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Infineon Technologies CY8C6144AZI-S4F82

Part No.:
CY8C6144AZI-S4F82
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP Exposed Pad
Datasheet:
AetrixCY8C6144AZI-S4F82.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,563

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Product details

Overview

CY8C6144AZI-S4F82 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller with 256 KB flash, 128 KB SRAM, integrated CAN FD, USB Full-Speed, QSPI/XIP, and programmable analog/digital peripherals - designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.

For engineers reviewing the CY8C6144AZI-S4F82 datasheet, CY8C6144AZI-S4F82 pinout, CY8C6144AZI-S4F82 application, or CY8C6144AZI-S4F82 equivalent, key selection considerations include Deep Sleep current (7 µA), dual-CPU voltage scaling (0.9 V / 1.1 V), hardware crypto acceleration, on-chip DC-DC buck converter (<1 µA quiescent), and segment LCD drive support up to 61 segments in System Deep Sleep mode.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F (150 MHz) handles application processing and signal integrity tasks, while the Cortex-M0+ (100 MHz) is reserved exclusively for system-level functions including security boot, power management, and peripheral arbitration - no user application code runs on M0+.

Its programmable analog subsystem includes two synchronized 12-bit 2-Msps SAR ADCs with 16-channel sequencer and Deep Sleep operation, one 12-bit DAC with <2 µs settling time, two low-power comparators active in Hibernate, and two opamps with continuous-time operation - all accessible via hardware-triggered TCPWM kill signals and Smart I/O Boolean logic during low-power states.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F with FPU + 100-MHz Cortex-M0+ (system-only, not user-accessible)
Memory 256-KB application flash + 32-KB supervisory flash; 128-KB SRAM with programmable retention granularity
Low-Power Performance 7 µA Deep Sleep current with 64-KB SRAM retention; on-chip DC-DC buck converter with <1 µA quiescent current
Analog Peripherals Two 12-bit 2-Msps SAR ADCs with synchronized sampling; one 12-bit DAC (<2 µs settling); two LP comparators active in Hibernate
Digital Interfaces One CAN FD block; six configurable SCBs (five SPI/I²C/UART + one Deep Sleep SCB); USB Full-Speed device interface
Programmable Logic Smart I/O (6 pins) enabling Boolean operations during System Deep Sleep; CapSense™ CSD with SmartSense auto-tuning
Clock & Timing 8-MHz IMO (±2%); 32-kHz ILO; PLL/FLL clock multiplication; twelve TCPWMs with center-aligned/PWM/Kill-trigger modes

Pinout & Package

This device is housed in an 80-pin TQFP package (ZI suffix), with 62 GPIOs supporting programmable drive strength, slew rate, and overvoltage tolerance on two pins. Pin functions are validated per Infineon's official CY8C61x4 pinout diagram (Rev. *H, p.29).

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] General-purpose I/O bank 0 Supports CapSense™, Smart I/O Boolean logic, and Deep Sleep wake-up; configurable as analog input or digital interface
P1[0]–P1[7] General-purpose I/O bank 1 Includes CAN FD TX/RX, USB D+/D−, and QSPI data lines; supports OVT on P1[0]/P1[1]
P12[0]–P12[7] Segment LCD driver outputs Drives up to 61 segments and 8 commons; operates in System Deep Sleep mode without CPU wake-up
XRES External reset input Active-low asynchronous reset; internal pull-up; compatible with standard push-button or supervisor IC reset signals
VDDIO0/VDDIO1 I/O supply rails Independent 1.7–3.6 V supplies per bank; enables mixed-voltage interfacing and dynamic I/O voltage scaling

Key Features

Feature Design Value
Hardware Security Architecture Authentication during boot using hardware SHA-256; eight protection contexts; debug/test ingress disable capability
Cryptography Acceleration Dedicated hardware engines for AES-128/256, ECC, RSA, SHA-256, and TRNG - offloads CPU during TLS handshake and firmware update verification
Ultra-Low-Power Operation Six fine-grained power modes; Deep Sleep at 7 µA with 64-KB SRAM retention; backup domain with RTC and 64-byte memory
Flexible Memory Interface Quad-SPI (QSPI)/SMIF with Execute-In-Place (XIP), on-the-fly encryption/decryption, and 4-KB cache - enables secure external code execution at up to 320 Mbps
Programmable Analog Integration Two synchronized SAR ADCs with result averaging and Deep Sleep operation; temperature sensor directly connected to ADC channel

Applications

Smart Home Sensor Hub Industrial Predictive Maintenance Node

Use Scenario: Multi-sensor aggregation (temperature, humidity, vibration, gas) with local AI inference and BLE/Wi-Fi coexistence.

IC Role / Device Role / Timing Role: Central MCU managing concurrent analog acquisition, CAN FD fieldbus communication, and secure OTA updates via QSPI-encrypted XIP.

Use Value: Dual-core isolation ensures real-time sensor sampling on M4F while M0+ handles secure boot and power state transitions - eliminating software race conditions in battery-powered deployments.

Use Scenario: Edge node monitoring motor current, bearing temperature, and acoustic emissions in factory automation systems.

IC Role / Device Role / Timing Role: Real-time signal conditioning via synchronized dual ADCs, TCPWM-driven PWM control of auxiliary actuators, and CAN FD reporting to PLC master.

