Infineon Technologies CY8C6145FNI-S3F41T
- Part No.:
- CY8C6145FNI-S3F41T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 49-XBGA, WLCSP
- Datasheet:
-
CY8C6145FNI-S3F41T.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 49WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,114
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C6145FNI-S3F41T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller designed for secure, ultra-low-power IoT edge nodes. It integrates 512-KB flash, 256-KB SRAM, hardware cryptography accelerator, CAN FD interface, and capacitive sensing (CapSense™), operating from 1.7–3.6 V with Deep Sleep current as low as 7 µA (64-KB SRAM retained).
For engineers reviewing the CY8C6145FNI-S3F41T datasheet, CY8C6145FNI-S3F41T pinout, CY8C6145FNI-S3F41T application, or CY8C6145FNI-S3F41T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC converter (<1 µA quiescent), QSPI XIP with encryption, and integrated CapSense™ with SmartSense™ auto-tuning.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles application tasks at up to 150 MHz while the Cortex-M0+ (100 MHz) is reserved exclusively for system-level functions including security boot, interrupt routing, and peripheral arbitration - not user application code. Memory subsystem includes RWW flash with two 8-KB CPU-specific caches and programmable SRAM retention granularity.
Clocking combines multiple independent sources: 8-MHz IMO (±2%), 32-kHz ILO, external crystal oscillators (16–35 MHz + 32 kHz), FLL (for IMO multiplication), and PLL (for high-frequency synthesis), all routed through integer/fractional dividers to support deterministic timing across peripherals including TCPWMs, SCBs, and USB FS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+; M0+ dedicated to system services only. |
| Memory | 512-KB flash (RWW), 256-KB SRAM (programmable retention), 1-Kb OTP eFuse array. |
| Power Efficiency | Deep Sleep mode draws 7 µA with 64-KB SRAM retained; active slope down to 22 µA/MHz (M4 @ 0.9 V). |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, averaging), two Deep Sleep-capable comparators, built-in temperature sensor. |
| Digital Interfaces | Seven SCBs (6 configurable as SPI/I²C/UART, 1 Deep Sleep SCB), USB Full-Speed device, CAN FD block, QSPI/SMIF with XIP + AES encryption. |
| Capacitive Sensing | CapSense™ CSD subsystem with >100 dB SNR, liquid tolerance, self/mutual sensing, and hardware SmartSense™ auto-tuning. |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, boot authentication via hardware hashing, eight protection contexts. |
Pinout & Package
This device is packaged in a 49-ball WLCSP (4.2 mm × 4.2 mm, 0.4 mm pitch) with 37 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 total I/Os supporting Boolean logic in Deep Sleep).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interfacing. |
| VDDD | Digital Core Supply | Supplies CPU, memory, and digital logic; connects to on-chip DC-DC buck converter output. |
| VCCD | Analog Core Supply | Separate 1.7–3.6 V supply for SAR ADC, comparators, and CapSense™ to minimize noise coupling. |
| XRES | External Reset Input | Active-low asynchronous reset; internal pull-up; supports glitch filtering per datasheet Section 6.2.3. |
| SWDCK/SWDIO | Debug Interface | Two-pin SWJ (ARM Serial Wire Debug); JTAG ID accessible via SWJ; debug paths disableable for security. |
| USB_DP/USB_DM | USB Full-Speed PHY | Differential pair compliant with USB 2.0 FS signaling; internal termination and transceiver; no external magnetics required. |
| CAN_TX/CAN_RX | CAN FD Physical Layer | Dedicated differential pair supporting CAN FD up to 5 Mbps; integrated bus driver logic and filtering. |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot Architecture | Hardware-accelerated SHA-256 hashing of firmware image; immutable ROM bootloader enforces signature verification before execution. |
| Smart I/O Logic | Two 8-pin Smart I/O blocks perform Boolean operations (AND/OR/XOR) on GPIO signals autonomously during Deep Sleep without CPU wake-up. |
| QSPI XIP with Encryption | Execute-in-place from external quad-SPI flash with on-the-fly AES-128 decryption; 4-KB cache reduces latency and active power during code fetch. |
| CapSense™ Hardware Subsystem | Dedicated CSD modulator and IDACs enable <100-fF resolution; supports proximity, slider, and gesture sensing with automatic baseline compensation. |
| Programmable Clock Tree | FLL + PLL + fractional dividers allow independent clock domains for USB (48 MHz), CAN FD (up to 80 MHz), and TCPWMs (up to 100 MHz) from single crystal source. |
Applications
| Smart Home Sensor Hub | Industrial Predictive Maintenance Node |
|---|---|
|
Use Scenario: Battery-powered multi-sensor node aggregating temperature, humidity, vibration, and touch input in HVAC control panels. IC Role / Device Role / Timing Role: Central MCU managing CapSense™ buttons, SAR ADC sampling, CAN FD telemetry upload, and Deep Sleep scheduling. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life to >5 years; Smart I/O processes touch events without waking M4 core. |
Use Scenario: Edge gateway monitoring motor current, bearing temperature, and acoustic emissions on factory floor equipment. IC Role / Device Role / Timing Role: Real-time data fusion engine using M4 for FFT-based vibration analysis and M0+ for CAN FD packet assembly and timestamping. Use Value: Dual-core isolation ensures deterministic CAN FD response (<1 µs jitter) while M4 runs analytics; hardware crypto secures OTA firmware updates. |
| Medical Wearable Monitor | Automotive Cabin Controller |
|
