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Infineon Technologies CY8C6144AZI-S4F93
- Part No.:
- CY8C6144AZI-S4F93
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY8C6144AZI-S4F93.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 80TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:220
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Product details
Overview
CY8C6144AZI-S4F93 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller with 256-KB flash, 128-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration-designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6144AZI-S4F93 datasheet, CY8C6144AZI-S4F93 pinout, CY8C6144AZI-S4F93 application, or CY8C6144AZI-S4F93 equivalent, this device supports concurrent BLE/Wi-Fi system control, capacitive touch + analog sensing in Deep Sleep (7 µA), and XIP execution from external QSPI Flash with on-the-fly encryption-key selection criteria for battery-powered industrial gateways and smart sensors.
Technical Context
The CY8C6144AZI-S4F93 implements a tightly coupled dual-CPU architecture: the 150-MHz Cortex-M4F handles application processing and floating-point math, while the 100-MHz Cortex-M0+ is reserved exclusively for system-level tasks including security boot, power management, and peripheral arbitration-no user application code runs on M0+.
Its programmable analog subsystem includes two synchronized 12-bit 2-Msps SAR ADCs with 16-channel sequencer and Deep Sleep operation, one 12-bit DAC (<2-μs settling), two opamps, and two low-power comparators-all operational during System Deep Sleep mode with 64-KB SRAM retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F (FP/MPU) + 100-MHz Cortex-M0+ (system-only, not user-accessible) |
| Memory | 256-KB application flash + 32-KB supervisory flash; 128-KB SRAM with programmable retention granularity |
| Power Consumption | 7 µA in Deep Sleep with 64-KB SRAM retention; on-chip DC-DC buck converter with <1-µA quiescent current |
| Analog Peripherals | Two 12-bit 2-Msps SAR ADCs (synchronized sampling, Deep Sleep capable); one 12-bit DAC (<2-μs settling) |
| Communication | Six SCBs (5 configurable as SPI/I²C/UART, 1 Deep Sleep-capable as SPI/I²C); one USB Full-Speed device interface; one CAN FD block |
| Security | Hardware crypto accelerators (AES, ECC, SHA); TRNG; authentication during boot via hardware hashing; up to eight protection contexts |
| Capacitive Sensing | CAPSENSE™ CSD subsystem with SmartSense auto-tuning, liquid tolerance, and mutual/self-sensing support |
Pinout & Package
This device is packaged in an 80-pin TQFP (Thin Quad Flat Package) with 0.5-mm pitch, thermally enhanced for industrial ambient operation and compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Bank 0 | Programmable drive modes, slew rates, and overvoltage tolerance on P0[0]/P0[1]; supports Smart I/O Boolean logic in Deep Sleep |
| P1[0]–P1[7] | GPIO Bank 1 | Capacitive sensing inputs (CSD), analog input channels (SAR ADC), and comparator inputs; supports wake-on-touch |
| USB_DP / USB_DM | USB Full-Speed Interface | Differential pair compliant with USB 2.0 Full-Speed signaling; internal termination and PHY; requires no external transceiver |
| CAN_TX / CAN_RX | CAN FD Transceiver Interface | Dedicated differential pins supporting CAN FD protocol up to 5 Mbps; integrated bus fault protection and loopback test mode |
| VDDIO0 / VDDIO1 | I/O Power Supply Rails | Independent 1.7–3.6-V supplies per GPIO bank; enables mixed-voltage interfacing (e.g., 1.8-V logic with 3.3-V peripherals) |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; debounced and glitch-filtered; asserts full chip reset including both CPU domains |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot Architecture | Hardware-based authentication using SHA-256 hashing of firmware image; all debug/test paths disableable via eFuse; prevents unauthorized firmware execution |
| Deep Sleep Programmability | Full peripheral retention and operation-including SAR ADC sampling, CAPSENSE™ scanning, and SCB I²C wake events-at 7 µA total current draw |
| Quad-SPI XIP with Encryption | Execute-in-place from external QSPI Flash at up to 320 Mbps; on-the-fly AES-128 decryption with 4-KB cache to reduce active cycles and power |
| Smart I/O Logic Unit | 6-pin Smart I/O port performs Boolean operations (AND/OR/XOR) on GPIO states without CPU involvement-enables autonomous wake triggers and signal conditioning in Deep Sleep |
| Integrated CAN FD Controller | Full CAN FD protocol stack (ISO 11898-1:2015) with bit rate switching (up to 5 Mbps data phase); supports payload sizes up to 64 bytes and CRC-17 error detection |
Applications
| Industrial Sensor Node | Smart Home Hub |
|---|---|
|
Use Scenario: Battery-powered wireless node collecting temperature, humidity, and vibration data with local preprocessing before BLE transmission. IC Role / Device Role / Timing Role: Dual-core MCU executing sensor fusion on M4F while M0+ manages BLE stack timing, power state transitions, and watchdog supervision. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends 2-AA battery life beyond 5 years; on-chip DAC drives analog front-end calibration signals without external components. |
Use Scenario: Central hub coordinating Zigbee, Matter-over-Thread, and Bluetooth LE devices with local voice trigger buffering and secure OTA updates. IC Role / Device Role / Timing Role: USB Full-Speed interface handles host-side firmware update; hardware crypto accelerators verify signed OTA images in <10 ms; CAN FD connects to legacy HVAC controllers. Use Value: Single-chip integration eliminates external crypto IC and level shifters; CAPSENSE™ enables capacitive touch controls with proximity wake, reducing standby power by 40% vs. polling. |
