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Infineon Technologies CY8C6137BZI-F54
- Part No.:
- CY8C6137BZI-F54
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6137BZI-F54.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 124BGA
- Quantity:
- Payment:
- Shipping:
Inventory:142
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Product details
Overview
CY8C6137BZI-F54 from Infineon is a dual-core PSOC™ 61 microcontroller featuring a 150-MHz Arm® Cortex®-M4F CPU and a dedicated 100-MHz Cortex®-M0+ for system functions, 1-MB flash, 288-KB SRAM, integrated CAPSENSE™, hardware cryptography accelerator, and QSPI/XIP support - deployed in IoT edge nodes requiring secure, low-power sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6137BZI-F54 datasheet, CY8C6137BZI-F54 pinout, CY8C6137BZI-F54 application, or CY8C6137BZI-F54 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), Deep Sleep current (7 µA with 64-KB SRAM retention), on-chip SIMO DC-DC converter (<1 µA quiescent), and programmable analog/digital subsystems enabling mixed-signal firmware-defined peripherals.
Technical Context
The CY8C6137BZI-F54 implements a tightly coupled dual-CPU architecture where the Cortex-M4 executes application code while the Cortex-M0+ handles real-time system services including interrupt routing, IPC, and security context management. Both cores share memory-mapped peripherals but operate under independent power domains and clock trees.
Its programmable analog subsystem includes a 12-bit 1-Msps SAR ADC with 16-channel sequencer and result averaging, two Deep Sleep-capable comparators, and a 12-bit DAC with <2-µs settling time - all accessible via hardware-triggered TCPWM kill signals and routed through Smart I/O Boolean logic during low-power states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual-core: 150-MHz Arm® Cortex®-M4F + 100-MHz Cortex®-M0+ (M0+ reserved for system functions) |
| Flash / SRAM | 1-MB application flash + 32-KB AUXFlash + 32-KB SFlash; 288-KB SRAM with selective retention control |
| Power Efficiency | 22 µA/MHz (M4 @ 0.9 V core); 7 µA Deep Sleep current with 64-KB SRAM retention |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer, averaging), two Deep Sleep comparators, 12-bit DAC (<2 µs settling) |
| Digital Programmability | Twelve UDBs (8 macrocells each), Smart I/O (16 pins), 32 TCPWM blocks, nine SCBs (SPI/I2C/UART/USB) |
| Security & Crypto | Hardware crypto accelerator (AES-256, ECC, SHA-256), TRNG, eight protection contexts, debug disable capability |
| Package | 124-ball BGA (9 × 9 mm, 0.5-mm pitch, 0.8-mm height) |
Pinout & Package
CY8C6137BZI-F54 is housed in a 124-ball BGA package (9 × 9 mm, 0.5-mm pitch, 0.8-mm height) with exposed thermal pad. Pin assignments follow Infineon's standardized PSOC™ 61 ball map, supporting configurable GPIO, analog inputs, USB D+/D−, QSPI, and power/ground distribution across four corner banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Four independent 1.7–3.6-V I/O banks enabling mixed-voltage interface (e.g., 1.8-V SPI + 3.3-V UART) |
| VDDD / VDDA | Digital/Analog Core Supply | Separate 0.9-V or 1.1-V core rails; VDDA powers ADC/DAC/Opamps with dedicated filtering |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; supports brown-out detection and POR sequencing |
| SWDCK / SWDIO | Debug Interface | Two-pin Serial Wire Debug port; supports programming, real-time trace, and secure debug disable via eFuse |
| QSPI[0:3] / QSCLK / QSSN | Quad SPI Interface | Direct XIP-capable bus for external flash; supports octal mode up to 640 Mbps with on-the-fly encryption |
| USB_DP / USB_DM | USB 2.0 Full-Speed PHY | Differential pair compliant with USB 2.0 specification; integrated transceiver eliminates external PHY requirement |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Gating | Independent voltage scaling (0.9 V / 1.1 V) and clock gating per core enable dynamic trade-off between performance and sub-µA sleep leakage |
| Programmable Analog Subsystem | Hardware-accelerated ADC averaging and comparator-triggered TCPWM kill signals reduce firmware overhead in motor control and battery monitoring |
| CAPSENSE™ with SmartSense | Self-tuning capacitive sensing engine delivers >100:1 SNR and liquid-tolerant operation without host CPU intervention |
| On-chip SIMO DC-DC Converter | Single-inductor, multi-output buck regulator supplies VDDD, VDDA, and VDDIO from single input; <1 µA quiescent current extends battery life |
| Secure Boot & eFuse | One-time-programmable 1-Kb eFuse array stores cryptographic keys and enables immutable secure boot verification before M4 execution |
Applications
| Smart Home Hub | Industrial Wireless Sensor Node |
|---|---|
|
Use Scenario: Central gateway aggregating BLE/Zigbee/Wi-Fi sensor data while running local AI inference and OTA updates. IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M4 runs neural network inference and protocol stacks; M0+ manages radio coexistence timing and secure key provisioning. Use Value: On-chip QSPI XIP + 4-KB cache enables fast firmware update staging without external RAM; SIMO DC-DC sustains 7-day battery life in always-on listening mode. |
Use Scenario: Battery-powered vibration/temperature node in predictive maintenance systems with LoRaWAN backhaul. IC Role / Device Role / Timing Role: Low-power sensor hub: ADC samples accelerometer at 1-kSPS in Deep Sleep; TCPWM triggers wake-on-event; CAPSENSE™ detects enclosure tampering. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves sensor history across months; hardware crypto accelerates AES-128 LoRaWAN payload encryption. |