Use Value: Hardware-triggered TCPWM kill signals respond to comparator overcurrent events in <100 ns - enabling sub-microsecond fault response without CPU intervention.

Wearable Health Monitor Secure Access Control Terminal

Use Scenario: Optical heart-rate and SpO₂ sensing with capacitive touch UI and Bluetooth LE connectivity.

IC Role / Device Role / Timing Role: CapSense™ CSD with SmartSense auto-tuning for liquid-tolerant touch buttons; segment LCD driving in Deep Sleep for persistent display.

Use Value: Segment LCD remains active with full 61-segment resolution during System Deep Sleep - extending battery life beyond 7 days on coin-cell power.

Use Scenario: Tamper-resistant door controller with biometric authentication, encrypted credential storage, and secure audit logging.

IC Role / Device Role / Timing Role: Hardware-accelerated AES-256 and SHA-256 for credential validation; OTP eFuse array for immutable root-of-trust binding.

Use Value: One-time-programmable 1-Kb eFuse array stores cryptographic keys and device identity - preventing key extraction even under physical attack.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247AZI-D54 Higher memory (512 KB flash, 256 KB SRAM); adds Bluetooth LE radio; no CAN FD block Better suited for BLE-centric IoT endpoints; lacks industrial fieldbus interface Select when wireless connectivity outweighs CAN FD requirement and higher BOM cost is acceptable
STM32WB55RGV Single Cortex-M4 core (64 MHz); integrated BLE 5.0 radio; no programmable analog/digital fabric Limited analog flexibility; no CapSense™ or Smart I/O; lower peak performance and security granularity Choose for simpler BLE gateway designs where hardware programmability and multi-protocol timing precision are non-critical

Compared with CY8C6144AZI-S4F82, CY8C6247AZI-D54 offers greater memory and integrated BLE but sacrifices CAN FD and increases power consumption in active mode; STM32WB55RGV provides lower-cost BLE integration but lacks dual-core isolation, hardware crypto context switching, and analog programmability essential for sensor-fusion edge nodes.

Availability

CY8C6144AZI-S4F82 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, wearable health monitors, and secure access control terminals requiring stable component supply across long-lifecycle deployments.

Supply support for CY8C6144AZI-S4F82 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and embedded controllers - with global R&D centers and ISO/TS 16949-certified manufacturing.

This part belongs to the PSOC™ 6 family, engineered specifically for secure, ultra-low-power IoT edge devices that demand hardware-enforced trust, heterogeneous processing, and integrated analog/digital programmability - not general-purpose MCU use cases.

FAQ

Is the Cortex-M0+ core accessible for user application code?

No. The Cortex-M0+ in CY8C6144AZI-S4F82 is reserved exclusively for system-level functions including secure boot, power management, interrupt arbitration, and peripheral initialization. Application firmware executes solely on the Cortex-M4F core, ensuring deterministic real-time behavior and hardware-enforced separation of trusted services.

Does this device support external memory execution with encryption?

Yes. The Quad-SPI/SMIF interface supports Execute-In-Place (XIP) from external flash with on-the-fly AES-128 decryption. A dedicated 4-KB cache optimizes instruction fetch latency, and hardware encryption keys are stored in protected memory regions - enabling secure external code storage without exposing plaintext firmware.

What is the lowest achievable current in Deep Sleep mode?

The device achieves 7 µA typical Deep Sleep current with 64-KB SRAM retention, measured at 3.3 V and 25°C. This includes active backup domain (RTC + 64-byte memory) and selected wakeup sources. The on-chip DC-DC buck converter contributes <1 µA quiescent current, making it optimal for coin-cell or energy-harvesting applications.

Can CapSense™ operate during low-power states?

Yes. Capacitive Sigma-Delta (CSD) sensing remains fully functional in System Deep Sleep mode. SmartSense auto-tuning adjusts baseline and sensitivity dynamically, and the CSD block can generate interrupts to wake the CPU - enabling touch UI responsiveness without compromising battery life in always-on wearable or access terminal designs.

CY8C6144AZI-S4F82 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
50MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, Sigma-Delta; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6144AZI-S4F82 FAQ

1.How can I place an order for CY8C6144AZI-S4F82 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6144AZI-S4F82 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6144AZI-S4F82 reliable?

The price and inventory of CY8C6144AZI-S4F82 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6144AZI-S4F82 is usually 5 days.

3.What payment methods are accepted for CY8C6144AZI-S4F82?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6144AZI-S4F82 transactions.

Note: Certain payment methods may incur a processing fee.

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CY8C6144AZI-S4F82 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6144AZI-S4F82 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6144AZI-S4F82?

For technical support, including CY8C6144AZI-S4F82 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6144AZI-S4F82 requirements.

6.How does Aetrix verify that CY8C6144AZI-S4F82 is sourced from the original manufacturer or authorized distributors?

All CY8C6144AZI-S4F82 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6144AZI-S4F82 meets industry standards.

7.What is the process for return or replacement of CY8C6144AZI-S4F82?

All CY8C6144AZI-S4F82 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6144AZI-S4F82, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6144AZI-S4F82 part is unused and in its original packaging.

Return procedure for CY8C6144AZI-S4F82:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6144AZI-S4F82 Tags

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