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Infineon Technologies CY8C6145AZI-S3F12

Part No.:
CY8C6145AZI-S3F12
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C6145AZI-S3F12.pdf
Description:
IC MCU 32BIT 512KB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:787

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Product details

Overview

CY8C6145AZI-S3F12 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU optimized for secure, ultra-low-power IoT edge nodes. It integrates 512 KB flash, 256 KB SRAM, hardware cryptography acceleration, CAN FD, USB Full-Speed, and CAPSENSE™ capacitive sensing-enabling battery-powered smart sensors and connected industrial controllers operating from 1.7–3.6 V.

For engineers reviewing the CY8C6145AZI-S3F12 datasheet, CY8C6145AZI-S3F12 pinout, CY8C6145AZI-S3F12 application, or CY8C6145AZI-S3F12 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), Deep Sleep current (7 µA with 64 KB SRAM retention), integrated CAN FD + USB, and hardware TRNG/secure boot support.

Technical Context

The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles application processing and real-time control, while the Cortex-M0+ manages system-level functions including security services and peripheral offload-core logic operates at either 0.9 V or 1.1 V to optimize active-mode efficiency. Its clock system combines an 8-MHz IMO (±2%), 32-kHz ILO, PLL/FLL frequency multipliers, and integer/fractional dividers to deliver precise timing across mixed-voltage domains.

Security is embedded at silicon level: ROM-based secure boot with hardware SHA-256 hashing, eight configurable protection contexts, debug/test ingress disablement, and dedicated crypto accelerator supporting AES-128/256, ECC, RSA, and true random number generation via TRNG.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with MPU and separate flash caches
Memory 512-KB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 256-KB SRAM with programmable retention
Power Efficiency 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9-V M4 core
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer), two Deep Sleep-capable comparators, on-die temperature sensor
Digital Interfaces Seven SCBs (SPI/I²C/UART), one Deep Sleep SCB, USB Full-Speed device, CAN FD controller, QSPI/SMIF with XIP & encryption
Capacitive Sensing CAPSENSE™ CSD subsystem with SmartSense auto-tuning, liquid tolerance, and self/mutual sensing support
Security Features Hardware crypto accelerator (AES/ECC/RSA/SHA), TRNG, secure boot with eFuse-based authentication, eight protection contexts

Pinout & Package

This device is packaged in a 100-pin TQFP (Thin Quad Flat Package) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports enabling Boolean logic during Deep Sleep.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO Bank 0 Programmable drive modes, slew rates, and Deep Sleep wake capability; supports Smart I/O Boolean operations
P1[0]–P1[7] GPIO Bank 1 Includes two OVT pins (P1[0], P1[1]) tolerant to 5.5 V in 1.8-V operation; configurable as analog inputs or digital interfaces
USB_DP / USB_DM USB Full-Speed Interface Differential pair compliant with USB 2.0 specification; requires external 1.5-kΩ pull-up on DP for device enumeration
CAN_TX / CAN_RX CAN FD Transceiver Interface Direct connection to external CAN transceiver; supports bit rates up to 5 Mbps with flexible data phase timing
VDDIO0 / VDDIO1 I/O Power Supplies Independent 1.7–3.6-V supplies per I/O bank; enables mixed-voltage interfacing with legacy peripherals
XRES External Reset Input Active-low asynchronous reset; internal pull-up; compatible with open-drain reset supervisors and push-button circuits

Key Features

Feature Design Value
Dual-Voltage Core Operation Configurable 0.9-V or 1.1-V CPU core voltage enables dynamic trade-off between performance and sub-20 µA/MHz active current
Hardware Crypto Acceleration Dedicated engine performs AES-128/256 encryption/decryption, ECDSA signing/verification, and SHA-256 hashing in <100 cycles
Deep Sleep SCB One serial communication block remains operational in Deep Sleep mode, enabling SPI/I²C wake-up without full CPU restart
Segment LCD Driver Drives up to 63 segments × 8 commons directly from SRAM buffers; operates in Deep Sleep with no CPU involvement
Smart I/O Logic Two 8-pin Smart I/O ports execute AND/OR/XOR/NOT on GPIO states autonomously during Deep Sleep, reducing wake events by >40% in sensor polling

Applications

Industrial Sensor Node Smart Home Hub

Use Scenario: Battery-powered wireless vibration/temperature node in predictive maintenance systems.

IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion algorithms on M4 while M0+ manages BLE/Wi-Fi coexistence, CAN FD gatewaying, and secure OTA updates.

Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends 2-AA battery life beyond 5 years; hardware TRNG ensures unique per-device keys for cloud enrollment.

Use Scenario: Central hub aggregating Zigbee, Matter-over-Thread, and Bluetooth LE devices in residential automation.

IC Role / Device Role / Timing Role: Acts as protocol translator and local decision engine; USB Full-Speed enables firmware recovery via PC, CAN FD connects to HVAC subsystems.

Use Value: Integrated CAPSENSE™ enables touch-sensitive status panel; hardware crypto accelerates Matter commissioning and TLS handshakes without M4 load penalty.

