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Infineon Technologies CY8C6144AZI-S4F83

Part No.:
CY8C6144AZI-S4F83
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixCY8C6144AZI-S4F83.pdf
Description:
IC MCU 32BIT 256KB FLASH 80TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,986

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Product details

Overview

CY8C6144AZI-S4F83 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller with 256 KB flash, 128 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports XIP from external Quad-SPI Flash at up to 320 Mbps - deployed in secure IoT edge nodes requiring real-time sensor fusion and low-power connectivity.

For engineers reviewing the CY8C6144AZI-S4F83 datasheet, CY8C6144AZI-S4F83 pinout, CY8C6144AZI-S4F83 application, or CY8C6144AZI-S4F83 equivalent, key selection criteria include dual-CPU partitioning (M4F for application, M0+ reserved for system functions), on-chip DC-DC buck converter (<1 µA quiescent), 12-bit SAR ADC with synchronized sampling, Smart I/O Boolean logic in Deep Sleep, and hardware TRNG + AES/SHA accelerators.

Technical Context

The device implements a tightly coupled dual-CPU subsystem: the 150-MHz Cortex-M4F handles application code with FPU and MPU, while the 100-MHz Cortex-M0+ executes boot, security, and power management firmware - not user-accessible. Inter-processor communication uses hardware IPC channels with doorbell interrupts and shared memory.

Its programmable analog subsystem includes two independent 12-bit 2-Msps SAR ADCs with 16-channel sequencer and result averaging, one 12-bit DAC with <2-µs settling time, two opamps, and two low-power comparators - all operable in Deep Sleep mode. The SMIF block enables encrypted Execute-In-Place from external QSPI Flash with 4-KB cache.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F (application) + 100-MHz Cortex-M0+ (system-reserved)
Memory 256 KB application flash + 32 KB supervisory flash; 128 KB SRAM with programmable retention granularity
Power Consumption 7 µA in Deep Sleep with 64 KB SRAM retention; on-chip DC-DC buck converter with <1 µA quiescent current
Analog Peripherals Two 12-bit 2-Msps SAR ADCs with synchronized sampling; one 12-bit DAC (<2 µs settling); two opamps; two LP comparators
Digital Interfaces One CAN FD controller; six configurable SCBs (SPI/I²C/UART); USB Full-Speed device; QSPI/SMIF with XIP & hardware encryption
Security Hardware crypto accelerators (AES-128/256, SHA-1/256, ECC); TRNG; boot authentication via hardware hashing; eight protection contexts
Capacitive Sensing CapSense™ CSD engine with SmartSense auto-tuning, liquid tolerance, and support for self/mutual sensing up to 61 segments

Pinout & Package

This device is housed in an 80-pin TQFP package (ZI suffix), with 62 GPIOs including six Smart I/O pins, two overvoltage-tolerant (OVT) inputs, and dedicated pins for CAN FD (CANRX/CANTX), USB D+/D−, and QSPI clock/data lines.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO3 I/O Power Supply Independent 1.7–3.6 V domains per port group; enables mixed-voltage interfacing
P0[0]–P9[7] Programmable GPIO 62 total; configurable drive strength/slew rate; Smart I/O logic available in Deep Sleep
CANRX / CANTX CAN FD Physical Interface Dedicated differential pair supporting CAN FD up to 5 Mbps with built-in transceiver bias control
USBDP / USBDM USB 2.0 Full-Speed PHY On-die termination and pull-up; compliant with USB 2.0 specification without external components
SMIF_CLK / SMIF_D0–D3 Quad-SPI Memory Interface Supports single/dual/quad modes; enables encrypted XIP with 4-KB cache for low-power execution
XRES External Reset Input Active-low asynchronous reset; internal pull-up; compatible with standard reset supervisors

Key Features

Feature Design Value
Dual-CPU Partitioning M4F runs application firmware; M0+ executes immutable system services - eliminates runtime interference and simplifies security certification
Deep Sleep Analog Operation SAR ADC, DAC, comparators, and CapSense™ remain active in Deep Sleep - enables always-on sensing without wake-up latency
Smart I/O Logic 6-pin Smart I/O block performs Boolean operations (AND/OR/XOR) on GPIO states during Deep Sleep - reduces CPU wake-ups for simple event filtering
Hardware Crypto Acceleration Dedicated AES-128/256, SHA-1/256, and ECC engines offload encryption from CPU - cuts TLS handshake time by >70% vs. software-only implementation
On-Chip DC-DC Buck Integrated regulator supports 1.1 V core voltage at 150 MHz - improves active-mode efficiency by ~35% vs. linear LDO under dynamic load

Applications

Industrial Sensor Node Secure Wearable Hub

Use Scenario: Battery-powered wireless vibration/temperature node in predictive maintenance systems.

IC Role / Device Role / Timing Role: Dual-core MCU acquires synchronized multi-sensor data via SAR ADCs, runs FFT-based analytics on M4F, and transmits encrypted telemetry via CAN FD or BLE companion radio.

Use Value: 7 µA Deep Sleep with active CapSense™ and ADC enables >5-year battery life; hardware TRNG and AES ensure OTA update integrity.

Use Scenario: Multi-sensor health monitor (ECG, SpO₂, motion) with medical-grade data privacy requirements.

IC Role / Device Role / Timing Role: Manages analog front-end signal chain, performs real-time motion artifact cancellation, and enforces HIPAA-compliant encryption before local storage or Bluetooth transmission.

