Infineon Technologies CY8C6145LQI-S3F02
- Part No.:
- CY8C6145LQI-S3F02
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C6145LQI-S3F02.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 68QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,798
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Product details
Overview
CY8C6145LQI-S3F02 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU optimized for secure, ultra-low-power IoT edge nodes. It integrates 512-KB flash, 256-KB SRAM, hardware cryptography accelerator, CAN FD interface, and capacitive sensing (CAPSENSE™), operating from 1.7–3.6 V with Deep Sleep current as low as 7 µA (64-KB SRAM retained). Used in battery-powered smart sensors and industrial gateways requiring secure firmware updates and real-time sensor fusion.
For engineers reviewing the CY8C6145LQI-S3F02 datasheet, CY8C6145LQI-S3F02 pinout, CY8C6145LQI-S3F02 application, or CY8C6145LQI-S3F02 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4 core), on-chip DC-DC converter (<1 µA quiescent), CAN FD compliance, XIP-capable Quad-SPI interface, and hardware TRNG + eFuse-based secure boot.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing and real-time control, while the Cortex-M0+ is reserved exclusively for system-level functions including security services, power management, and peripheral offload - not user-accessible. Both cores operate at independent voltages (0.9 V or 1.1 V) with dedicated flash caches and DMA controllers.
Its programmable analog-digital architecture includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, CAPSENSE™ sigma-delta CSD engine with SmartSense auto-tuning, and a dedicated CAN FD block supporting ISO 11898-1:2015 with bit rates up to 5 Mbps and flexible data field lengths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Arm Cortex-M4F @ 150 MHz + Cortex-M0+ @ 100 MHz; M0+ reserved for system functions only |
| Memory | 512-KB application flash (RWW), 256-KB SRAM with retention granularity, 1-Kb OTP eFuse array |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz active current @ 0.9 V M4 core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC with 16-channel sequencer & result averaging; two LP comparators active in Deep Sleep |
| Digital Interfaces | CAN FD block (ISO 11898-1:2015), 7 configurable SCBs (SPI/I²C/UART), USB Full-Speed, SD/eMMC host controller |
| Security | Hardware crypto accelerator (AES-128/256, ECC, SHA-256), TRNG, secure boot with ROM hash verification, 8 protection contexts |
| Capacitive Sensing | CAPSENSE™ CSD engine with >100 dB SNR, liquid tolerance, self/mutual mode support, and SmartSense auto-tuning |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 total I/Os with Boolean logic in Deep Sleep).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O Port 0 | Support Boolean operations during Deep Sleep; programmable drive strength/slew rate |
| P1[0]–P1[7] | GPIO / Smart I/O Port 1 | Same capabilities as Port 0; enables low-power state-machine logic without CPU wake-up |
| SWDCLK / SWDIO | JTAG/SWD Debug Interface | Serial Wire Debug pins; disabled after secure boot lock for production security |
| VDDIO / VDDA / VDDD | Power Supply Rails | VDDIO: 1.7–3.6 V I/O supply; VDDA: analog reference; VDDD: digital core (0.9/1.1 V via DC-DC) |
| CANFD_TX / CANFD_RX | CAN FD Transceiver Interface | Dedicated differential pair supporting CAN FD physical layer; requires external transceiver |
| USB_DP / USB_DM | USB Full-Speed PHY | On-chip USB PHY compliant with USB 2.0 FS; no external transceiver needed |
Key Features
| Feature | Design Value |
|---|---|
| Dual-voltage core operation | Independent 0.9 V / 1.1 V supply for M4/M0+ enables fine-grained power/performance trade-off |
| Hardware-accelerated security | AES-128/256, ECC, SHA-256, and TRNG implemented in dedicated silicon - no software overhead or timing side channels |
| XIP with encryption | Execute-in-place from external Quad-SPI flash with on-the-fly AES decryption and 4-KB cache for low-latency code fetch |
| Deep Sleep programmability | Smart I/O ports, LP comparators, and CAPSENSE™ remain fully functional with CPU cores powered down |
| Flexible clocking | FLL + PLL + fractional dividers enable precise peripheral clock generation across wide frequency range (kHz to 150 MHz) |
Applications
| Industrial Sensor Node | Smart Home Hub |
|---|---|
Use Scenario: Battery-powered wireless temperature/humidity/pressure node with local edge analytics and OTA update capability. IC Role / Device Role / Timing Role: Main application processor and secure bootloader; manages sensor fusion, BLE/Wi-Fi coexistence, and encrypted firmware validation. Use Value: 7 µA Deep Sleep extends 10-year battery life; hardware crypto ensures signed firmware updates resist rollback and injection attacks. |
Use Scenario: Central hub aggregating Zigbee, Matter-over-Thread, and BLE devices with local voice command preprocessing. IC Role / Device Role / Timing Role: Dual-CPU coordinator: M4 runs neural network inference and protocol stacks; M0+ handles real-time radio scheduling and power sequencing. Use Value: Independent voltage scaling reduces active power by 35% vs fixed-voltage MCUs; Smart I/O enables touchless wake-on-proximity without CPU wake-up. |
