Infineon Technologies CY8C6145FNI-S3F71T
- Part No.:
- CY8C6145FNI-S3F71T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 49-XBGA, WLCSP
- Datasheet:
-
CY8C6145FNI-S3F71T.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 49WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,989
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Product details
Overview
CY8C6145FNI-S3F71T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller designed for secure, ultra-low-power IoT edge nodes. It integrates 512 KB flash, 256 KB SRAM, hardware cryptography acceleration, CAN FD, USB Full-Speed, and CAPSENSE™ capacitive sensing - enabling battery-powered smart sensors and industrial gateways operating from 1.7 V to 3.6 V with 7 µA Deep Sleep current.
For engineers reviewing the CY8C6145FNI-S3F71T datasheet, CY8C6145FNI-S3F71T pinout, CY8C6145FNI-S3F71T application, or CY8C6145FNI-S3F71T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC converter (<1 µA quiescent), QSPI XIP with encryption, and hardware TRNG + eFuse-based secure boot.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing at up to 150 MHz while the Cortex-M0+ (reserved for system functions) manages low-level peripherals and security services. Both cores operate at user-selectable 1.1 V or 0.9 V supply, enabling fine-grained dynamic voltage scaling.
Its programmable analog-digital architecture includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and a dedicated CAPSENSE™ sigma-delta CSD block supporting self/mutual sensing with SmartSense auto-tuning - all synchronized via hardware trigger routing and three DMA controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with MPU and single-cycle multiply |
| Memory | 512 KB flash (RWW), 256 KB SRAM (programmable retention), 1 KB OTP eFuse array |
| Power Efficiency | 7 µA Deep Sleep with 64 KB SRAM retention; 22 µA/MHz active current @ 0.9 V core for M4 |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer + averaging), 2x low-power comparators, integrated temp sensor |
| Digital Interfaces | 7 configurable SCBs (SPI/I²C/UART), USB Full-Speed, CAN FD, SD/eMMC controller, QSPI/SMIF with XIP + AES encryption |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, secure boot with ROM hash, 8 protection contexts |
| Capacitive Sensing | CAPSENSE™ CSD subsystem with liquid tolerance, proximity support, and automatic SmartSense tuning |
Pinout & Package
This device is packaged in a 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 pins total) supporting Boolean logic in Deep Sleep mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O Port 0 | Supports combinational logic (AND/OR/XOR) during Deep Sleep; programmable drive strength/slew rate |
| P1[0]–P1[7] | GPIO / Smart I/O Port 1 | Same Smart I/O functionality as Port 0; enables wake-on-event with minimal power overhead |
| USB_DP / USB_DM | USB Full-Speed Interface | Differential pair compliant with USB 2.0 specification; supports device-only operation without external PHY |
| CAN_TX / CAN_RX | CAN FD Transceiver Interface | Direct connection to CAN FD physical layer; supports data rates up to 5 Mbps with flexible bit timing |
| QSPI_SCK / QSPI_SS / QSPI_IO0–IO3 | Quad-SPI Memory Interface | Enables Execute-In-Place from external flash with 4 KB cache and on-the-fly AES decryption |
| VDDA / VDDD / VCCD | Analog/Digital Core Supplies | Separate 1.7–3.6 V domains allow independent power gating and noise isolation for mixed-signal operation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | User-selectable 1.1 V or 0.9 V CPU supply enables dynamic trade-off between performance (150 MHz) and ultra-low active current (22 µA/MHz) |
| On-Chip DC-DC Converter | Integrated buck regulator with <1 µA quiescent current reduces external component count and improves battery life in portable designs |
| Hardware Crypto Acceleration | Dedicated engine for AES-128/256, SHA-256, ECC P-256, and TRNG eliminates software overhead and ensures deterministic secure boot timing |
| Deep Sleep SCB | One serial communication block remains operational in Deep Sleep mode, enabling SPI/I²C wake-up without CPU intervention |
| Segment LCD Driver | Drives up to 63 segments × 8 commons directly from SRAM buffers, reducing display controller BOM in HMI applications |
Applications
| Smart Home Sensor Hub | Industrial Predictive Maintenance Node |
|---|---|
|
Use Scenario: Battery-powered multi-sensor node aggregating temperature, humidity, motion, and touch input for cloud-connected HVAC control. IC Role / Device Role / Timing Role: Central MCU managing CAPSENSE™ touch UI, SAR ADC sampling, BLE gateway interface (via external radio), and secure OTA updates. Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends 2-AA battery life beyond 5 years; Smart I/O enables wake-on-touch without M4 activation. |
Use Scenario: Vibration and thermal monitoring unit mounted on rotating machinery, transmitting time-stamped sensor data via CAN FD to PLC. IC Role / Device Role / Timing Role: Real-time edge processor executing FFT preprocessing on ADC data, timestamping with RTC backup domain, and CAN FD packet framing. Use Value: Hardware-accelerated crypto secures firmware integrity; CAN FD 5 Mbps throughput supports high-resolution waveform streaming without buffering delay. |
| Medical Wearable Patch | Secure Access Control Terminal |
|
