggered kill signals.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, with independent MPUs and DMA controllers
Memory 1-MB application flash (RWW), 32-KB AUXFlash, 32-KB SFlash, 288-KB SRAM with retention control
Power Efficiency 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9-V M4 core
Analog Peripherals 12-bit 1-Msps SAR ADC (16-channel sequencer, averaging), 12-bit DAC (<2-µs settling), 2 opamps, 2 LP comparators
Connectivity 9 SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep SCB), USB full-speed device/host, QSPI/SMIF with XIP & encryption
Security Hardware crypto accelerator (AES-128/256, SHA-256, ECC), TRNG, 8 protection contexts, debug/test path disable
Package 124-ball BGA (8 × 8 mm, 0.5-mm pitch), RoHS-compliant, moisture sensitivity level 3

Pinout & Package

CY8C6137BZI-F34 is housed in a 124-ball BGA package (8 mm × 8 mm, 0.5-mm pitch) with exposed thermal pad. Pin functions are organized into power domains (VDDIO, VDDD, VCCD, VBAT), clock inputs (XTAL_IN/OUT, IMO, ILO), dual-CPU debug (SWDIO/SWCLK), and programmable GPIO banks supporting Smart I/O Boolean operations during Deep Sleep.

Pin/Terminal Circuit Role Design Meaning
VDDD / VDDIO Core & I/O supply rails Separate 1.7–3.6-V domains enable mixed-voltage I/O interfacing and dynamic voltage scaling
SWDIO / SWCLK JTAG/SWD debug interface Two-pin serial wire debug supports firmware validation, secure programming, and real-time trace
XTAL_IN / XTAL_OUT External crystal oscillator terminals Supports 16–35 MHz crystals for high-accuracy timing; optional 32-kHz crystal for RTC backup domain
USB_DP / USB_DM Full-speed USB differential pair Integrated PHY enables host/device operation without external transceiver; supports CDC/HID class drivers
P0[0]–P0[7] Programmable GPIO bank 0 Eight pins with Smart I/O capability - perform Boolean logic (AND/OR/XOR) in Deep Sleep without CPU wake-up

Key Features

Feature Design Value
Dual-CPU Power Gating Independent voltage scaling (0.9 V or 1.1 V) per core enables fine-grained trade-off between performance and µA/MHz efficiency
On-Chip SIMO DC-DC Single-inductor, multi-output buck converter delivers VDDD/VDDIO/VCCD from single input; <1 µA quiescent current extends battery life
CAPSENSE™ with SmartSense Hardware-accelerated capacitive sensing with automatic tuning, liquid-tolerant operation, and proximity detection up to 25 mm
QSPI/XIP with Encryption Execute-in-place from external flash with on-the-fly AES-128 decryption and 4-KB cache - eliminates boot latency and external RAM
Deep Sleep SCB Dedicated serial block retains SPI/I²C functionality in Deep Sleep mode, enabling sensor polling without waking CPUs

Applications

Smart Home Hub Industrial Wireless Sensor Node

Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices, running local AI inference and OTA updates.

IC Role / Device Role / Timing Role: Dual-CPU orchestrates real-time protocol stacks (M0+) while M4 runs TensorFlow Lite Micro and encrypted cloud comms.

Use Value: 7 µA Deep Sleep + SIMO DC-DC enables >5-year coin-cell operation; hardware crypto ensures signed firmware validation.

Use Scenario: Battery-powered vibration/temperature node in predictive maintenance systems, transmitting data via LoRaWAN.

IC Role / Device Role / Timing Role: M0+ manages ultra-low-power sensor sampling and wake-on-event; M4 processes FFT-based anomaly detection pre-transmission.

Use Value: 12-bit SAR ADC with sequencer and averaging delivers ±0.5°C temp accuracy; Smart I/O filters noise before CPU wake-up.

Medical Wearable Monitor Secure Access Control Terminal

Use Scenario: ECG/PPG patch with touchless UI, Bluetooth LE, and local biometric authentication.

IC Role / Device Role / Timing Role: CAPSENSE™ drives proximity wake-up and gesture UI; USB enables clinical firmware update and data export.

Use Value: Integrated opamps condition analog biosignals; TRNG + AES engine meets HIPAA-compliant data-at-rest requirements.

Use Scenario: Tamper-resistant door controller using fingerprint + NFC, logging access events to encrypted flash.

