Infineon Technologies CY8C6145AZI-S3F72
- Part No.:
- CY8C6145AZI-S3F72
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C6145AZI-S3F72.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,813
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Product details
Overview
CY8C6145AZI-S3F72 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU optimized for secure, ultra-low-power IoT edge nodes. It integrates 512 KB flash, 256 KB SRAM, hardware cryptography accelerator, CAN FD, USB Full-Speed, and CAPSENSE™ capacitive sensing-enabling battery-powered smart sensors and industrial controllers with <7 µA Deep Sleep current and 150 MHz M4F performance.
For engineers reviewing the CY8C6145AZI-S3F72 datasheet, CY8C6145AZI-S3F72 pinout, CY8C6145AZI-S3F72 application, or CY8C6145AZI-S3F72 equivalent, key selection criteria include dual-CPU power management (22 µA/MHz @ 0.9 V), on-chip DC-DC buck (<1 µA quiescent), QSPI XIP with hardware encryption, and 64 GPIOs with Smart I/O Boolean logic in Deep Sleep.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles application processing and real-time control while the Cortex-M0+ manages system-level functions including security boot, power mode transitions, and peripheral arbitration-without user application access. Memory subsystem includes RWW flash with two 8-KB CPU-specific caches and programmable SRAM retention granularity down to 64 KB.
Clocking combines an 8-MHz IMO (±2%), 32-kHz ILO, PLL/FLL frequency synthesis, and integer/fractional dividers to feed independent clock domains for CPU, analog, and digital peripherals. The SMIF supports quad-SPI XIP with 4-KB cache and on-the-fly AES-128 decryption, enabling secure external code execution at up to 320 Mbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with MPU and single-cycle multiply |
| Memory | 512-KB flash (RWW), 256-KB SRAM with retention control, 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz active current @ 0.9 V core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 low-power comparators, integrated temp sensor |
| Digital Interfaces | 7 SCBs (SPI/I2C/UART), USB FS device, CAN FD, SD/eMMC controller, QSPI/SMIF with XIP & AES |
| Capacitive Sensing | CAPSENSE™ CSD with SmartSense auto-tuning, liquid tolerance, and self/mutual sensing support |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, boot authentication, 8 protection contexts |
Pinout & Package
This device is packaged in a 72-pin TQFP (10 × 10 mm, 0.5 mm pitch) with 64 general-purpose I/Os, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 pins total) supporting Boolean logic in Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O Port 0 | Supports Boolean operations (AND/OR/XOR) during Deep Sleep; configurable drive strength/slew |
| P1[0]–P1[7] | GPIO / Smart I/O Port 1 | Same Smart I/O capability as Port 0; enables wake-on-event logic without CPU wake-up |
| P12[0]–P12[3] | OVT Pins | Withstand up to 5.5 V input while core operates at 1.7–3.6 V; suitable for legacy interface bridging |
| USB_DP / USB_DM | USB Full-Speed Interface | Differential pair compliant with USB 2.0 FS signaling; internal PHY with suspend/resume detection |
| CAN_TX / CAN_RX | CAN FD Transceiver Interface | Direct connection to external CAN transceiver; supports ISO 11898-1:2015 FD frames up to 5 Mbps |
| QSPI_SCK / QSPI_SS / QSPI_IO0–IO3 | Quad-SPI Interface | Configurable for single/dual/quad mode; enables secure XIP from external flash with hardware AES |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | User-selectable 1.1 V (40 µA/MHz M4F) or 0.9 V (22 µA/MHz M4F) for dynamic power/performance trade-off |
| Secure Boot & Runtime Protection | Hardware-based hash verification at boot; debug/test paths disableable; eight memory protection contexts |
| Smart I/O in Deep Sleep | Two 8-pin Smart I/O ports execute Boolean logic autonomously-no CPU wake required for sensor event filtering |
| Integrated DC-DC Buck Converter | On-chip regulator with <1 µA quiescent current; eliminates external PMIC for single-supply battery systems |
| CAPSENSE™ CSD Performance | Best-in-class SNR >100 dB, liquid-tolerant operation, and automatic SmartSense tuning reduce firmware calibration effort |
Applications
| Industrial Sensor Node | Smart Home Hub |
|---|---|
Use Scenario: Battery-powered wireless temperature/humidity/pressure node with BLE gateway interface. IC Role / Device Role / Timing Role: Main application processor and sensor interface hub; manages CAPSENSE™ buttons, ADC sampling, CAN FD fieldbus comms, and secure OTA updates. Use Value: 7 µA Deep Sleep extends 2-AA battery life beyond 5 years; Smart I/O filters motion events before waking M4F core. |
Use Scenario: Centralized home automation controller aggregating Zigbee, Matter-over-Thread, and local touch UI. IC Role / Device Role / Timing Role: Dual-core coordinator: M4F runs Matter stack and USB host for dongles; M0+ handles CAPSENSE™ touch panel and real-time power monitoring. Use Value: On-chip crypto accelerator enables TLS 1.3 handshake in <100 ms; QSPI XIP reduces external memory BOM cost by 30%. |
| Medical Wearable | Automotive Body Control Module |
