Infineon Technologies CY8C6145FNI-S3F11T
- Part No.:
- CY8C6145FNI-S3F11T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 49-XBGA, WLCSP
- Datasheet:
-
CY8C6145FNI-S3F11T.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 49WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C6145FNI-S3F11T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller designed for secure, ultra-low-power IoT edge nodes. It integrates 512 KB flash, 256 KB SRAM, hardware cryptography acceleration, CAN FD, USB Full-Speed, and CAPSENSE™ capacitive sensing-enabling battery-operated smart sensors and connected industrial controllers.
For engineers reviewing the CY8C6145FNI-S3F11T datasheet, CY8C6145FNI-S3F11T pinout, CY8C6145FNI-S3F11T application, or CY8C6145FNI-S3F11T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), Deep Sleep current (7 µA with 64 KB SRAM retention), integrated CAN FD + USB, and hardware TRNG/secure boot architecture.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing at up to 150 MHz while the Cortex-M0+ (100 MHz) manages system-level tasks including security services and peripheral offload-its firmware access restricted per platform policy. Memory coherency is maintained via shared bus matrix and three DMA controllers.
Its programmable analog-digital fabric includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and CAPSENSE™ CSD with SmartSense auto-tuning. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), PLL/FLL, and fractional dividers for precise peripheral timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, with separate MPUs and core-voltage selection (0.9 V / 1.1 V) |
| Memory | 512-KB flash (RWW), 256-KB SRAM (programmable retention), 32-KB AUXflash, 32-KB SFlash, 1-Kb OTP eFuse |
| Power Efficiency | Deep Sleep mode draws 7 µA with 64-KB SRAM retention; active slope as low as 22 µA/MHz (M4 @ 0.9 V) |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), 2x low-power comparators, built-in temperature sensor |
| Digital Interfaces | 7 configurable SCBs (SPI/I²C/UART), 1 Deep Sleep SCB, USB Full-Speed device, CAN FD controller, SD/eMMC host, QSPI/SMIF with XIP & on-the-fly encryption |
| Security | Hardware crypto accelerator (AES-128/256, SHA-256, ECC), TRNG, secure boot with hardware hashing, 8 protection contexts |
| Capacitive Sensing | CAPSENSE™ CSD subsystem with liquid tolerance, proximity support, self/mutual sensing, and SmartSense auto-tuning |
Pinout & Package
This device is housed in a 100-pin TQFP package (14 × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 total I/Os) supporting Boolean logic during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Bank 0 | Programmable drive modes, slew rates; supports Smart I/O Boolean operations in Deep Sleep |
| P1[0]–P1[7] | GPIO Bank 1 | Includes two OVT pins (P1[0], P1[1]) tolerant to 5.5 V in 1.7–3.6 V operation |
| USB_DP / USB_DM | USB Full-Speed Interface | Dedicated differential pair for USB 2.0 Full-Speed device operation (12 Mbps) |
| CAN_TX / CAN_RX | CAN FD Transceiver Interface | Direct connection to external CAN transceiver; supports ISO 11898-1:2015 FD frames up to 5 Mbps |
| QSPI_SCK / QSPI_SS / QSPI_IO0–IO3 | Quad-SPI Memory Interface | Enables Execute-In-Place from external flash with 4-KB cache and hardware encryption/decryption |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | Selectable 0.9 V or 1.1 V CPU supply enables dynamic trade-off between performance (150 MHz M4) and ultra-low active current (22 µA/MHz) |
| Hardware Crypto Acceleration | Dedicated engine for AES-128/256, SHA-256, ECC-256, and TRNG-offloads encryption from CPU and ensures deterministic latency |
| Deep Sleep SCB | One serial communication block remains active in Deep Sleep mode, enabling SPI/I²C wake-up and sensor data polling without CPU wake-up |
| Smart I/O Logic | Two 4-bit Smart I/O ports perform Boolean operations (AND/OR/XOR) on GPIO signals autonomously during Deep Sleep-reducing wake events |
| CAPSENSE™ SmartSense | Fully hardware-tuned capacitive sensing eliminates manual calibration; maintains SNR > 100 dB in wet environments and supports proximity detection |
Applications
| Industrial Sensor Node | Smart Home Hub |
|---|---|
Use Scenario: Battery-powered wireless vibration/temperature node in predictive maintenance systems. IC Role / Device Role / Timing Role: Dual-core MCU performs real-time FFT analysis (M4), manages BLE/Wi-Fi coexistence (M0+), and schedules Deep Sleep wake-ups via TCPWM-triggered ADC sampling. Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends 2-AA battery life beyond 5 years; CAPSENSE™ detects enclosure tampering without added components. |
Use Scenario: Central hub aggregating Zigbee, Matter-over-Thread, and Bluetooth LE devices in residential automation. IC Role / Device Role / Timing Role: M4 runs Matter SDK stack and local decision logic; M0+ handles secure boot, crypto offload, and USB CDC bridge for PC configuration. Use Value: Integrated USB Full-Speed + CAN FD enables wired commissioning and legacy appliance integration; hardware TRNG satisfies NIST SP 800-90B entropy requirements. |
| Medical Wearable | Automotive Body Controller |
Use Scenario: ECG patch with dry-electrode sensing, motion compensation, and encrypted cloud upload. IC Role / Device Role / Timing Role: SAR ADC samples analog front-end at 2 Msps; CAPSENSE™ monitors electrode-skin contact quality; crypto engine encrypts data pre-transmission. Use Value: 12-bit ADC with 16-channel sequencer and result averaging achieves <1 µV RMS noise; SmartSense auto-calibrates for varying skin impedance. |
Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN/CAN FD gateway functionality. IC Role / Device Role / Timing Role: CAN FD block handles high-speed body bus messaging (≤5 Mbps); TCPWMs generate precise PWM for LED dimming and motor control; GPIOs drive relays and sense switches. Use Value: Dual-core isolation allows safety-critical CAN FD handling (M0+) while M4 runs UI and diagnostics; OVT pins interface directly with 12 V automotive signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FMI-D52 | Same PSOC™ 61 family but with 1 MB flash, 384 KB SRAM, and 68-QFN (53 IOs); lacks OVT pins and has higher Deep Sleep current (12 µA) | Better suited for firmware-rich gateways requiring larger code space; less optimal for ultra-low-power sensor endpoints | Select when >512 KB flash or additional SRAM is required and QFN thermal profile is acceptable. |
| STM32H743VI | Single-core Cortex-M7 (480 MHz), no integrated CAPSENSE™ or hardware CAN FD; requires external transceiver; 2.9 µA Standby (with RTC) | Higher compute throughput but no native capacitive sensing or dual-core security partitioning; needs external crypto IC for full TLS offload | Choose for raw DSP performance or RTOS-heavy applications where analog sensing and embedded security are handled externally. |
Compared with CY8C6145FNI-S3F11T, CY8C6247FMI-D52 trades ultra-low Deep Sleep for memory headroom and package compactness, while STM32H743VI delivers higher clock speed at the cost of integrated sensing, dual-core isolation, and hardware CAN FD-making the CY8C6145FNI-S3F11T optimal for battery-constrained, sensor-rich, and security-sensitive IoT endpoints.
Availability
CY8C6145FNI-S3F11T is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, medical wearables, and automotive body controllers requiring stable component supply across multi-year production cycles.
Supply support for CY8C6145FNI-S3F11T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and R&D infrastructure.
This part belongs to the PSOC™ 61 MCU product line-designed specifically for secure, energy-efficient IoT edge devices combining programmable analog/digital fabric with Arm dual-core processing and hardware-rooted trust.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6145FNI-S3F11T?
The Cortex-M4F core operates at up to 150 MHz under 1.1 V core voltage and 100 MHz under 0.9 V core voltage. Frequency scaling is user-configurable via the clock tree and voltage regulator settings, with performance validated across industrial temperature range (–40°C to +85°C) per datasheet Rev. *G.
Does CY8C6145FNI-S3F11T support CAN FD without an external transceiver?
No. The device integrates a CAN FD controller compliant with ISO 11898-1:2015, but requires an external CAN FD physical-layer transceiver (e.g., Infineon TLE9471-2ES) for bus interfacing. The CAN_TX and CAN_RX pins provide differential logic-level signals only.
How many GPIOs support overvoltage tolerance, and what is their rating?
Two GPIOs-P1[0] and P1[1]-are overvoltage-tolerant (OVT) and rated to 5.5 V regardless of VDD (1.7–3.6 V). They support direct interface with 5 V logic or automotive 12 V signals through appropriate resistive dividers, as confirmed in the "GPIO Electrical Specifications" section of datasheet 002-30703 Rev. *G.
Is the CAPSENSE™ subsystem capable of operating during Deep Sleep mode?
Yes. The CAPSENSE™ CSD hardware subsystem-including sigma-delta modulator, IDACs, and scanning logic-operates fully in Deep Sleep mode. It can autonomously scan up to 63 segments, trigger wake-on-touch, and maintain liquid tolerance without CPU involvement, as documented in the "CAPSENSE™ Subsystem" functional description.
CY8C6145FNI-S3F11T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 49-XBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6145FNI-S3F11T FAQ
1.How can I place an order for CY8C6145FNI-S3F11T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6145FNI-S3F11T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6145FNI-S3F11T reliable?
The price and inventory of CY8C6145FNI-S3F11T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145FNI-S3F11T is usually 5 days.
3.What payment methods are accepted for CY8C6145FNI-S3F11T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145FNI-S3F11T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6145FNI-S3F11T?
CY8C6145FNI-S3F11T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6145FNI-S3F11T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6145FNI-S3F11T?
For technical support, including CY8C6145FNI-S3F11T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145FNI-S3F11T requirements.
6.How does Aetrix verify that CY8C6145FNI-S3F11T is sourced from the original manufacturer or authorized distributors?
All CY8C6145FNI-S3F11T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145FNI-S3F11T meets industry standards.
7.What is the process for return or replacement of CY8C6145FNI-S3F11T?
All CY8C6145FNI-S3F11T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145FNI-S3F11T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6145FNI-S3F11T part is unused and in its original packaging.
Return procedure for CY8C6145FNI-S3F11T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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