Use Value: On-die temperature sensor calibrated to ±1.5°C enables thermal compensation of analog paths; eight protection contexts isolate sensor, crypto, and comms domains.

Smart Building Controller Automotive Body Control Module

Use Scenario: Occupancy-aware HVAC/lighting controller using capacitive touch + PIR fusion.

IC Role / Device Role / Timing Role: CapSense™ CSD detects touch gestures; Smart I/O filters PIR triggers in Deep Sleep; M4F fuses inputs and drives DALI/0–10 V lighting interfaces.

Use Value: Self-calibrating SmartSense eliminates manual tuning; synchronized ADC sampling captures transient occupancy events without missed edges.

Use Scenario: Low-power door module managing window lift, mirror fold, and interior lighting with CAN FD backbone integration.

IC Role / Device Role / Timing Role: CAN FD interface handles vehicle network commands; TCPWMs generate precise PWM for motor control; OVT pins tolerate 18 V battery transients.

Use Value: 62 GPIOs with programmable slew rates suppress EMI in automotive harnesses; on-chip DC-DC maintains regulation during cold-crank (4.5 V min).

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RG Single Cortex-M4 + Cortex-M0+; no integrated CAN FD; BLE 5.0 radio instead of USB/CAN; 256 KB flash, 64 KB RAM Optimized for wireless sensor networks with BLE mesh; lacks QSPI XIP and hardware CapSense™ Choose when wireless coexistence (BLE + MCU) outweighs CAN FD or LCD driving needs
RA6M5 (R7FA6M5BH3CFP) 200-MHz Cortex-M33 with TrustZone; 1 MB flash, 512 KB RAM; CAN FD + USB HS; no integrated CapSense™ or SMIF XIP Targets high-throughput industrial HMI with Linux-capable peripherals; higher power in Deep Sleep (12 µA) Prefer for complex GUI or RTOS-heavy workloads where memory headroom and USB HS matter more than ultra-low Deep Sleep current

Compared with STM32WB55RG and RA6M5, CY8C6144AZI-S4F83 uniquely combines CAN FD, USB FS, hardware-accelerated CapSense™, and sub-10 µA Deep Sleep - making it optimal for cost-sensitive, battery-operated IoT endpoints needing mixed-signal intelligence and automotive-grade connectivity.

Availability

CY8C6144AZI-S4F83 is available at Aetrix Electronics and suitable for industrial sensor nodes, secure wearables, smart building controllers, and automotive body electronics requiring stable component supply across long-lifecycle deployments.

Supply support for CY8C6144AZI-S4F83 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers - with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.

This part belongs to the PSoC™ 6 family, engineered specifically for secure, ultra-low-power IoT edge devices that integrate programmable analog/digital logic with Arm-based processing - bridging the gap between discrete signal conditioning and embedded intelligence.

FAQ

Is the Cortex-M0+ core accessible for user application code?

No. In the CY8C6144AZI-S4F83, the Cortex-M0+ is reserved exclusively for system-level functions including boot, security monitoring, and power management. Application firmware must run solely on the Cortex-M4F core, which includes FPU and MPU for deterministic real-time execution.

Does this device support external QSPI Flash with hardware encryption during XIP?

Yes. The SMIF peripheral provides on-the-fly AES-128 decryption of instructions fetched directly from external Quad-SPI Flash, enabling secure Execute-In-Place without exposing decrypted code to external memory buses - critical for protecting firmware IP in field-deployed devices.

What is the maximum operating frequency of the on-chip DC-DC buck converter?

The integrated DC-DC buck operates up to 12 MHz switching frequency, dynamically adjusting to load conditions while maintaining <1 µA quiescent current in Deep Sleep - delivering regulated 1.1 V core voltage for the M4F at 150 MHz with 92% peak efficiency.

Can CapSense™ operate independently while the CPU remains in Deep Sleep?

Yes. The CapSense™ CSD block runs autonomously in Deep Sleep mode using the 32-kHz ILO clock, performing baseline tracking, noise filtering, and gesture detection - waking the M4F only upon confirmed touch or proximity event, reducing average system power by up to 40% in human-interface applications.

CY8C6144AZI-S4F83 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
150MHz
Connectivity:
FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
62
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6144AZI-S4F83 FAQ

1.How can I place an order for CY8C6144AZI-S4F83 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6144AZI-S4F83 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6144AZI-S4F83 reliable?

The price and inventory of CY8C6144AZI-S4F83 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6144AZI-S4F83 is usually 5 days.

3.What payment methods are accepted for CY8C6144AZI-S4F83?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6144AZI-S4F83 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6144AZI-S4F83?

CY8C6144AZI-S4F83 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6144AZI-S4F83 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6144AZI-S4F83?

For technical support, including CY8C6144AZI-S4F83 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6144AZI-S4F83 requirements.

6.How does Aetrix verify that CY8C6144AZI-S4F83 is sourced from the original manufacturer or authorized distributors?

All CY8C6144AZI-S4F83 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6144AZI-S4F83 meets industry standards.

7.What is the process for return or replacement of CY8C6144AZI-S4F83?

All CY8C6144AZI-S4F83 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6144AZI-S4F83, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6144AZI-S4F83 part is unused and in its original packaging.

Return procedure for CY8C6144AZI-S4F83:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6144AZI-S4F83 Tags

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