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Infineon Technologies CY8C6145LQI-S3F72

Part No.:
CY8C6145LQI-S3F72
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C6145LQI-S3F72.pdf
Description:
IC MCU 32BIT 512KB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,106

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Product details

Overview

CY8C6145LQI-S3F72 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller designed for secure, ultra-low-power IoT edge nodes. It integrates 512 KB flash, 256 KB SRAM, hardware cryptography acceleration, CAN FD, USB Full-Speed, and capacitive sensing (CAPSENSE™), operating from 1.7–3.6 V with Deep Sleep current as low as 7 µA (64 KB SRAM retained).

For engineers reviewing the CY8C6145LQI-S3F72 datasheet, CY8C6145LQI-S3F72 pinout, CY8C6145LQI-S3F72 application, or CY8C6145LQI-S3F72 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC converter (<1 µA quiescent), QSPI XIP with 4 KB cache, and integrated CAPSENSE™ with SmartSense auto-tuning.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing at up to 150 MHz with FPU and MPU, while the Cortex-M0+ (100 MHz) is reserved exclusively for system-level functions including security boot, power management, and peripheral arbitration - not user application code. Both cores support dynamic voltage scaling between 0.9 V and 1.1 V.

Its programmable analog-digital architecture includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and a dedicated CAPSENSE™ sigma-delta subsystem supporting self/mutual sensing with hardware-accelerated SmartSense tuning - all independently operable during system Deep Sleep mode.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+ (M0+ reserved for system functions only)
Memory 512 KB flash (RWW), 256 KB SRAM (programmable retention), 1 KB OTP eFuse
Power Efficiency 7 µA Deep Sleep current with 64 KB SRAM retention; 22 µA/MHz active current @ 0.9 V core
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), 2 LP comparators (Deep Sleep active)
Digital Interfaces 7 SCBs (6 configurable as SPI/I²C/UART, 1 Deep Sleep SCB), USB Full-Speed, CAN FD, QSPI/SMIF with XIP & encryption
CAPSENSE™ Capacitive sigma-delta (CSD) subsystem with liquid tolerance, proximity support, and automatic SmartSense hardware tuning
Security Hardware crypto accelerator (AES, ECC, SHA), TRNG, boot authentication, 8 protection contexts, debug disable capability

Pinout & Package

This device is packaged in a 72-pin QFN (7 mm × 7 mm, 0.4 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 total I/Os) enabling Boolean logic during Deep Sleep.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO3 I/O Power Supply Independent 1.7–3.6 V domains per port group; enables mixed-voltage interface design
VDDD Digital Core Supply Supplies CPU, memory, and digital logic; supports dynamic voltage scaling (0.9 V / 1.1 V)
VDDR Regulator Input Input to on-chip DC-DC buck converter; enables <1 µA quiescent operation and high-efficiency regulation
XRES External Reset Input Active-low asynchronous reset; compatible with open-drain or push-pull drivers; internal pull-up enabled
SWDCK/SWDIO Debug Interface Two-pin SWD interface for programming and debugging; accessible until debug disable fuse is blown
USB_DP/USB_DM USB Physical Layer Differential Full-Speed (12 Mbps) USB transceiver; no external PHY required
CAN_TX/CAN_RX CAN FD Transceiver Interface Direct connection to external CAN FD transceiver; supports bit rates up to 5 Mbps

Key Features

Feature Design Value
Dual-CPU Voltage Scaling Runtime-selectable 0.9 V / 1.1 V core voltage per CPU, enabling optimized active power vs. performance trade-offs
QSPI XIP with Encryption Execute-in-place from external quad-SPI flash with on-the-fly AES-128 decryption and 4 KB instruction cache
Smart I/O Logic Two 8-pin Smart I/O ports perform Boolean operations (AND/OR/XOR) on GPIO signals without CPU wake-up
Segment LCD Driver Integrated driver supporting up to 63 segments × 8 commons; operates fully in Deep Sleep mode
Hardware CAPSENSE™ Tuning SmartSense auto-calibration runs in firmware background; eliminates manual sensor parameter tuning across temperature/humidity

Applications

Smart Home Sensor Hub Industrial Predictive Maintenance Node

Use Scenario: Battery-powered multi-sensor node aggregating temperature, humidity, motion, and touch input in HVAC control panels.

IC Role / Device Role / Timing Role: Central MCU managing CAPSENSE™ touch UI, SAR ADC sensor reads, CAN FD data aggregation, and ultra-low-power sleep scheduling.

Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends battery life to >5 years; SmartSense eliminates field recalibration of touch buttons.

Use Scenario: Vibration and thermal monitoring unit mounted on rotating machinery, transmitting alerts via CAN FD to PLC.

IC Role / Device Role / Timing Role: Real-time signal acquisition host running FFT preprocessing on Cortex-M4F, with M0+ handling CAN FD protocol stack and watchdog supervision.

Use Value: Dual-core isolation prevents firmware faults from disrupting CAN FD communication; hardware crypto secures firmware updates over CAN.

