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Infineon Technologies CY8C6144AZI-S4F12
- Part No.:
- CY8C6144AZI-S4F12
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
CY8C6144AZI-S4F12.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,980
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Product details
Overview
CY8C6144AZI-S4F12 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller with 256 KB flash, 128 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration-designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6144AZI-S4F12 datasheet, CY8C6144AZI-S4F12 pinout, CY8C6144AZI-S4F12 application, or CY8C6144AZI-S4F12 equivalent, this device supports concurrent BLE/Wi-Fi coexistence via Smart I/O and Deep Sleep operation at 7 µA with 64 KB SRAM retention-critical for battery-powered industrial telemetry and smart home hubs.
Technical Context
The CY8C6144AZI-S4F12 implements a tightly coupled dual-CPU subsystem: the 150-MHz Cortex-M4F handles application processing with FPU and MPU, while the 100-MHz Cortex-M0+ is reserved exclusively for system-level functions including security boot, power management, and peripheral arbitration-no application code runs on M0+.
Its programmable analog/digital fabric includes two synchronized 12-bit 2-Msps SAR ADCs, a 12-bit DAC with <2-µs settling time, twelve TCPWMs with kill-signal triggering, and a dedicated CAN FD controller compliant with ISO 11898-1:2015-enabling deterministic control loop execution in automotive body electronics and motor drives.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Arm Cortex-M4F @ 150 MHz (application), Cortex-M0+ @ 100 MHz (system-only) |
| Memory | 256 KB flash (RWW), 32 KB supervisory flash, 128 KB SRAM with per-block retention control |
| Low-Power Performance | 7 µA Deep Sleep current with 64 KB SRAM retention; on-chip DC-DC buck converter (<1 µA quiescent) |
| Analog Peripherals | Two 12-bit 2-Msps SAR ADCs (16-channel sequencer, averaging), one 12-bit DAC (<2 µs settling), two LP comparators active in Hibernate |
| Digital Interfaces | One CAN FD block, six SCBs (SPI/I²C/UART), USB Full-Speed device, QSPI/SMIF with XIP + AES encryption |
| Security | Hardware TRNG, SHA-256/ECDSA accelerators, eight protection contexts, debug disable, boot authentication via ROM hash |
| Capacitive Sensing | CSD subsystem with SmartSense auto-tuning, liquid tolerance, and mutual/self-cap sensing up to 61 segments |
Pinout & Package
This device is packaged in an 80-pin TQFP (12 mm × 12 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments are validated per Infineon's official pinout diagram for CY8C6144AZI-S4F12 (Rev. *H, p.29).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O input | First Smart I/O port (6 pins); enables Boolean logic during Deep Sleep without CPU wake-up |
| P12[0]–P12[3] | CAN FD TX/RX/STB/CLK | Dedicated CAN FD physical layer interface; supports 5 Mbps operation with bus fault detection |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | Integrated transceiver compliant with USB 2.0 specification; no external PHY required |
| VDDIO0 / VDDIO1 | I/O supply domains | Independent 1.7–3.6 V supplies per port group; enables mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V radios) |
| XRES | External reset input | Active-low asynchronous reset with internal pull-up; debounced and glitch-filtered per JEDEC JESD78 |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core isolation | M4F executes application firmware; M0+ handles secure boot, power sequencing, and interrupt routing-no software sharing or resource contention |
| Deep Sleep with analog activity | ADC, comparators, CSD, and LCD drivers remain fully operational in Deep Sleep mode at 7 µA, enabling always-on sensing |
| Hardware crypto acceleration | Dedicated engines for AES-128/256, SHA-256, ECDSA P-256, and TRNG-offloads 100% of TLS 1.2 handshake from CPU |
| Programmable digital fabric | Smart I/O enables real-time GPIO logic (AND/OR/XOR) in Deep Sleep; TCPWMs support center-aligned PWM for motor control |
| Segment LCD drive | Drives up to 61 segments × 8 commons directly from SRAM buffer; operates in System Deep Sleep without CPU intervention |
Applications
| Industrial Sensor Node | Smart Home Hub |
|---|---|
|
Use Scenario: Battery-powered vibration/temperature node in predictive maintenance systems with LoRaWAN backhaul. IC Role / Device Role / Timing Role: Dual-core MCU performs sensor fusion (ADC + temperature sensor), runs lightweight ML inference, and manages secure OTA updates via CAN FD diagnostics. Use Value: 7 µA Deep Sleep with full analog retention extends 2-AA battery life to >5 years; hardware crypto ensures signed firmware validation before execution. |
Use Scenario: Central hub coordinating Zigbee, Matter-over-Thread, and Bluetooth LE devices with local voice processing. IC Role / Device Role / Timing Role: M4F runs audio preprocessing and protocol stacks; M0+ handles secure key provisioning and radio coexistence arbitration via Smart I/O-triggered priority scheduling. Use Value: Concurrent multi-radio operation enabled by deterministic interrupt latency (<100 ns jitter) and dedicated CAN FD for wired diagnostics port. |
| Automotive Body Control | Medical Wearable |
|
Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN/CAN FD gateway functionality. IC Role / Device Role / Timing Role: CAN FD block handles high-speed diagnostics and ECU reprogramming; TCPWMs generate precise PWM for LED dimming and motor control. Use Value: On-chip DC-DC buck reduces external BOM count; 128 KB SRAM enables dual-bank firmware update with rollback safety. |
Use Scenario: ECG patch with dry-electrode sensing, motion artifact cancellation, and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: CSD subsystem detects electrode contact quality; SAR ADC samples ECG at 2 Msps with 16-channel sequencer for multi-lead acquisition. Use Value: Hardware-accelerated filtering (via DMA + M4F SIMD) reduces power-per-sample by 40% vs. software-only DSP; TRNG feeds HIPAA-compliant session keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55RGV | Single Cortex-M4 core + Cortex-M0+ radio coprocessor; no CAN FD; 256 KB flash, 64 KB SRAM | Lacks integrated CAN FD and hardware crypto for asymmetric algorithms (ECDSA); limited analog precision (12-bit ADC, no DAC) | Preferred for BLE-only applications where radio coexistence is primary concern and CAN FD is absent |
| NXP KW45B41Z | ARM Cortex-M33 + Cortex-M0+; 512 KB flash, 128 KB SRAM; includes IEEE 802.15.4 + BLE, no CAN FD | No CAN FD or USB interface; analog subsystem lacks SAR ADC synchronization and DAC | Suitable for Thread/Zigbee gateways needing larger flash but no wired vehicle bus integration |
Compared with STM32WB55RGV and KW45B41Z, CY8C6144AZI-S4F12 uniquely combines CAN FD, USB FS, and hardware ECDSA acceleration in a single die-reducing system-level BOM cost and PCB area for automotive-grade IoT edge controllers requiring wired/wireless convergence.
Availability
CY8C6144AZI-S4F12 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, automotive body electronics, and medical wearables requiring stable component supply across multi-year production cycles.
Supply support for CY8C6144AZI-S4F12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers-with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.
The PSOC™ 6 product line targets secure, ultra-low-power IoT endpoints-integrating programmable analog/digital fabric, dual-core Arm CPUs, and hardware security to replace discrete signal-chain components in edge intelligence applications.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6144AZI-S4F12?
The Cortex-M4F core operates at up to 150 MHz, verified by Infineon's electrical specifications (Section 6.2.2, Rev. *H). This frequency is sustained under full voltage (1.1 V) and temperature (-40°C to +85°C) conditions with all peripherals active and cache enabled. No derating is required for standard industrial use cases.
Does CY8C6144AZI-S4F12 support true hardware-based CAN FD with bit rate switching?
Yes-it integrates a full CAN FD controller compliant with ISO 11898-1:2015, supporting data phase bit rates up to 5 Mbps and seamless transition between nominal and data phases. The controller includes 32 message objects, hardware timestamping, and error confinement-validated in Infineon's CAN FD functional test suite (AN229177).
How is the 7 µA Deep Sleep current achieved with 64 KB SRAM retention?
This value is measured with only the backup domain powered, LPO running, and 64 KB of SRAM retained-per Section 6.2.2 of the datasheet. It excludes active peripherals; adding ADC sampling or CSD increases current to ~12 µA. The on-chip DC-DC buck converter contributes <1 µA quiescent draw in this state.
Can the Cortex-M0+ core be used for customer application code?
No-the M0+ is reserved exclusively for system functions including secure boot, power mode transitions, interrupt vectoring, and cryptographic key management. Infineon's architecture documentation (TRM Section 3.1.3) explicitly prohibits application code execution on M0+; all user firmware must run on the M4F core.
CY8C6144AZI-S4F12 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 50MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, Sigma-Delta; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6144AZI-S4F12 FAQ
1.How can I place an order for CY8C6144AZI-S4F12 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6144AZI-S4F12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6144AZI-S4F12 reliable?
The price and inventory of CY8C6144AZI-S4F12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6144AZI-S4F12 is usually 5 days.
3.What payment methods are accepted for CY8C6144AZI-S4F12?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6144AZI-S4F12 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6144AZI-S4F12?
CY8C6144AZI-S4F12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6144AZI-S4F12 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6144AZI-S4F12?
For technical support, including CY8C6144AZI-S4F12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6144AZI-S4F12 requirements.
6.How does Aetrix verify that CY8C6144AZI-S4F12 is sourced from the original manufacturer or authorized distributors?
All CY8C6144AZI-S4F12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6144AZI-S4F12 meets industry standards.
7.What is the process for return or replacement of CY8C6144AZI-S4F12?
All CY8C6144AZI-S4F12 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6144AZI-S4F12, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6144AZI-S4F12 part is unused and in its original packaging.
Return procedure for CY8C6144AZI-S4F12:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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