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Infineon Technologies CY8C6145AZI-S3F62
- Part No.:
- CY8C6145AZI-S3F62
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C6145AZI-S3F62.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,594
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Product details
Overview
CY8C6145AZI-S3F62 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 512-KB flash, 256-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography accelerator - designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6145AZI-S3F62 datasheet, CY8C6145AZI-S3F62 pinout, CY8C6145AZI-S3F62 application, or CY8C6145AZI-S3F62 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC buck (<1 µA quiescent), Deep Sleep current (7 µA w/64-KB SRAM retention), and integrated CAPSENSE™ with SmartSense auto-tuning.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing and real-time control, while the Cortex-M0+ is reserved exclusively for system-level functions including security boot, power management, and peripheral arbitration - no application firmware runs on M0+.
Its programmable analog-digital architecture integrates a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and a dedicated CAPSENSE™ sigma-delta subsystem supporting mutual/self-capacitive sensing with liquid tolerance and hardware-accelerated SmartSense tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with separate MPUs and memory protection contexts |
| Memory | 512-KB flash (RWW), 256-KB SRAM with programmable retention granularity, 1-Kb OTP eFuse array |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9-V M4 core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), 2 low-power comparators (Deep Sleep active) |
| Communication | 7 configurable SCBs (SPI/I2C/UART), 1 Deep Sleep SCB, USB Full-Speed device, CAN FD block, QSPI/SMIF with XIP & AES encryption |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, boot authentication via hardware hashing, 8 protection contexts |
| Capacitive Sensing | CAPSENSE™ CSD subsystem with dynamic self/mutual sensing, liquid tolerance, and automatic SmartSense hardware tuning |
Pinout & Package
This device is packaged in a 100-pin TQFP (14 mm × 14 mm, 0.5-mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 I/Os total) enabling Boolean logic during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O Port 0 | Supports combinational logic (AND/OR/XOR) in Deep Sleep; programmable drive strength/slew rate |
| P1[0]–P1[7] | GPIO / Smart I/O Port 1 | Same Smart I/O capability as Port 0; enables wake-on-event with minimal power overhead |
| USB_DP / USB_DM | USB Full-Speed Interface | Differential pair compliant with USB 2.0 FS signaling; internal termination and PHY support |
| CAN_TX / CAN_RX | CAN FD Physical Layer Interface | Direct connection to external CAN transceiver; supports bit rates up to 5 Mbps with FD frame format |
| VDDIO0–VDDIO3 | I/O Power Domains | Four independent 1.7–3.6-V I/O supply rails enabling mixed-voltage interface operation |
| VDDD / VDDA | Digital & Analog Core Supplies | Separate 1.7–3.6-V supplies for digital logic and precision analog subsystems |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | User-selectable 1.1-V or 0.9-V CPU core voltage - enables trade-off between performance (150 MHz M4 @ 1.1 V) and ultra-low-power operation (22 µA/MHz @ 0.9 V) |
| On-Chip DC-DC Buck Converter | Integrated regulator with <1 µA quiescent current - eliminates need for external PMIC in battery-powered designs |
| Segment LCD Driver | Supports up to 63 segments × 8 commons with operation in Deep Sleep mode - enables always-on display in wearables and HMI |
| Hardware Crypto Acceleration | Dedicated engine for AES-128/256, ECC (NIST P-256), SHA-256, and TRNG - offloads CPU and ensures deterministic timing for secure OTA updates |
| SmartSense Auto-Tuning | Fully hardware-managed CAPSENSE™ calibration - eliminates manual tuning across temperature/humidity and enables production-line zero-touch setup |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central controller aggregating Zigbee, BLE, and Thread devices while running local AI inference and secure cloud sync. IC Role / Device Role / Timing Role: Dual-core real-time coordinator: M4 executes protocol stacks and ML models; M0+ manages secure boot, crypto, and low-power scheduling. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention enables multi-week battery life; integrated CAN FD supports legacy building automation integration. |
Use Scenario: Battery-powered vibration/temperature node deployed in rotating machinery with wireless telemetry and predictive maintenance triggers. IC Role / Device Role / Timing Role: Edge signal processor: SAR ADC samples at 2 Msps with hardware averaging; TCPWMs generate precise PWM excitation for piezo sensors. Use Value: On-chip DC-DC buck extends battery life by >3× vs. LDO-based solutions; CAPSENSE™ detects housing micro-fractures via proximity shift. |
| Wearable Health Monitor | Automotive Cabin Controller |
|
Use Scenario: Optical heart-rate and SpO₂ monitor with capacitive touch UI, ECG front-end, and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: Mixed-signal hub: CAPSENSE™ drives touch buttons and proximity wake; SAR ADC digitizes analog ECG path with 16-channel sequencing. Use Value: SmartSense auto-tuning maintains button reliability across sweat and skin impedance variation; 2-Msps ADC enables high-fidelity waveform capture. |