Medical Wearable Monitor Automotive Cabin Controller

Use Scenario: Disposable ECG patch with dry-electrode sensing, Bluetooth LE gateway, and onboard anomaly detection.

IC Role / Device Role / Timing Role: Signal conditioning (SAR ADC + comparator), CAPSENSE™ electrode contact detection, USB charging management, and BLE coexistence timing coordination.

Use Value: On-chip DC-DC converter enables stable 3.3 V rail from single coin cell; LP comparators detect electrode detachment during Deep Sleep.

Use Scenario: Touch-enabled climate and lighting control panel in EV cabins with haptic feedback and ambient light adaptation.

IC Role / Device Role / Timing Role: CAPSENSE™ touch controller, segment LCD driver for status display, PWM dimming control, and LIN/CAN FD gateway bridging.

Use Value: Integrated segment LCD driver reduces BOM count; Smart I/O logic enables wake-on-touch without CPU intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247FDI-D52 Same PSOC™ 62 family; adds AIROC™ Wi-Fi/Bluetooth combo radio; larger 100-TQFP package (64 IOs); higher active power Requires wireless connectivity; less suitable for cost-sensitive or space-constrained wired-only designs Select when integrated wireless and larger I/O count justify added cost and power overhead
STM32WBA52CGU6 Single-core Cortex-M33 (100 MHz); no CAPSENSE™; BLE 5.3 radio; smaller 48-pin QFN; lacks CAN FD and QSPI XIP Better suited for BLE-centric endpoints without touch UI or industrial bus requirements Choose for Bluetooth-only applications needing lower BOM cost and simpler certification path

Compared with CY8C6145LQI-S3F72, CY8C6247FDI-D52 trades off power efficiency and analog integration for wireless capability, while STM32WBA52CGU6 sacrifices dual-core security features and CAPSENSE™ for BLE integration and lower entry cost - neither matches its combination of ultra-low-power Deep Sleep, hardware-accelerated touch, and CAN FD in a compact QFN.

Availability

CY8C6145LQI-S3F72 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, medical wearables, and automotive cabin controllers requiring stable component supply, long-term lifecycle assurance, and qualified production traceability.

Supply support for CY8C6145LQI-S3F72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including ISO/TS 16949 and ISO 9001.

This part belongs to the PSOC™ 61 MCU product line - engineered specifically for secure, battery-operated IoT endpoints demanding simultaneous low-power operation, rich analog sensing, and robust communication (CAN FD, USB, QSPI) without external components.

FAQ

Is the Cortex-M0+ core available for user application code?

No. The Cortex-M0+ in CY8C6145LQI-S3F72 is reserved exclusively for system-level functions including secure boot, power management, interrupt arbitration, and peripheral control. Application firmware must run solely on the Cortex-M4F core, which operates at up to 150 MHz with FPU and MPU support.

Does this device support execute-in-place (XIP) from external flash?

Yes. The integrated Quad-SPI/SMIF interface supports XIP from external quad-SPI flash with on-the-fly AES-128 decryption and a dedicated 4 KB instruction cache, enabling low-latency code execution while minimizing active power consumption during firmware fetch.

What is the minimum supply voltage for Deep Sleep mode with full SRAM retention?

The device maintains full 64 KB SRAM retention in Deep Sleep mode down to 1.7 V VDDD supply. At 1.7 V, Deep Sleep current remains ≤7 µA, verified per Infineon's 002-30703 Rev. *G datasheet Section 6.2.2 under "Device-level specifications".

Can CAPSENSE™ operate while the CPU is in Deep Sleep?

Yes. The CAPSENSE™ sigma-delta (CSD) subsystem operates autonomously during Deep Sleep mode using the internal low-speed oscillator (ILO). It supports self- and mutual-capacitance sensing, automatic SmartSense tuning, and wake-on-touch events without waking the CPU or consuming active-core current.

CY8C6145LQI-S3F72 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6145LQI-S3F72 FAQ

1.How can I place an order for CY8C6145LQI-S3F72 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6145LQI-S3F72 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6145LQI-S3F72 reliable?

The price and inventory of CY8C6145LQI-S3F72 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6145LQI-S3F72 is usually 5 days.

3.What payment methods are accepted for CY8C6145LQI-S3F72?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6145LQI-S3F72 transactions.

Note: Certain payment methods may incur a processing fee.

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CY8C6145LQI-S3F72 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6145LQI-S3F72 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6145LQI-S3F72?

For technical support, including CY8C6145LQI-S3F72 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6145LQI-S3F72 requirements.

6.How does Aetrix verify that CY8C6145LQI-S3F72 is sourced from the original manufacturer or authorized distributors?

All CY8C6145LQI-S3F72 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6145LQI-S3F72 meets industry standards.

7.What is the process for return or replacement of CY8C6145LQI-S3F72?

All CY8C6145LQI-S3F72 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6145LQI-S3F72, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6145LQI-S3F72 part is unused and in its original packaging.

Return procedure for CY8C6145LQI-S3F72:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6145LQI-S3F72 Tags

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