| Medical Wearable | Secure Access Control Terminal |
|
Use Scenario: ECG/PPG patch with real-time arrhythmia detection and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Analog front-end controller: SAR ADC digitizes analog bio-signals; PDM/I2S interfaces to MEMS microphone; DAC drives reference voltage for precision gain calibration. Use Value: 12-bit ADC with 16-channel sequencer and hardware averaging achieves >85 dB SNR; temperature sensor auto-compensates opamp offset drift. |
Use Scenario: Tamper-resistant door controller using fingerprint + NFC + secure element authentication. IC Role / Device Role / Timing Role: Secure peripheral orchestrator: CAPSENSE™ reads fingerprint; SCB handles NFC ISO14443; crypto accelerator performs ECDSA signature verification. Use Value: Eight protection contexts isolate biometric processing from network stack; eFuse disables JTAG after production to prevent physical debug access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247BZI-D54 | Same package and core architecture; adds 256-KB additional SRAM and enhanced USB HS PHY support | Better suited for USB host applications requiring large buffer memory and high-bandwidth peripheral control | Select when USB host functionality or >288-KB SRAM is required; otherwise CY8C6137BZI-F54 offers optimal cost/power balance |
| STM32WB55RGV | Single Cortex-M4 core (64 MHz), integrated BLE 5.0 radio, no programmable analog/digital logic, smaller flash (1 MB same) | Targeted at BLE-centric devices with minimal analog signal conditioning needs | Choose only if BLE SoC integration outweighs need for CAPSENSE™, dual-CPU isolation, or hardware crypto acceleration |
Compared with CY8C6247BZI-D54 and STM32WB55RGV, CY8C6137BZI-F54 uniquely balances ultra-low-power dual-core execution, field-programmable analog/digital resources, and hardware-enforced security - making it optimal for firmware-defined IoT endpoints where mixed-signal flexibility and long battery life are non-negotiable.
Availability
CY8C6137BZI-F54 is available at Aetrix Electronics and suitable for smart home hubs, industrial wireless sensor nodes, medical wearables, and secure access terminals requiring stable component supply, long-term lifecycle assurance, and full traceability.
Supply support for CY8C6137BZI-F54 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with R&D centers across Europe, Asia, and North America.
The PSOC™ 6 product line targets secure, ultra-low-power IoT endpoints - integrating programmable analog/digital fabric with Arm dual-core CPUs to eliminate discrete signal-chain components and accelerate firmware-defined device development.
FAQ
Does CY8C6137BZI-F54 support external memory expansion beyond QSPI?
No - the CY8C6137BZI-F54 lacks parallel NOR/NAND or DDR interfaces. Its SMIF block supports only serial protocols: single/dual/quad/octal SPI, and QPI. External memory is limited to XIP-capable flash devices with ≤640 Mbps throughput. SRAM or PSRAM must be interfaced via custom GPIO bit-banging or external bridge ICs.
Can the Cortex-M0+ core be used for application code?
No - Infineon explicitly reserves the Cortex-M0+ in CY8C6137BZI-F54 for system-level functions only: interrupt aggregation, IPC messaging, security monitor tasks, and bootloader execution. Application firmware must run exclusively on the Cortex-M4F core; M0+ registers and memory regions are not user-accessible in standard configurations.
What is the maximum operating temperature for this BGA package?
The CY8C6137BZI-F54 is rated for industrial temperature range: –40 °C to +85 °C ambient. The 124-BGA package uses lead-free solder and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), requiring bake-out before reflow if exposed to humidity >10% RH for >168 hours.
Is CAPSENSE™ supported in Deep Sleep mode?
Yes - CAPSENSE™ can operate in Deep Sleep mode using the low-power ILO clock and dedicated low-power comparators. It supports automatic scan wakeup, proximity detection, and self-capacitance measurement with <10 µA active current, retaining configuration in dedicated retention registers without waking the M4 core.
CY8C6137BZI-F54 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6137BZI-F54 FAQ
1.How can I place an order for CY8C6137BZI-F54 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6137BZI-F54 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6137BZI-F54 reliable?
The price and inventory of CY8C6137BZI-F54 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6137BZI-F54 is usually 5 days.
3.What payment methods are accepted for CY8C6137BZI-F54?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6137BZI-F54 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6137BZI-F54?
CY8C6137BZI-F54 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6137BZI-F54 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6137BZI-F54?
For technical support, including CY8C6137BZI-F54 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6137BZI-F54 requirements.
6.How does Aetrix verify that CY8C6137BZI-F54 is sourced from the original manufacturer or authorized distributors?
All CY8C6137BZI-F54 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6137BZI-F54 meets industry standards.
7.What is the process for return or replacement of CY8C6137BZI-F54?
All CY8C6137BZI-F54 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6137BZI-F54, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6137BZI-F54 part is unused and in its original packaging.
Return procedure for CY8C6137BZI-F54:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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