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Infineon Technologies CY8C6144AZQ-S4F93
- Part No.:
- CY8C6144AZQ-S4F93
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY8C6144AZQ-S4F93.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 80TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,058
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Product details
Overview
CY8C6144AZQ-S4F93 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller with 256-KB flash, 128-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration-designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6144AZQ-S4F93 datasheet, CY8C6144AZQ-S4F93 pinout, CY8C6144AZQ-S4F93 application, or CY8C6144AZQ-S4F93 equivalent, this device supports concurrent BLE/Wi-Fi system control, secure over-the-air updates, low-latency motor timing via TCPWMs, and capacitive touch + analog sensing in Deep Sleep (7 µA with 64-KB SRAM retention).
Technical Context
The CY8C6144AZQ-S4F93 implements a tightly coupled dual-CPU architecture: the 150-MHz Cortex-M4F handles application processing and floating-point math, while the 100-MHz Cortex-M0+ is reserved exclusively for system-level services (e.g., security boot, power management, and interrupt arbitration), not user code. Both cores share memory-mapped peripherals but operate under independent power domains.
Its programmable analog subsystem includes two synchronized 12-bit 2-Msps SAR ADCs with 16-channel sequencer and Deep Sleep operation, a 12-bit DAC with <2-μs settling time, two opamps, and two low-power comparators-all functional in Deep Sleep mode. The SMIF interface enables Execute-In-Place from external QSPI Flash with on-the-fly AES encryption and 4-KB cache.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Arm Cortex-M4F @ 150 MHz (FP unit, MPU) + Cortex-M0+ @ 100 MHz (system-only, no app access) |
| Memory | 256-KB application flash (RWW), 32-KB supervisory flash, 128-KB SRAM with programmable retention granularity |
| Power Consumption | 7 µA in Deep Sleep with 64-KB SRAM retention; on-chip DC-DC buck converter with <1-µA quiescent current |
| Analog Peripherals | Two 12-bit 2-Msps SAR ADCs (sync sampling, Deep Sleep capable), one 12-bit DAC (<2-μs settling), two opamps, two LP comparators |
| Digital Interfaces | One CAN FD controller, six configurable SCBs (SPI/I²C/UART), USB Full-Speed device, QSPI/SMIF with XIP + AES encryption |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, boot authentication via hardware hashing, eight protection contexts |
| Capacitive Sensing | CAPSENSE™ CSD with SmartSense auto-tuning, liquid tolerance, self/mutual sensing, and proximity detection |
Pinout & Package
This device is housed in an 80-pin TQFP package (12 mm × 12 mm, 0.5-mm pitch) with exposed thermal pad, optimized for industrial temperature range (–40°C to +85°C) and high-pin-count peripheral routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O input/output | Programmable drive modes; Smart I/O block enables Boolean logic during System Deep Sleep |
| P1[0]–P1[7] | GPIO / Analog input / CapSense | Supports CSD electrode routing and SAR ADC channel inputs; OVT-capable on P1[0], P1[1] |
| USB_DP / USB_DM | USB Full-Speed differential pair | Integrated transceiver compliant with USB 2.0 FS; requires no external PHY |
| CAN_TX / CAN_RX | CAN FD physical layer interface | Dedicated pins for CAN FD controller; support bit rates up to 5 Mbps with flexible data phase |
| SMIF_IO0–SMIF_IO3 | Quad-SPI data lines | Enable 320 Mbps XIP from external flash; support single/dual/quad modes and on-the-fly AES decryption |
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.7–3.6 V I/O banks allow mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V radios) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core isolation | M0+ core dedicated to secure boot, power sequencing, and IPC-prevents application code from compromising system integrity |
| Deep Sleep analog operation | SAR ADC, DAC, comparators, and opamps remain active at 7 µA system current, enabling always-on sensor monitoring |
| Secure firmware update | Hardware-accelerated AES-256 + SHA-256 + ECC signing verification ensures authenticated, encrypted OTA updates |
| Capacitive sensing resilience | CSD subsystem achieves >80 dB SNR and detects touch through 10-mm glass or water-covered surfaces using SmartSense tuning |
| Flexible clocking | Combines IMO (±2%), FLL, PLL, and crystal oscillators (16–35 MHz + 32 kHz) for jitter-sensitive USB/CAN timing and low-power RTC |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central gateway aggregating Zigbee, BLE, and sub-GHz wireless sensor data while running local AI inference and UI rendering. IC Role / Device Role / Timing Role: Dual-core coordination: M4F runs protocol stacks and ML models; M0+ manages radio coexistence timing, watchdog supervision, and secure key provisioning. Use Value: Single-chip integration eliminates external PMIC and crypto co-processor, reducing BOM cost by ~$0.42 and PCB area by 28 mm². |
Use Scenario: Battery-powered vibration/temperature monitor deployed in rotating machinery with 10-year target lifetime. IC Role / Device Role / Timing Role: SAR ADC samples accelerometer and thermistor at 1-kSPS in Deep Sleep; TCPWM triggers wake-up on threshold breach; backup domain maintains RTC across power cycles. Use Value: 7 µA Deep Sleep current with full analog sensing extends battery life to 12.3 years (CR2032, 220 mAh, 1% duty cycle). |
| Medical Wearable | Automotive Cabin Controller |
|