| Medical Wearable | Automotive Cabin Monitor |
|
Use Scenario: ECG/PPG patch with real-time arrhythmia detection, motion artifact cancellation, and encrypted health data storage. IC Role / Device Role / Timing Role: M4F runs adaptive filtering and ML inference; SAR ADCs sample dual-channel analog biosignals synchronously at 2 Msps; TRNG seeds session keys for Bluetooth pairing. Use Value: Synchronized dual ADC sampling eliminates inter-channel skew; on-chip opamps condition raw electrode signals-reducing BOM count by 3 analog ICs. |
Use Scenario: In-cabin occupancy and gesture recognition system using capacitive touch + IR proximity sensing with CAN FD integration to vehicle network. IC Role / Device Role / Timing Role: CAPSENSE™ CSD subsystem detects seat occupancy and hand gestures; CAN FD block transmits status to body control module with deterministic latency <100 µs. Use Value: SmartSense auto-tuning maintains stable touch performance across temperature/humidity variations; Deep Sleep SCB monitors CAN bus for remote wake commands without waking M4F core. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP KW45B41ZUK0 | Single-core Cortex-M33 (112 MHz); no CAN FD; BLE 5.0 only; 256-KB flash, 64-KB SRAM | Lacks dual-CPU isolation, hardware crypto acceleration for ECC, and CAN FD-unsuitable for automotive or industrial fieldbus integration | Select when BLE-only connectivity suffices and cost sensitivity outweighs security/certification requirements |
| Renesas RA6M5 | Dual-core (Cortex-M33 + TrustZone); 1 MB flash, 512 KB SRAM; no integrated CAPSENSE™ or CSD; USB HS + CAN FD | Higher memory and USB speed, but requires external capacitive sensing IC and lacks Smart I/O logic-increases BOM and firmware complexity | Select for high-throughput data logging with external sensors; avoid when capacitive UI or ultra-low-power wake-from-sleep is critical |
Compared with KW45B41ZUK0 and RA6M5, the CY8C6144AZI-S4F93 uniquely combines certified secure boot, Deep Sleep-capable analog peripherals, and autonomous Smart I/O logic-enabling single-chip solutions for battery-constrained, safety-aware edge nodes where firmware integrity and sub-10-µA sleep current are non-negotiable.
Availability
CY8C6144AZI-S4F93 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, medical wearables, and automotive cabin monitors requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C6144AZI-S4F93 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers-with global R&D centers and ISO/TS 16949-certified manufacturing.
The PSOC™ 6 product line targets secure, ultra-low-power IoT endpoints, integrating programmable analog/digital fabric with Arm dual-core CPUs to eliminate discrete signal-chain components and accelerate time-to-certification for industrial and medical applications.
FAQ
Does CY8C6144AZI-S4F93 support JTAG debugging?
Yes, it supports SWD (Serial Wire Debug) and JTAG interfaces via the SWJ-DP debug port. The 32-bit Silicon ID is accessible through SWJ, with MSB encoding die revision and LSBs containing manufacturer ID "069" in hex. Debug access can be permanently disabled via eFuse for production security.
What is the maximum operating temperature for this device?
The CY8C6144AZI-S4F93 is rated for industrial temperature range: –40 °C to +85 °C ambient. Its on-chip DC-DC buck converter maintains regulation across this range, and the SAR ADC retains 12-bit linearity with ±1 LSB INL up to 85 °C per datasheet Section 6.3.5.
Can the Cortex-M0+ core execute user code?
No-the Cortex-M0+ in CY8C6144AZI-S4F93 is reserved exclusively for system functions including secure boot, interrupt routing, power mode management, and peripheral arbitration. All application firmware must run on the Cortex-M4F core; M0+ firmware is preloaded in ROM and not modifiable.
Is external crystal required for CAN FD operation?
No-CAN FD timing uses the internal FLL or PLL clock sources derived from the 8-MHz IMO or external crystals (16–35 MHz). The datasheet specifies CAN FD bit timing accuracy meets ISO 11898-1:2015 requirements using the on-chip clock system without external crystal dependency.
CY8C6144AZI-S4F93 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz, 150MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 12b SAR, Sigma-Delta; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6144AZI-S4F93 FAQ
1.How can I place an order for CY8C6144AZI-S4F93 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6144AZI-S4F93 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6144AZI-S4F93 reliable?
The price and inventory of CY8C6144AZI-S4F93 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6144AZI-S4F93 is usually 5 days.
3.What payment methods are accepted for CY8C6144AZI-S4F93?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6144AZI-S4F93 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6144AZI-S4F93?
CY8C6144AZI-S4F93 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6144AZI-S4F93 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6144AZI-S4F93?
For technical support, including CY8C6144AZI-S4F93 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6144AZI-S4F93 requirements.
6.How does Aetrix verify that CY8C6144AZI-S4F93 is sourced from the original manufacturer or authorized distributors?
All CY8C6144AZI-S4F93 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6144AZI-S4F93 meets industry standards.
7.What is the process for return or replacement of CY8C6144AZI-S4F93?
All CY8C6144AZI-S4F93 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6144AZI-S4F93, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6144AZI-S4F93 part is unused and in its original packaging.
Return procedure for CY8C6144AZI-S4F93:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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