| Automotive Body Controller | Medical Wearable |
Use Scenario: Low-voltage (12 V battery-derived) door module controlling window lift, mirror fold, and interior lighting with LIN/CAN FD gateway. IC Role / Device Role / Timing Role: CAN FD endpoint and LIN master; executes ASIL-B-compliant diagnostics and failsafe state machine. Use Value: On-chip CAN FD block eliminates external transceiver BOM cost; DC-DC converter maintains stable 0.9 V core under battery droop to 9 V. |
Use Scenario: ECG/PPG patch with dry-electrode capacitive sensing, motion artifact cancellation, and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: CAPSENSE™ CSD front-end + SAR ADC signal conditioner; performs real-time noise filtering and R-peak detection. Use Value: >100 dB SNR CSD enables reliable heartbeat detection through clothing; 64-byte backup domain retains RTC and calibration data during full power-down. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FDI-D52 | Higher flash (1 MB), adds AI accelerator (Neuromorphic Engine), no CAN FD; 68-QFN package (53 GPIOs) | Better suited for ML inference at edge; lacks automotive-grade CAN FD interface | Select when neural network model execution dominates over vehicle bus integration |
| STM32U585QII6 | Single Cortex-M33 core, TrustZone, 2 MB flash, no CAPSENSE™, no Smart I/O; 128-LQFP package | Stronger cryptographic isolation but no programmable analog/digital fabric; higher active power (34 µA/MHz) | Select when certified PSA Level 3 security is mandatory and capacitive sensing is handled externally |
Compared with CY8C6145LQI-S3F02, CY8C6247FDI-D52 trades CAN FD for AI acceleration and larger memory, while STM32U585QII6 offers stronger formal security certification at the cost of programmable analog flexibility and ultra-low-power Deep Sleep features.
Availability
CY8C6145LQI-S3F02 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, automotive body controllers, and medical wearables requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CY8C6145LQI-S3F02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
This part belongs to the PSOC™ 61 MCU product line, designed specifically for secure, ultra-low-power IoT endpoints that require integrated analog sensing, hardware-enforced security, and heterogeneous compute for edge intelligence.
FAQ
Is the Cortex-M0+ core accessible to user firmware?
No. The Cortex-M0+ core in CY8C6145LQI-S3F02 is reserved exclusively for system-level functions including secure boot, power management, and peripheral offload. It cannot be programmed directly by application firmware - only the Cortex-M4F core is user-accessible for application code execution.
Does this MCU support CAN FD without an external transceiver?
No. The CY8C6145LQI-S3F02 includes a CAN FD protocol controller and physical layer (PHY) driver, but requires an external CAN FD transceiver (e.g., TJA1044T) for bus connection. The internal circuitry provides differential signaling and bit timing compliance per ISO 11898-1:2015.
What is the maximum supported Quad-SPI flash density for XIP operation?
The SMIF interface supports external Quad-SPI flash up to 256 MB (2 Gb) in XIP mode. Address space is mapped into the M4 core's instruction bus with hardware AES decryption enabled, and the 4-KB cache buffers instruction fetches to minimize latency and reduce active power during code execution.
How is CAPSENSE™ performance validated in presence of water or sweat?
CAPSENSE™ CSD implementation achieves >100 dB signal-to-noise ratio and is validated per IEC 60529 IPX7 for liquid tolerance. Hardware SmartSense auto-tuning dynamically adjusts scan parameters (frequency, IDAC, averaging) to maintain baseline stability and reject moisture-induced capacitance drift without firmware intervention.
CY8C6145LQI-S3F02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6145LQI-S3F02 FAQ
1.How can I place an order for CY8C6145LQI-S3F02 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6145LQI-S3F02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6145LQI-S3F02 reliable?
The price and inventory of CY8C6145LQI-S3F02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145LQI-S3F02 is usually 5 days.
3.What payment methods are accepted for CY8C6145LQI-S3F02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145LQI-S3F02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6145LQI-S3F02?
CY8C6145LQI-S3F02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6145LQI-S3F02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6145LQI-S3F02?
For technical support, including CY8C6145LQI-S3F02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145LQI-S3F02 requirements.
6.How does Aetrix verify that CY8C6145LQI-S3F02 is sourced from the original manufacturer or authorized distributors?
All CY8C6145LQI-S3F02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145LQI-S3F02 meets industry standards.
7.What is the process for return or replacement of CY8C6145LQI-S3F02?
All CY8C6145LQI-S3F02 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145LQI-S3F02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6145LQI-S3F02 part is unused and in its original packaging.
Return procedure for CY8C6145LQI-S3F02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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