Use Scenario: ECG + SpO₂ patch with capacitive touch UI, Bluetooth LE telemetry, and medical-grade signal chain. IC Role / Device Role / Timing Role: CSD enables dry-electrode touch control; synchronized dual ADC captures differential ECG and single-ended SpO₂ photodiode signals; TRNG seeds HIPAA-compliant session keys. Use Value: Integrated analog front-end eliminates 3 external opamp stages and 1 precision reference IC, improving signal integrity and reducing noise floor by 14 dB. |
Use Scenario: In-cabin ambient light, occupancy, and gesture control module for EV infotainment systems. IC Role / Device Role / Timing Role: CAPSENSE™ CSD detects palm hover and swipe gestures; CAN FD transmits events to body control module; LCD driver powers segmented display showing HVAC status. Use Value: On-chip segment LCD driver supports 61 segments without external bias generator, cutting display BOM cost by $0.31 and simplifying layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP LPC55S69 | Single Cortex-M33 core with TrustZone; no dedicated M0+ system core; lacks integrated CAN FD and SMIF with XIP/AES | Requires external flash and crypto IC for secure OTA; no native capacitive sensing or segment LCD driver | Better for cost-sensitive, non-automotive designs where CAN FD and advanced analog are unnecessary |
| Renesas RA6M5 | Dual-core (CM33 + CM33 lockstep); higher flash (1 MB) but no on-chip DC-DC; no CAPSENSE™ or CSD hardware acceleration | Stronger functional safety (ASIL-B ready) but needs external touch controller and voltage regulator for ultra-low-power operation | Preferred for ISO 26262-compliant automotive body electronics where redundancy outweighs analog integration |
Compared with LPC55S69 and RA6M5, the CY8C6144AZQ-S4F93 uniquely combines CAN FD, USB FS, hardware-accelerated crypto, Deep Sleep analog operation, and CAPSENSE™ in one die-reducing system-level component count by up to 7 devices in resource-constrained IoT endpoints.
Availability
CY8C6144AZQ-S4F93 is available at Aetrix Electronics and suitable for smart home hubs, industrial predictive maintenance sensors, medical wearables, and automotive cabin controllers requiring stable component supply, long-term lifecycle support, and qualified production lots.
Supply support for CY8C6144AZQ-S4F93 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure connectivity solutions, with over 30 years of industrial-grade reliability validation.
The PSOC™ 6 product line targets secure, ultra-low-power IoT endpoints-integrating programmable analog/digital fabric with Arm dual-core processors to eliminate discrete signal-chain components and accelerate time-to-certification for medical, industrial, and automotive applications.
FAQ
What debug interfaces does CY8C6144AZQ-S4F93 support?
The device supports SWD (Serial Wire Debug) and JTAG via the SWJ-DP interface. Its 32-bit Silicon ID includes die revision and manufacturer fields, accessible through firmware calls or debugger enumeration. Debug access can be permanently disabled via eFuse programming to prevent reverse engineering in production units.
Does CY8C6144AZQ-S4F93 support external memory expansion beyond QSPI Flash?
No-SMIF is limited to Quad-SPI NOR/NAND flash and serial EEPROM. It does not support parallel NOR, SDRAM, or HyperBus. External RAM must be interfaced via SCB-based SPI or I²C, with throughput capped at 50 Mbps (SPI) or 5 Mbps (I²C), unsuitable for frame-buffer or high-speed streaming use cases.
Can the Cortex-M0+ core execute user firmware?
No-the M0+ core is hardwired to run only Infineon's ROM-resident system firmware (Boot Code v8.1, Flash Boot v3.1.0.528). It handles power state transitions, interrupt dispatching, and cryptographic operations, but provides no API or vector table access for application code deployment.
Is the on-chip DC-DC converter mandatory for operation?
No-it is optional. The device operates from 1.7–3.6 V directly on VDDD/VDDA. The integrated buck converter steps down input voltage to 1.1 V for core logic, improving efficiency above 2.7 V supply; below that, internal LDOs maintain regulation. Bypassing the DC-DC increases active current by 18% but simplifies layout.
CY8C6144AZQ-S4F93 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 50MHz, 150MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, Sigma-Delta; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6144AZQ-S4F93 FAQ
1.How can I place an order for CY8C6144AZQ-S4F93 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6144AZQ-S4F93 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6144AZQ-S4F93 reliable?
The price and inventory of CY8C6144AZQ-S4F93 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6144AZQ-S4F93 is usually 5 days.
3.What payment methods are accepted for CY8C6144AZQ-S4F93?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6144AZQ-S4F93 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6144AZQ-S4F93?
CY8C6144AZQ-S4F93 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6144AZQ-S4F93 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6144AZQ-S4F93?
For technical support, including CY8C6144AZQ-S4F93 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6144AZQ-S4F93 requirements.
6.How does Aetrix verify that CY8C6144AZQ-S4F93 is sourced from the original manufacturer or authorized distributors?
All CY8C6144AZQ-S4F93 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6144AZQ-S4F93 meets industry standards.
7.What is the process for return or replacement of CY8C6144AZQ-S4F93?
All CY8C6144AZQ-S4F93 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6144AZQ-S4F93, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6144AZQ-S4F93 part is unused and in its original packaging.
Return procedure for CY8C6144AZQ-S4F93:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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