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Infineon Technologies CY8C6145FNI-S3F11T

Part No.:
CY8C6145FNI-S3F11T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
49-XBGA, WLCSP
Datasheet:
AetrixCY8C6145FNI-S3F11T.pdf
Description:
IC MCU 32BIT 512KB FLASH 49WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,533

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Product details

Overview

CY8C6145FNI-S3F11T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller designed for secure, ultra-low-power IoT edge nodes. It integrates 512 KB flash, 256 KB SRAM, hardware cryptography acceleration, CAN FD, USB Full-Speed, and CAPSENSE™ capacitive sensing-enabling battery-operated smart sensors and connected industrial controllers.

For engineers reviewing the CY8C6145FNI-S3F11T datasheet, CY8C6145FNI-S3F11T pinout, CY8C6145FNI-S3F11T application, or CY8C6145FNI-S3F11T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), Deep Sleep current (7 µA with 64 KB SRAM retention), integrated CAN FD + USB, and hardware TRNG/secure boot architecture.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing at up to 150 MHz while the Cortex-M0+ (100 MHz) manages system-level tasks including security services and peripheral offload-its firmware access restricted per platform policy. Memory coherency is maintained via shared bus matrix and three DMA controllers.

Its programmable analog-digital fabric includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and CAPSENSE™ CSD with SmartSense auto-tuning. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), PLL/FLL, and fractional dividers for precise peripheral timing.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, with separate MPUs and core-voltage selection (0.9 V / 1.1 V)
Memory 512-KB flash (RWW), 256-KB SRAM (programmable retention), 32-KB AUXflash, 32-KB SFlash, 1-Kb OTP eFuse
Power Efficiency Deep Sleep mode draws 7 µA with 64-KB SRAM retention; active slope as low as 22 µA/MHz (M4 @ 0.9 V)
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), 2x low-power comparators, built-in temperature sensor
Digital Interfaces 7 configurable SCBs (SPI/I²C/UART), 1 Deep Sleep SCB, USB Full-Speed device, CAN FD controller, SD/eMMC host, QSPI/SMIF with XIP & on-the-fly encryption
Security Hardware crypto accelerator (AES-128/256, SHA-256, ECC), TRNG, secure boot with hardware hashing, 8 protection contexts
Capacitive Sensing CAPSENSE™ CSD subsystem with liquid tolerance, proximity support, self/mutual sensing, and SmartSense auto-tuning

Pinout & Package

This device is housed in a 100-pin TQFP package (14 × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 total I/Os) supporting Boolean logic during Deep Sleep.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO Bank 0 Programmable drive modes, slew rates; supports Smart I/O Boolean operations in Deep Sleep
P1[0]–P1[7] GPIO Bank 1 Includes two OVT pins (P1[0], P1[1]) tolerant to 5.5 V in 1.7–3.6 V operation
USB_DP / USB_DM USB Full-Speed Interface Dedicated differential pair for USB 2.0 Full-Speed device operation (12 Mbps)
CAN_TX / CAN_RX CAN FD Transceiver Interface Direct connection to external CAN transceiver; supports ISO 11898-1:2015 FD frames up to 5 Mbps
QSPI_SCK / QSPI_SS / QSPI_IO0–IO3 Quad-SPI Memory Interface Enables Execute-In-Place from external flash with 4-KB cache and hardware encryption/decryption

Key Features

Feature Design Value
Dual-Voltage Core Operation Selectable 0.9 V or 1.1 V CPU supply enables dynamic trade-off between performance (150 MHz M4) and ultra-low active current (22 µA/MHz)
Hardware Crypto Acceleration Dedicated engine for AES-128/256, SHA-256, ECC-256, and TRNG-offloads encryption from CPU and ensures deterministic latency
Deep Sleep SCB One serial communication block remains active in Deep Sleep mode, enabling SPI/I²C wake-up and sensor data polling without CPU wake-up
Smart I/O Logic Two 4-bit Smart I/O ports perform Boolean operations (AND/OR/XOR) on GPIO signals autonomously during Deep Sleep-reducing wake events
CAPSENSE™ SmartSense Fully hardware-tuned capacitive sensing eliminates manual calibration; maintains SNR > 100 dB in wet environments and supports proximity detection

Applications

Industrial Sensor Node Smart Home Hub

Use Scenario: Battery-powered wireless vibration/temperature node in predictive maintenance systems.

IC Role / Device Role / Timing Role: Dual-core MCU performs real-time FFT analysis (M4), manages BLE/Wi-Fi coexistence (M0+), and schedules Deep Sleep wake-ups via TCPWM-triggered ADC sampling.

Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends 2-AA battery life beyond 5 years; CAPSENSE™ detects enclosure tampering without added components.

Use Scenario: Central hub aggregating Zigbee, Matter-over-Thread, and Bluetooth LE devices in residential automation.

IC Role / Device Role / Timing Role: M4 runs Matter SDK stack and local decision logic; M0+ handles secure boot, crypto offload, and USB CDC bridge for PC configuration.

Use Value: Integrated USB Full-Speed + CAN FD enables wired commissioning and legacy appliance integration; hardware TRNG satisfies NIST SP 800-90B entropy requirements.

