Infineon Technologies CY8C6145LQI-S3F62
- Part No.:
- CY8C6145LQI-S3F62
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C6145LQI-S3F62.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 68QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,998
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Product details
Overview
CY8C6145LQI-S3F62 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU optimized for secure, ultra-low-power IoT edge nodes, featuring 512 KB flash, 256 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports XIP from external QSPI flash at up to 320 Mbps.
For engineers reviewing the CY8C6145LQI-S3F62 datasheet, CY8C6145LQI-S3F62 pinout, CY8C6145LQI-S3F62 application, or CY8C6145LQI-S3F62 equivalent, key selection considerations include dual-CPU power efficiency trade-offs (22 µA/MHz @ 0.9 V M4), on-chip DC-DC quiescent current (<1 µA), CAN FD timing compliance, and Smart I/O Boolean logic availability in Deep Sleep mode.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing and real-time control while the Cortex-M0+ is reserved exclusively for system-level functions including security boot, interrupt management, and peripheral arbitration - not user application code. Memory protection units (MPUs) are present on both cores, and inter-processor communication (IPC) uses dedicated hardware channels with mailbox semantics.
Clocking combines multiple independent sources: an 8-MHz IMO (±2%), 32-kHz ILO, crystal oscillators (16–35 MHz + 32 kHz), FLL for IMO multiplication, and PLL for high-frequency synthesis. All peripherals-including TCPWMs, SCBs, and SMIF-derive clocks via integer/fractional dividers with dynamic reconfiguration support during runtime.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with separate MPUs and dedicated DMA controllers. |
| Memory | 512 KB flash (RWW), 256 KB SRAM (programmable retention), 1 KB OTP eFuse; two 8-KB CPU-specific flash caches. |
| Power Efficiency | 7 µA Deep Sleep (64 KB SRAM retained); active current slope of 22 µA/MHz (M4 @ 0.9 V core). |
| Connectivity | One CAN FD block, seven SCBs (6 configurable as SPI/I²C/UART, 1 Deep Sleep-capable), USB Full-Speed device interface. |
| Analog Peripherals | 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging; two low-power comparators active in Deep Sleep/Hibernate. |
| Security | Hardware crypto accelerator (AES-128/256, SHA-256, ECC, TRNG); boot authentication via hardware hashing; eight protection contexts. |
| Capacitive Sensing | CAPSENSE™ CSD subsystem with SmartSense auto-tuning, liquid tolerance, and simultaneous self/mutual sensing capability. |
Pinout & Package
This device is packaged in a 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 total I/Os). Power domains include VDDIO (1.7–3.6 V), VDDD (core, 0.9/1.1 V selectable), and VBACKUP (for RTC and 64-byte backup memory).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O Port A | Support Boolean logic (AND/OR/XOR) in Deep Sleep; programmable drive strength/slew rate; configurable as analog input or digital function. |
| P1[0]–P1[7] | GPIO / Smart I/O Port B | Same capabilities as Port A; enables parallel low-power sensor interface with hardware-accelerated signal conditioning. |
| USB_DP / USB_DM | USB Full-Speed Interface | Differential pair compliant with USB 2.0 FS signaling; internal termination and PHY; no external components required. |
| CAN_TX / CAN_RX | CAN FD Transceiver Interface | Dedicated pins for CAN FD physical layer connection; support bit rates up to 5 Mbps with flexible data phase timing. |
| SMIF_IO0–SMIF_IO3 | Quad-SPI Data Lines | Support single/dual/quad SPI modes; enable Execute-In-Place (XIP) from external flash with 4-KB cache and on-the-fly AES decryption. |
| VDDIO0–VDDIO3 | I/O Power Supply | Four independent I/O banks allow mixed-voltage operation (1.8 V/2.5 V/3.3 V) across GPIO groups for interfacing legacy peripherals. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip DC-DC Buck Converter | <1 µA quiescent current enables battery-powered operation for >10 years in sensor node applications with periodic wake-up. |
| Segment LCD Driver | Drives up to 63 segments × 8 commons while remaining fully operational in Deep Sleep mode without CPU intervention. |
| Hardware Crypto Accelerator | Offloads AES-128/256 encryption, SHA-256 hashing, and ECC signing from CPU, reducing M4 execution time by >90% for TLS handshake. |
| Smart I/O Boolean Logic | Performs AND/OR/XOR on up to 8 GPIO inputs in Deep Sleep, enabling wake-on-combination events without CPU wake-up. |
| CAPSENSE™ CSD Subsystem | Delivers >100 dB SNR and robust liquid-tolerant touch detection using sigma-delta modulation and automatic hardware tuning. |
Applications
| Smart Home Sensor Hub | Industrial Predictive Maintenance Node |
|---|---|
|
Use Scenario: Battery-powered multi-sensor aggregator (temp, humidity, vibration, gas) transmitting encrypted telemetry via BLE gateway. IC Role / Device Role / Timing Role: Central controller managing concurrent sensor sampling, CAPSENSE™ button interface, CAN FD diagnostics bus, and secure OTA update preparation. Use Value: 7 µA Deep Sleep extends 2-AA battery life beyond 5 years; hardware crypto ensures firmware integrity without compromising M4 real-time response. |
Use Scenario: Edge node monitoring motor current, bearing temperature, and acoustic emissions on rotating equipment. IC Role / Device Role / Timing Role: Real-time signal acquisition host running FFT on M4, with M0+ handling CAN FD alarm reporting and watchdog supervision. Use Value: 2-Msps SAR ADC with 16-channel sequencer captures synchronized multi-sensor waveforms; TCPWM kill signals respond to comparator-triggered overcurrent within <100 ns. |
| Medical Wearable Patch | Automotive Body Control Module (BCM) Subsystem |
