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Infineon Technologies CY8C6145AZI-S3F42

Part No.:
CY8C6145AZI-S3F42
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C6145AZI-S3F42.pdf
Description:
IC MCU 32BIT 512KB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,949

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Product details

Overview

CY8C6145AZI-S3F42 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller designed for secure, ultra-low-power IoT edge nodes. It integrates 512 KB flash, 256 KB SRAM, hardware cryptography accelerator, CAN FD interface, and capacitive sensing (CapSense™), operating from 1.7–3.6 V with Deep Sleep current as low as 7 µA (64 KB SRAM retained).

For engineers reviewing the CY8C6145AZI-S3F42 datasheet, CY8C6145AZI-S3F42 pinout, CY8C6145AZI-S3F42 application, or CY8C6145AZI-S3F42 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC converter (<1 µA quiescent), QSPI XIP with encryption, and integrated CapSense™ with SmartSense™ auto-tuning.

Technical Context

The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles application processing at up to 150 MHz with FPU and MPU, while the Cortex-M0+ (100 MHz) is reserved exclusively for system-level functions including security boot, power management, and peripheral offload - not user application code. Both cores operate at selectable 1.1 V or 0.9 V supply voltages to optimize active current.

Its programmable analog-digital subsystem includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and a dedicated CapSense™ sigma-delta engine supporting self/mutual sensing with liquid tolerance. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), PLL/FLL, and fractional dividers for precise peripheral timing.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+ (M0+ reserved for system functions only)
Memory 512 KB flash (RWW), 256 KB SRAM (programmable retention), 1 KB OTP eFuse
Power Efficiency Deep Sleep mode: 7 µA with 64 KB SRAM retention; Active slope: 22 µA/MHz @ 0.9 V (M4)
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer, averaging), 2 LP comparators (Deep Sleep active)
Digital Interfaces 7 SCBs (SPI/I²C/UART), USB Full-Speed, CAN FD, SD/eMMC, QSPI/SMIF with XIP + AES encryption
Capacitive Sensing CapSense™ CSD engine with SmartSense™ auto-tuning, supports >63 segments, liquid-tolerant operation
Security Hardware crypto accelerator (AES, ECC, SHA), TRNG, boot authentication, 8 protection contexts

Pinout & Package

This device is packaged in a 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 pins total) enabling Boolean logic during Deep Sleep.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO3 I/O Power Supply Four independent I/O banks (1.7–3.6 V), enabling mixed-voltage interface design
VDDD / VDDA Digital/Analog Core Supply Separate 1.7–3.6 V domains; VDDA powers SAR ADC, comparators, and CapSense™
XRES Active-Low Reset Input Asynchronous reset with internal pull-up; compatible with external reset supervisors
SWDCK / SWDIO Debug Interface 2-pin SWD interface supporting programming, debug, and boundary scan (no JTAG pins exposed)
USB_DP / USB_DM USB 2.0 Full-Speed PHY Differential pair compliant with USB 2.0 specification; no external transceiver required
CAN_FD_H / CAN_FD_L CAN FD Transceiver Interface Dedicated differential pins for CAN FD physical layer; supports data rates up to 5 Mbps

Key Features

Feature Design Value
Dual-Voltage Core Operation User-selectable 1.1 V or 0.9 V core supply enables dynamic trade-off between performance (150 MHz) and ultra-low active current (22 µA/MHz)
Secure Boot & Runtime Protection Hardware-enforced authentication using SHA-256 hashing; all debug/test paths disableable; 8 configurable memory protection contexts
QSPI XIP with Encryption Execute-in-place from external quad-SPI flash with on-the-fly AES-128 decryption and 4 KB cache for low-power, high-throughput firmware execution
Smart I/O in Deep Sleep Two 8-pin Smart I/O blocks perform Boolean logic (AND/OR/XOR) on GPIO states without waking CPU - critical for battery-powered wake-on-event designs
CapSense™ with SmartSense™ Hardware-accelerated auto-tuning eliminates manual calibration; supports proximity, slider, and gesture sensing with >100:1 SNR and water rejection

Applications

Smart Home Sensor Hub Industrial Predictive Maintenance Node

Use Scenario: Battery-powered multi-sensor node aggregating temperature, humidity, motion, and touch input in HVAC controls.

IC Role / Device Role / Timing Role: Central MCU managing sensor fusion, local decision logic, CapSense™ UI, and encrypted BLE/USB reporting.

Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends 10-year battery life; Smart I/O enables wake-on-touch without CPU intervention.

Use Scenario: Vibration and thermal monitoring on rotating machinery with local FFT analysis and anomaly flagging.

IC Role / Device Role / Timing Role: Real-time signal acquisition host running M4-based DSP algorithms, with M0+ handling CAN FD telemetry transmission and watchdog supervision.

Use Value: Dual-core isolation ensures deterministic sensor processing (M4) while maintaining robust fieldbus communication (M0+), even under voltage droop.