IC Role / Device Role / Timing Role: Hardware crypto accelerator performs PKI signing of audit logs; eFuse array stores immutable device identity.

Use Value: 8 protection contexts isolate secure bootloader, app, and credential storage; debug disable prevents physical extraction attacks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247BZI-D54 Same package and dual-core architecture, but adds 2-MB flash, 512-KB SRAM, and enhanced USB HS PHY Better suited for edge AI gateways requiring larger firmware partitions and higher-bandwidth peripheral bridging Select when >1-MB flash or USB high-speed host capability is required; otherwise CY8C6137BZI-F34 offers optimal cost/power balance
STM32WB55RGV Single Cortex-M4 core (64 MHz), integrated BLE 5.0 radio, no programmable analog/digital fabric, 1-MB flash, 256-KB SRAM Targeted at BLE-centric wireless endpoints, not programmable logic or CAPSENSE™-based HMI Choose only if BLE SoC integration outweighs need for dual-CPU determinism, analog flexibility, or hardware crypto diversity

Compared with CY8C6247BZI-D54 and STM32WB55RGV, CY8C6137BZI-F34 uniquely balances ultra-low-power dual-core execution, on-die programmable analog/digital logic, and field-proven CAPSENSE™ - making it optimal for resource-constrained, sensor-rich, and security-critical embedded designs where flexibility and power efficiency are co-primary constraints.

Availability

CY8C6137BZI-F34 is available at Aetrix Electronics and suitable for industrial IoT gateways, medical wearables, smart home hubs, and secure access terminals requiring stable component supply across multi-year production cycles.

Supply support for CY8C6137BZI-F34 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and R&D infrastructure.

The PSoC™ 6 family was designed specifically for secure, ultra-low-power IoT endpoints - integrating programmable analog/digital fabric, dual-CPU isolation, and hardware-rooted trust to simplify certification and reduce system-level BOM count.

FAQ

What is the maximum operating frequency of the Cortex-M4 core in CY8C6137BZI-F34?

The Arm Cortex-M4F core operates at up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection unit enabled. This frequency is sustained under 1.1-V core supply; at 0.9 V, maximum frequency is reduced to maintain timing closure and power efficiency - verified in Infineon's characterization across temperature and voltage corners.

Does CY8C6137BZI-F34 support execute-in-place (XIP) from external flash?

Yes - the QSPI/SMIF interface supports XIP with on-the-fly AES-128 decryption and a dedicated 4-KB cache. External quad-SPI flash is mapped directly into the M4 instruction space, eliminating boot ROM copy overhead and reducing SRAM pressure during firmware execution.

Can the CAPSENSE™ subsystem operate during Deep Sleep mode?

Yes - CAPSENSE™ can run autonomously in Deep Sleep using the 32-kHz ILO clock and dedicated low-power sensing circuitry. It supports self- and mutual-capacitance scanning, automatic SmartSense tuning, and wake-on-touch event generation without waking either CPU core.

Is the USB interface limited to device-only operation?

No - the integrated USB full-speed PHY supports both device and host roles. Firmware-selectable configuration enables CDC, HID, or MSC class operation as a device, or enumeration of USB peripherals (e.g., keyboards, flash drives) as a host - all without external transceivers or level shifters.

CY8C6137BZI-F34 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
124-VFBGA
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6137BZI-F34 FAQ

1.How can I place an order for CY8C6137BZI-F34 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6137BZI-F34 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6137BZI-F34 reliable?

The price and inventory of CY8C6137BZI-F34 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6137BZI-F34 is usually 5 days.

3.What payment methods are accepted for CY8C6137BZI-F34?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6137BZI-F34 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6137BZI-F34?

CY8C6137BZI-F34 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6137BZI-F34 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6137BZI-F34?

For technical support, including CY8C6137BZI-F34 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6137BZI-F34 requirements.

6.How does Aetrix verify that CY8C6137BZI-F34 is sourced from the original manufacturer or authorized distributors?

All CY8C6137BZI-F34 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6137BZI-F34 meets industry standards.

7.What is the process for return or replacement of CY8C6137BZI-F34?

All CY8C6137BZI-F34 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6137BZI-F34, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6137BZI-F34 part is unused and in its original packaging.

Return procedure for CY8C6137BZI-F34:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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