Use Scenario: In-cabin ambient lighting and HVAC control panel with touch sliders, RGB LED drivers, and LIN/CAN gateway functionality. IC Role / Device Role / Timing Role: Human-machine interface processor: Smart I/O ports implement touch slider logic in Deep Sleep; CAN FD handles body control module communication. Use Value: Two OVT pins tolerate 12-V automotive transients; segment LCD driver powers dashboard displays without external bias generator. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FDI-D52 | Higher flash (1-MB), no CAN FD, adds Ethernet MAC; same dual-core architecture and CAPSENSE™ | Better suited for wired industrial gateways requiring network stack offload, not CAN-based vehicle networks | Select when Ethernet connectivity and larger code space outweigh CAN FD requirement |
| STM32H743VI | Single Cortex-M7 core (480 MHz), no integrated CAPSENSE™ or Smart I/O; external crypto IC needed for full security | Targeted at high-throughput motor control or vision preprocessing - lacks ultra-low-power Deep Sleep and capacitive sensing integration | Choose only if raw M7 compute throughput >150 DMIPS is mandatory and external component count is acceptable |
Compared with CY8C6145AZI-S3F62, CY8C6247FDI-D52 trades CAN FD for Ethernet and flash headroom, while STM32H743VI delivers higher single-core speed but requires external components to match PSOC™ 61's integrated low-power sensing, security, and mixed-signal flexibility.
Availability
CY8C6145AZI-S3F62 is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, wearable health monitors, and automotive cabin controllers requiring stable component supply, long-term lifecycle assurance, and qualified traceable sourcing.
Supply support for CY8C6145AZI-S3F62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and automotive ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This part belongs to the PSOC™ 61 MCU product line - engineered specifically for secure, battery-operated IoT endpoints demanding concurrent wireless connectivity, capacitive HMI, and cryptographic integrity without external components.
FAQ
Is the Cortex-M0+ core accessible for user application code?
No. The Cortex-M0+ in CY8C6145AZI-S3F62 is reserved exclusively for system-level functions including secure boot, power management, and peripheral arbitration. Application firmware must run solely on the Cortex-M4F core, which is fully programmable with MPU and FPU support.
Does this device support Execute-In-Place (XIP) from external flash?
Yes. The integrated Quad-SPI/SMIF interface supports XIP from external quad SPI flash with on-the-fly AES-128 decryption and a dedicated 4-KB cache, enabling secure code execution without loading into internal RAM - critical for memory-constrained edge AI deployments.
What is the maximum operating frequency of the CAN FD interface?
The integrated CAN FD block supports data bit rates up to 5 Mbps in FD mode and 1 Mbps in classical CAN mode. It complies with ISO 11898-1:2015 and supports flexible data-length frames (up to 64 bytes), CRC-17, and bit-rate switching.
How does the SmartSense feature simplify capacitive touch design?
SmartSense performs full hardware-based CAPSENSE™ calibration - automatically adjusting IDACs, scanning parameters, and noise thresholds across temperature, humidity, and PCB aging. This eliminates manual tuning, reduces qualification time, and ensures consistent button response without firmware intervention.
CY8C6145AZI-S3F62 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, LCD, POR, PWM, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6145AZI-S3F62 FAQ
1.How can I place an order for CY8C6145AZI-S3F62 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6145AZI-S3F62 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6145AZI-S3F62 reliable?
The price and inventory of CY8C6145AZI-S3F62 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145AZI-S3F62 is usually 5 days.
3.What payment methods are accepted for CY8C6145AZI-S3F62?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145AZI-S3F62 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6145AZI-S3F62?
CY8C6145AZI-S3F62 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6145AZI-S3F62 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6145AZI-S3F62?
For technical support, including CY8C6145AZI-S3F62 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145AZI-S3F62 requirements.
6.How does Aetrix verify that CY8C6145AZI-S3F62 is sourced from the original manufacturer or authorized distributors?
All CY8C6145AZI-S3F62 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145AZI-S3F62 meets industry standards.
7.What is the process for return or replacement of CY8C6145AZI-S3F62?
All CY8C6145AZI-S3F62 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145AZI-S3F62, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6145AZI-S3F62 part is unused and in its original packaging.
Return procedure for CY8C6145AZI-S3F62:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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