|
Use Scenario: ECG/PPG patch with dry-electrode sensing, motion compensation, and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Analog front-end controller performing CAPSENSE™ electrode contact detection, ADC oversampling, and motion artifact filtering in firmware. Use Value: Dual-core isolation allows M0+ to maintain secure bootloader and sensor calibration tables while M4 runs adaptive filtering algorithms. |
Use Scenario: Low-power door module controlling window lift, mirror fold, and interior lighting via LIN/CAN FD gateways. IC Role / Device Role / Timing Role: Subsystem MCU managing GPIO-driven relays, PWM-controlled LED dimming, and CAN FD status reporting with guaranteed latency. Use Value: Smart I/O logic detects multi-button press combinations in Deep Sleep; on-chip DC-DC eliminates need for external PMIC, saving PCB area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FDI-D52 | Higher flash (1 MB) and SRAM (320 KB); adds second USB port and Ethernet MAC; no CAN FD block. | Better suited for gateway-class devices requiring local protocol bridging (e.g., BLE-to-Ethernet), but lacks automotive-grade CAN FD interface. | Select when needing larger code space and network connectivity, and CAN FD is not required. |
| STM32H743VI | Single-core Cortex-M7 (480 MHz); no integrated capacitive sensing or Smart I/O; includes FMC for SDRAM/NOR, but no on-chip DC-DC. | Targeted at high-throughput HMI or motor control; lacks ultra-low-power Deep Sleep features and hardware CAPSENSE™ acceleration. | Select for compute-intensive tasks where sub-µA sleep current and touch integration are secondary to raw performance. |
Compared with CY8C6145LQI-S3F62, CY8C6247FDI-D52 trades CAN FD for expanded memory and USB flexibility, while STM32H743VI sacrifices ultra-low-power architecture and integrated analog front-end for higher clock speed and external memory bandwidth - making CY8C6145LQI-S3F62 uniquely balanced for battery-operated, sensor-rich, and security-critical edge nodes.
Availability
CY8C6145LQI-S3F62 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, medical wearable patches, and automotive body control subsystems requiring stable component supply across long-lifecycle deployments.
Supply support for CY8C6145LQI-S3F62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and embedded controllers, with global R&D centers and ISO/TS 16949-certified manufacturing.
This part belongs to the PSoC™ 61 MCU product line, designed specifically for secure, ultra-low-power IoT endpoints requiring integrated analog, programmable logic, and hardware-accelerated cryptography - not general-purpose computing or high-performance DSP.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6145LQI-S3F62?
The Cortex-M4F core operates at up to 150 MHz, with single-cycle multiply, floating-point unit (FPU), and memory protection unit (MPU) enabled. This frequency is achievable under 1.1-V core voltage and ambient temperatures up to 85°C, as validated in the device's electrical specifications table (Rev. *G, Section 6.2.2).
Does CY8C6145LQI-S3F62 support hardware-based secure boot?
Yes - it implements hardware-rooted secure boot using SHA-256 hashing of the boot image stored in protected flash. The ROM bootloader validates signature integrity before executing flash-resident firmware, and all debug/test interfaces (JTAG/SWD) can be permanently disabled via eFuse programming.
Can the Smart I/O blocks operate independently during Deep Sleep mode?
Yes - both Smart I/O ports (8 pins total) remain fully functional in Deep Sleep mode, performing Boolean logic (AND/OR/XOR) on input states and generating wake events without waking the CPU. This capability is confirmed in the "Smart I/O" section of the PSoC™ 61 Technical Reference Manual (TRM), Section 3.4.1.
Is CAN FD timing compliant with ISO 11898-1:2015 at 5 Mbps?
Yes - the integrated CAN FD block meets ISO 11898-1:2015 requirements for bit timing accuracy and synchronization at data rates up to 5 Mbps, with programmable sample point, propagation delay compensation, and loopback self-test mode verified in characterization testing per Infineon's CY8C61x5 Datasheet Rev. *G, Section 3.5.7.
CY8C6145LQI-S3F62 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- CANbus, eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6145LQI-S3F62 FAQ
1.How can I place an order for CY8C6145LQI-S3F62 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6145LQI-S3F62 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6145LQI-S3F62 reliable?
The price and inventory of CY8C6145LQI-S3F62 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145LQI-S3F62 is usually 5 days.
3.What payment methods are accepted for CY8C6145LQI-S3F62?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145LQI-S3F62 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6145LQI-S3F62?
CY8C6145LQI-S3F62 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6145LQI-S3F62 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6145LQI-S3F62?
For technical support, including CY8C6145LQI-S3F62 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145LQI-S3F62 requirements.
6.How does Aetrix verify that CY8C6145LQI-S3F62 is sourced from the original manufacturer or authorized distributors?
All CY8C6145LQI-S3F62 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145LQI-S3F62 meets industry standards.
7.What is the process for return or replacement of CY8C6145LQI-S3F62?
All CY8C6145LQI-S3F62 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145LQI-S3F62, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6145LQI-S3F62 part is unused and in its original packaging.
Return procedure for CY8C6145LQI-S3F62:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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