Medical Wearable Automotive Body Controller

Use Scenario: ECG/PPG patch requiring clinical-grade signal integrity and HIPAA-compliant data handling.

IC Role / Device Role / Timing Role: SAR ADC samples analog front-end at 2 Msps with result averaging; M4 runs real-time arrhythmia detection; M0+ enforces secure boot and memory isolation.

Use Value: On-die temperature sensor calibrates ADC offset drift; eFuse array stores device-specific cryptographic keys, preventing cloning in regulated environments.

Use Scenario: Door module managing window lift, mirror fold, and seat position memory in 12-V automotive body networks.

IC Role / Device Role / Timing Role: CAN FD interface communicates with central gateway; TCPWMs generate precise PWM for motor drivers; GPIOs handle switch debouncing and LED dimming.

Use Value: Six power modes allow microamp-level sleep during vehicle off-state; backup domain with RTC maintains timekeeping and alarm triggers without main supply.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RGV Single Cortex-M4 + Cortex-M0+; lacks CAN FD, no hardware TRNG, 256 KB flash, no CAPSENSE™ Targeted at Bluetooth LE + proprietary RF coexistence; not suitable for CAN-based industrial gateways or high-SNR touch interfaces Select when BLE stack integration and ST's ecosystem outweigh need for CAN FD, LCD driver, or advanced capacitive sensing
NXP KW45B41Z ARM Cortex-M33 + Cortex-M0+; includes IEEE 802.15.4/Bluetooth LE radio; no USB, no QSPI XIP, 128 KB flash Optimized for sub-GHz/Zigbee/Thread endpoint devices; insufficient memory and interface breadth for full-featured hubs or sensor fusion nodes Prefer for cost-sensitive, radio-centric endpoints where external flash and USB recovery are unnecessary

Compared with STM32WB55RGV and KW45B41Z, CY8C6145AZI-S3F12 uniquely combines CAN FD, USB Full-Speed, hardware-accelerated crypto, and CAPSENSE™ in a single die-enabling consolidated BOMs for industrial gateways and medical wearables requiring both wired/wireless connectivity and secure human interface.

Availability

CY8C6145AZI-S3F12 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, medical wearables, and automotive body controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY8C6145AZI-S3F12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers-with annual R&D investment exceeding €1.2 billion.

This part belongs to the PSOC™ 61 MCU product line, engineered specifically for ultra-low-power, security-critical IoT endpoints that demand concurrent wired/wireless connectivity, analog sensing fidelity, and hardware-enforced trust boundaries.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6145AZI-S3F12?

The Cortex-M4F core operates at up to 150 MHz, verified under 1.1-V core supply with ambient temperature ≤85°C. At 0.9-V core voltage, maximum frequency is reduced to 100 MHz to maintain timing closure and power efficiency-both configurations are supported in production firmware via the Power Management Unit (PMU).

Does CY8C6145AZI-S3F12 support Execute-In-Place (XIP) from external flash?

Yes-it features a Quad-SPI/Serial Memory Interface (SMIF) with hardware-accelerated XIP support, including on-the-fly AES-128 decryption and a dedicated 4-KB cache. External flash must be quad-SPI compatible and configured for single/dual/quad I/O modes; SMIF supports up to 320 Mbps throughput in quad mode.

How many protection contexts does the security subsystem provide?

The device implements eight independent protection contexts, each defining memory access permissions, peripheral enablement, and interrupt masking. These contexts are enforced by the Memory Protection Unit (MPU) and Security Configuration Registers (SCR), enabling strict isolation between secure boot, RTOS tasks, and application code-verified in Infineon's PSOC™ 6 Security Reference Manual.

Is the CAPSENSE™ subsystem capable of operating during Deep Sleep mode?

Yes-the CAPSENSE™ CSD hardware block remains fully functional in Deep Sleep mode, allowing continuous proximity or touch detection without waking the CPU. It uses the 32-kHz ILO clock and draws <1.5 µA, with results stored in dedicated SRAM sections retained during Deep Sleep.

CY8C6145AZI-S3F12 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 16x8/10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6145AZI-S3F12 FAQ

1.How can I place an order for CY8C6145AZI-S3F12 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6145AZI-S3F12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6145AZI-S3F12 reliable?

The price and inventory of CY8C6145AZI-S3F12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145AZI-S3F12 is usually 5 days.

3.What payment methods are accepted for CY8C6145AZI-S3F12?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145AZI-S3F12 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6145AZI-S3F12?

CY8C6145AZI-S3F12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6145AZI-S3F12 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6145AZI-S3F12?

For technical support, including CY8C6145AZI-S3F12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145AZI-S3F12 requirements.

6.How does Aetrix verify that CY8C6145AZI-S3F12 is sourced from the original manufacturer or authorized distributors?

All CY8C6145AZI-S3F12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145AZI-S3F12 meets industry standards.

7.What is the process for return or replacement of CY8C6145AZI-S3F12?

All CY8C6145AZI-S3F12 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145AZI-S3F12, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6145AZI-S3F12 part is unused and in its original packaging.

Return procedure for CY8C6145AZI-S3F12:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6145AZI-S3F12 Tags

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