Medical Wearable Automotive Body Controller

Use Scenario: ECG patch with dry-electrode sensing, motion compensation, and encrypted cloud upload.

IC Role / Device Role / Timing Role: SAR ADC samples analog front-end at 2 Msps; CAPSENSE™ monitors electrode-skin contact quality; crypto engine encrypts data pre-transmission.

Use Value: 12-bit ADC with 16-channel sequencer and result averaging achieves <1 µV RMS noise; SmartSense auto-calibrates for varying skin impedance.

Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN/CAN FD gateway functionality.

IC Role / Device Role / Timing Role: CAN FD block handles high-speed body bus messaging (≤5 Mbps); TCPWMs generate precise PWM for LED dimming and motor control; GPIOs drive relays and sense switches.

Use Value: Dual-core isolation allows safety-critical CAN FD handling (M0+) while M4 runs UI and diagnostics; OVT pins interface directly with 12 V automotive signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247FMI-D52 Same PSOC™ 61 family but with 1 MB flash, 384 KB SRAM, and 68-QFN (53 IOs); lacks OVT pins and has higher Deep Sleep current (12 µA) Better suited for firmware-rich gateways requiring larger code space; less optimal for ultra-low-power sensor endpoints Select when >512 KB flash or additional SRAM is required and QFN thermal profile is acceptable.
STM32H743VI Single-core Cortex-M7 (480 MHz), no integrated CAPSENSE™ or hardware CAN FD; requires external transceiver; 2.9 µA Standby (with RTC) Higher compute throughput but no native capacitive sensing or dual-core security partitioning; needs external crypto IC for full TLS offload Choose for raw DSP performance or RTOS-heavy applications where analog sensing and embedded security are handled externally.

Compared with CY8C6145FNI-S3F11T, CY8C6247FMI-D52 trades ultra-low Deep Sleep for memory headroom and package compactness, while STM32H743VI delivers higher clock speed at the cost of integrated sensing, dual-core isolation, and hardware CAN FD-making the CY8C6145FNI-S3F11T optimal for battery-constrained, sensor-rich, and security-sensitive IoT endpoints.

Availability

CY8C6145FNI-S3F11T is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, medical wearables, and automotive body controllers requiring stable component supply across multi-year production cycles.

Supply support for CY8C6145FNI-S3F11T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and R&D infrastructure.

This part belongs to the PSOC™ 61 MCU product line-designed specifically for secure, energy-efficient IoT edge devices combining programmable analog/digital fabric with Arm dual-core processing and hardware-rooted trust.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6145FNI-S3F11T?

The Cortex-M4F core operates at up to 150 MHz under 1.1 V core voltage and 100 MHz under 0.9 V core voltage. Frequency scaling is user-configurable via the clock tree and voltage regulator settings, with performance validated across industrial temperature range (–40°C to +85°C) per datasheet Rev. *G.

Does CY8C6145FNI-S3F11T support CAN FD without an external transceiver?

No. The device integrates a CAN FD controller compliant with ISO 11898-1:2015, but requires an external CAN FD physical-layer transceiver (e.g., Infineon TLE9471-2ES) for bus interfacing. The CAN_TX and CAN_RX pins provide differential logic-level signals only.

How many GPIOs support overvoltage tolerance, and what is their rating?

Two GPIOs-P1[0] and P1[1]-are overvoltage-tolerant (OVT) and rated to 5.5 V regardless of VDD (1.7–3.6 V). They support direct interface with 5 V logic or automotive 12 V signals through appropriate resistive dividers, as confirmed in the "GPIO Electrical Specifications" section of datasheet 002-30703 Rev. *G.

Is the CAPSENSE™ subsystem capable of operating during Deep Sleep mode?

Yes. The CAPSENSE™ CSD hardware subsystem-including sigma-delta modulator, IDACs, and scanning logic-operates fully in Deep Sleep mode. It can autonomously scan up to 63 segments, trigger wake-on-touch, and maintain liquid tolerance without CPU involvement, as documented in the "CAPSENSE™ Subsystem" functional description.

CY8C6145FNI-S3F11T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
49-XBGA, WLCSP
Series:
PSOC™ 6
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6145FNI-S3F11T FAQ

1.How can I place an order for CY8C6145FNI-S3F11T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6145FNI-S3F11T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6145FNI-S3F11T reliable?

The price and inventory of CY8C6145FNI-S3F11T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145FNI-S3F11T is usually 5 days.

3.What payment methods are accepted for CY8C6145FNI-S3F11T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145FNI-S3F11T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6145FNI-S3F11T?

CY8C6145FNI-S3F11T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6145FNI-S3F11T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6145FNI-S3F11T?

For technical support, including CY8C6145FNI-S3F11T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145FNI-S3F11T requirements.

6.How does Aetrix verify that CY8C6145FNI-S3F11T is sourced from the original manufacturer or authorized distributors?

All CY8C6145FNI-S3F11T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145FNI-S3F11T meets industry standards.

7.What is the process for return or replacement of CY8C6145FNI-S3F11T?

All CY8C6145FNI-S3F11T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145FNI-S3F11T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6145FNI-S3F11T part is unused and in its original packaging.

Return procedure for CY8C6145FNI-S3F11T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6145FNI-S3F11T Tags

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