Use Scenario: Disposable ECG patch with dry-electrode sensing, onboard signal conditioning, and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: Analog front-end controller digitizing biopotential signals, applying digital filtering, and managing low-power wireless handshaking. Use Value: Integrated 12-bit SAR ADC with differential input and result averaging achieves >70 dB SNR; on-chip DC-DC minimizes battery drain during continuous 250 Hz sampling. |
Use Scenario: Tamper-resistant door controller using fingerprint CAPSENSE™, secure credential storage, and encrypted audit logging. IC Role / Device Role / Timing Role: Trusted execution environment enforcing secure boot, storing keys in eFuse, and performing real-time biometric matching. Use Value: Hardware TRNG + SHA-256 acceleration enables FIPS-compliant key derivation; 8 protection contexts isolate application, bootloader, and secure monitor memory spaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FMI-F54 | Higher flash (1 MB) and SRAM (320 KB); adds second USB port and Ethernet MAC; no CAN FD | Better suited for networked gateway applications requiring local web server or Ethernet bridging | Select when needing >512 KB code space or wired connectivity - not drop-in compatible due to pinout and peripheral differences |
| STM32U585QII6 | Single-core Cortex-M33 (160 MHz), TrustZone, 2 MB flash, 786 KB SRAM; no CAPSENSE™ or Smart I/O | Stronger cryptographic isolation but lacks integrated capacitive sensing and low-power GPIO logic | Prefer for high-assurance secure boot in payment terminals - requires external touch controller and additional power management ICs |
Compared with CY8C6145FNI-S3F71T, CY8C6247FMI-F54 offers greater memory headroom at higher cost and power, while STM32U585QII6 trades programmable analog/digital flexibility for stronger ARM TrustZone enforcement - making CY8C6145FNI-S3F71T optimal for cost-constrained, sensor-rich IoT endpoints needing hardware-accelerated security and ultra-low sleep current.
Availability
CY8C6145FNI-S3F71T is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, medical wearable patches, and secure access control terminals requiring stable component supply across multi-year production cycles.
Supply support for CY8C6145FNI-S3F71T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure embedded solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
This part belongs to the PSOC™ 61 family - engineered specifically for secure, battery-operated IoT edge devices demanding simultaneous low-power operation, rich analog integration, and hardware-enforced trust boundaries.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6145FNI-S3F71T?
The Cortex-M4F core operates at up to 150 MHz under 1.1 V core supply, and maintains full functionality at 100 MHz when powered at 0.9 V for ultra-low-power operation. Frequency scaling is managed via the on-chip PLL and FLL, with integer/fractional clock dividers supporting precise peripheral timing alignment.
Does CY8C6145FNI-S3F71T support secure boot with public-key verification?
Yes - it performs authentication during boot using hardware-accelerated SHA-256 hashing of the boot image, validated against RSA-2048 or ECC-P256 signatures stored in protected flash or eFuse. Debug interfaces can be permanently disabled post-configuration to prevent unauthorized firmware extraction.
Can the CAPSENSE™ subsystem operate independently of the main CPU cores?
Yes - the CAPSENSE™ CSD hardware block runs autonomously using its own clock and sequencer, allowing touch scanning during Deep Sleep mode with only the ILO oscillator active. Results are placed directly into SRAM, and interrupts or DMA transfers wake the CPU only upon threshold crossing or completion.
Is external memory required to use the QSPI interface for code execution?
No - the QSPI/SMIF interface supports Execute-In-Place (XIP) directly from external quad-SPI flash, with a dedicated 4 KB cache to reduce latency and power consumption. On-the-fly AES-128 decryption is applied transparently to encrypted firmware images stored externally.
CY8C6145FNI-S3F71T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 49-XBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- CANbus, eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, PMC, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6145FNI-S3F71T FAQ
1.How can I place an order for CY8C6145FNI-S3F71T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6145FNI-S3F71T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6145FNI-S3F71T reliable?
The price and inventory of CY8C6145FNI-S3F71T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145FNI-S3F71T is usually 5 days.
3.What payment methods are accepted for CY8C6145FNI-S3F71T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145FNI-S3F71T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6145FNI-S3F71T?
CY8C6145FNI-S3F71T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6145FNI-S3F71T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6145FNI-S3F71T?
For technical support, including CY8C6145FNI-S3F71T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145FNI-S3F71T requirements.
6.How does Aetrix verify that CY8C6145FNI-S3F71T is sourced from the original manufacturer or authorized distributors?
All CY8C6145FNI-S3F71T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145FNI-S3F71T meets industry standards.
7.What is the process for return or replacement of CY8C6145FNI-S3F71T?
All CY8C6145FNI-S3F71T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145FNI-S3F71T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6145FNI-S3F71T part is unused and in its original packaging.
Return procedure for CY8C6145FNI-S3F71T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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