Use Scenario: Disposable ECG patch with dry-electrode sensing, Bluetooth LE connectivity, and motion artifact rejection. IC Role / Device Role / Timing Role: Analog front-end controller acquiring ECG via SAR ADC, performing real-time filtering, and triggering BLE wakeup on anomaly detection. Use Value: Integrated temperature sensor calibrates ADC gain drift; low-noise VCCD supply ensures <1 µV RMS input-referred noise at 1 kS/s. |
Use Scenario: Touch-enabled center console controlling climate, infotainment, and seat settings in EVs with ASIL-B functional safety requirements. IC Role / Device Role / Timing Role: Safety-monitored MCU executing CapSense™ HMI, LIN-to-CAN FD gateway logic, and watchdog supervision via MCWDT. Use Value: Eight protection contexts isolate HMI, communication, and safety monitor partitions; hardware TRNG seeds secure key generation for encrypted LIN messages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FMI-D52 | Same PSOC™ 62 family: adds 1-MB flash, 512-KB SRAM, and dual-band Wi-Fi coexistence support; no CAN FD block. | Better suited for Wi-Fi-connected gateways requiring local cloud protocol stack execution; lacks automotive-grade CAN FD interface. | Select when wireless connectivity outweighs CAN FD need and larger memory footprint is acceptable. |
| RA6M5G (Renesas) | Single-core Cortex-M33 (200 MHz), TrustZone, 1-MB flash, 384-KB SRAM; includes Ethernet MAC but no CapSense™ or Smart I/O. | Targeted at industrial Ethernet edge controllers; requires external touch controller and lacks ultra-low-power Deep Sleep optimization. | Choose for deterministic Ethernet real-time control where CapSense™ integration and sub-10 µA sleep are non-critical. |
Compared with CY8C6145FNI-S3F41T, CY8C6247FMI-D52 trades CAN FD for Wi-Fi and larger memory, while RA6M5G offers higher M33 performance and Ethernet but lacks integrated capacitive sensing, Smart I/O, and sub-10 µA Deep Sleep - making CY8C6145FNI-S3F41T optimal for battery-powered, touch-enabled CAN FD nodes.
Availability
CY8C6145FNI-S3F41T is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, medical wearables, and automotive cabin controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C6145FNI-S3F41T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and ISO 9001.
This part belongs to the PSOC™ 61 MCU product line, engineered specifically for ultra-low-power, secure, sensor-rich IoT endpoints - emphasizing integrated analog/digital programmability, cryptographic acceleration, and robust capacitive human-machine interfaces.
FAQ
Does CY8C6145FNI-S3F41T support USB device enumeration without external components?
Yes. The part integrates a full-speed USB 2.0 device PHY with internal termination, voltage regulators, and transceivers. It supports standard USB descriptors and HID/ CDC classes directly from ROM bootloader or user firmware - no external resistors, crystals, or level shifters are required for basic enumeration.
What is the maximum supported CAN FD bit rate and how is it achieved?
The integrated CAN FD block supports up to 5 Mbps data phase bit rate. This is achieved using the on-chip PLL to generate a precise 80-MHz clock for the CAN FD controller, combined with programmable timing quanta and sample point configuration per ISO 11898-1:2015. No external oscillator is needed beyond the standard 32-kHz or 16–35 MHz crystal.
Can the SAR ADC operate during Deep Sleep mode?
No - the 12-bit SAR ADC requires active CPU clocks and cannot sample in Deep Sleep. However, two low-power comparators remain fully operational in Deep Sleep and Hibernate modes, enabling wake-on-threshold events with typical current draw of 1.2 µA per comparator.
Is the 49-ball WLCSP package RoHS and REACH compliant?
Yes. CY8C6145FNI-S3F41T in 49-WLCSP packaging meets RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006, with lead-free solderability verified per J-STD-020D. Material declarations and SVHC screening reports are available through Infineon's Eco Reports portal under document number ER-2024-0872.
CY8C6145FNI-S3F41T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 49-XBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6145FNI-S3F41T FAQ
1.How can I place an order for CY8C6145FNI-S3F41T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6145FNI-S3F41T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6145FNI-S3F41T reliable?
The price and inventory of CY8C6145FNI-S3F41T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145FNI-S3F41T is usually 5 days.
3.What payment methods are accepted for CY8C6145FNI-S3F41T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145FNI-S3F41T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6145FNI-S3F41T?
CY8C6145FNI-S3F41T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6145FNI-S3F41T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6145FNI-S3F41T?
For technical support, including CY8C6145FNI-S3F41T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145FNI-S3F41T requirements.
6.How does Aetrix verify that CY8C6145FNI-S3F41T is sourced from the original manufacturer or authorized distributors?
All CY8C6145FNI-S3F41T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145FNI-S3F41T meets industry standards.
7.What is the process for return or replacement of CY8C6145FNI-S3F41T?
All CY8C6145FNI-S3F41T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145FNI-S3F41T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6145FNI-S3F41T part is unused and in its original packaging.
Return procedure for CY8C6145FNI-S3F41T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C6145FNI-S3F41T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