Use Scenario: ECG patch with dry-electrode sensing, motion compensation, and encrypted Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Signal acquisition engine: SAR ADC samples at 2 Msps with averaging; CAPSENSE™ detects electrode contact; crypto block encrypts data pre-transmission. Use Value: Integrated temp sensor calibrates ADC offset drift; 0.9 V core mode cuts active power by 45% vs. 1.1 V during signal processing bursts. |
Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN/CAN FD diagnostics. IC Role / Device Role / Timing Role: Real-time safety-critical controller: TCPWMs generate precise PWM for motor drives; CAN FD reports fault codes; watchdog timers enforce ASIL-B timing constraints. Use Value: Three DMA controllers offload ADC, CAN, and PWM data movement-freeing M4F for diagnostic algorithms and reducing jitter below 1 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55RGV | Single Cortex-M4 + Cortex-M0+; no on-chip DC-DC; 256 KB flash; lacks CAN FD and QSPI XIP | Targeted at BLE-centric IoT; limited for CAN-based industrial or automotive use cases | Choose when BLE coexistence and RF certification priority outweigh CAN FD and external flash security needs |
| RA6M5GFP | Single Cortex-M33 (100 MHz); 1 MB flash; TrustZone but no hardware crypto accelerator; no CAPSENSE™ | Better for high-code-footprint industrial HMI; weaker for ultra-low-power capacitive UI or secure sensor edge | Prefer for deterministic RTOS workloads requiring large flash and memory safety, not for battery-constrained touch/sensing nodes |
Compared with STM32WB55RGV and RA6M5GFP, CY8C6145AZI-S3F72 uniquely delivers CAN FD + QSPI XIP + CAPSENSE™ + sub-7-µA Deep Sleep in one die-making it optimal for secure, sensor-rich, battery-operated edge controllers where mixed-signal integration and autonomous low-power logic reduce system-level component count.
Availability
CY8C6145AZI-S3F72 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, medical wearables, and automotive body control modules requiring stable component supply across multi-year production cycles.
Supply support for CY8C6145AZI-S3F72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers-with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.
This part belongs to the PSOC™ 61 MCU product line, engineered specifically for secure, ultra-low-power IoT endpoints that demand integrated analog, programmable logic, and hardware-enforced trust-targeting battery-operated edge intelligence in industrial, medical, and consumer domains.
FAQ
Does CY8C6145AZI-S3F72 support JTAG debugging?
Yes-it features a SWJ-DP (Serial Wire JTAG Debug Port) with full ARM CoreSight support, enabling real-time trace, breakpoint debugging, and memory inspection for both Cortex-M4F and Cortex-M0+ cores. The 32-bit Silicon ID is accessible via SWJ, with die revision encoded in the MSB and manufacturer ID "069" in the LSBs.
What is the maximum operating frequency of the QSPI interface?
The QSPI interface supports up to 320 Mbps throughput in quad mode, achieved using a 80-MHz SMIF clock derived from the PLL. This enables zero-wait-state XIP from external flash and meets timing requirements for real-time firmware execution in resource-constrained edge devices.
Can the CAPSENSE™ subsystem operate during Deep Sleep mode?
Yes-CAPSENSE™ CSD hardware runs autonomously in Deep Sleep mode using the 32-kHz ILO clock, detecting touch or proximity events and generating interrupts without waking the CPU. SmartSense auto-tuning remains active, maintaining accuracy across temperature and humidity variations.
Is the on-chip DC-DC converter mandatory for operation?
No-the device supports direct LDO operation from 1.7–3.6 V, but the integrated DC-DC buck is recommended for battery-powered designs: it delivers >85% efficiency at 10–100 mA loads and reduces quiescent current to <1 µA, extending runtime significantly versus external regulators.
CY8C6145AZI-S3F72 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6145AZI-S3F72 FAQ
1.How can I place an order for CY8C6145AZI-S3F72 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6145AZI-S3F72 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6145AZI-S3F72 reliable?
The price and inventory of CY8C6145AZI-S3F72 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145AZI-S3F72 is usually 5 days.
3.What payment methods are accepted for CY8C6145AZI-S3F72?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145AZI-S3F72 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6145AZI-S3F72?
CY8C6145AZI-S3F72 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6145AZI-S3F72 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6145AZI-S3F72?
For technical support, including CY8C6145AZI-S3F72 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145AZI-S3F72 requirements.
6.How does Aetrix verify that CY8C6145AZI-S3F72 is sourced from the original manufacturer or authorized distributors?
All CY8C6145AZI-S3F72 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145AZI-S3F72 meets industry standards.
7.What is the process for return or replacement of CY8C6145AZI-S3F72?
All CY8C6145AZI-S3F72 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145AZI-S3F72, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6145AZI-S3F72 part is unused and in its original packaging.
Return procedure for CY8C6145AZI-S3F72:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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