Medical Wearable Patch Automotive Cabin Controller

Use Scenario: Disposable ECG patch with dry-electrode sensing, onboard artifact filtering, and encrypted data upload via USB.

IC Role / Device Role / Timing Role: Signal acquisition controller integrating SAR ADC, comparator-based R-wave detection, and hardware AES for HIPAA-compliant data export.

Use Value: On-chip temperature sensor calibrates ADC gain drift; TRNG seeds secure session keys for each USB transfer.

Use Scenario: Touch-enabled seat/mirror/window control module interfacing with vehicle CAN FD backbone.

IC Role / Device Role / Timing Role: Human-machine interface processor executing CapSense™ buttons/sliders while routing commands via CAN FD to body control module.

Use Value: Dedicated CAN FD block supports 5 Mbps data rate and ISO 11898-1 compliance; OVT pins tolerate 5.5 V automotive load-dump transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247FDI-D52 Same PSOC™ 62 family: adds Bluetooth LE radio, removes CAN FD; 1 MB flash, same 256 KB SRAM Better suited for wireless-connected endpoints (e.g., BLE gateways); lacks native CAN FD for vehicle bus integration Select when wireless connectivity outweighs fieldbus requirements and board space permits RF layout
STM32WB55RGV Single-core Cortex-M4 + dedicated Cortex-M0+ radio controller; 1 MB flash, 256 KB SRAM; no CapSense™ or SMIF Optimized for BLE/Wi-Fi coexistence; requires external components for capacitive touch and external flash XIP Choose for cost-sensitive, RF-centric designs where analog programmability and secure flash execution are secondary

Compared with CY8C6145AZI-S3F42, CY8C6247FDI-D52 trades CAN FD for integrated BLE and higher flash density, while STM32WB55RGV offers lower BOM cost but demands external circuitry for touch and encrypted XIP - making CY8C6145AZI-S3F42 optimal for secure, sensor-rich, wired-edge applications.

Availability

CY8C6145AZI-S3F42 is available at Aetrix Electronics and suitable for industrial predictive maintenance nodes, medical wearable patches, smart home sensor hubs, and automotive cabin controllers requiring stable component supply across extended product lifecycles.

Supply support for CY8C6145AZI-S3F42 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

This device belongs to the PSOC™ 61 MCU product line - engineered specifically for ultra-low-power, security-critical IoT edge devices requiring integrated analog programmability, hardware crypto, and deterministic real-time response.

FAQ

Is the Cortex-M0+ core available for user application code?

No. The Cortex-M0+ in CY8C6145AZI-S3F42 is reserved exclusively for system-level functions including secure boot, power management, interrupt dispatching, and peripheral offload. Application firmware must run solely on the Cortex-M4F core, which operates at up to 150 MHz with FPU and MPU support.

Does this device support execute-in-place (XIP) from external flash?

Yes. The integrated Quad-SPI/SMIF interface supports XIP from external quad-SPI flash with on-the-fly AES-128 decryption and a dedicated 4 KB cache. This enables low-power, high-speed firmware execution without loading code into internal RAM, reducing active current and memory footprint.

What is the maximum clock frequency of the CAN FD peripheral?

The CAN FD block supports data bit rates up to 5 Mbps in fast-phase mode, compliant with ISO 11898-1:2015. It uses dedicated CAN_FD_H/CAN_FD_L pins and operates independently of CPU load, with hardware message filtering and TX/RX FIFOs managed by the M0+ subsystem.

How does CapSense™ achieve liquid tolerance on this MCU?

Liquid tolerance is achieved through the dedicated CapSense™ CSD (capacitive sigma-delta) hardware engine, which uses spread-spectrum modulation, shield-driven sensing, and automatic baseline compensation. SmartSense™ firmware performs real-time tuning to reject water-induced capacitance shifts while maintaining >100:1 signal-to-noise ratio for true touch detection.

CY8C6145AZI-S3F42 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
150MHz
Connectivity:
eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, PMC, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
64
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6145AZI-S3F42 FAQ

1.How can I place an order for CY8C6145AZI-S3F42 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6145AZI-S3F42 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6145AZI-S3F42 reliable?

The price and inventory of CY8C6145AZI-S3F42 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145AZI-S3F42 is usually 5 days.

3.What payment methods are accepted for CY8C6145AZI-S3F42?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145AZI-S3F42 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6145AZI-S3F42?

CY8C6145AZI-S3F42 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6145AZI-S3F42 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6145AZI-S3F42?

For technical support, including CY8C6145AZI-S3F42 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145AZI-S3F42 requirements.

6.How does Aetrix verify that CY8C6145AZI-S3F42 is sourced from the original manufacturer or authorized distributors?

All CY8C6145AZI-S3F42 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145AZI-S3F42 meets industry standards.

7.What is the process for return or replacement of CY8C6145AZI-S3F42?

All CY8C6145AZI-S3F42 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145AZI-S3F42, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6145AZI-S3F42 part is unused and in its original packaging.

Return procedure for CY8C6145AZI-S3F42:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6145AZI-S3F42 Tags

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