Infineon Technologies CY8C614AAZI-S2F04
- Part No.:
- CY8C614AAZI-S2F04
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 128-LQFP
- Datasheet:
-
CY8C614AAZI-S2F04.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 128TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,167
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C614AAZI-S2F04 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, integrated CAPSENSE™, hardware crypto accelerator, and ultra-low-power Deep Sleep mode (7 µA with 64 KB SRAM retention), designed for secure, battery-operated IoT edge nodes requiring real-time sensor fusion and wireless connectivity.
For engineers reviewing the CY8C614AAZI-S2F04 datasheet, CY8C614AAZI-S2F04 pinout, CY8C614AAZI-S2F04 application, or CY8C614AAZI-S2F04 equivalent, this device supports concurrent BLE/Wi-Fi coexistence via configurable SCBs, XIP from external QSPI flash with on-the-fly encryption, and deterministic timing control via 32 TCPWMs - critical for industrial sensing, wearable health monitors, and smart home hubs.
Technical Context
The CY8C614AAZI-S2F04 implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles application processing and real-time control while the Cortex-M0+ is dedicated to system-level functions including security boot, power management, and peripheral offload - not user-accessible. Its memory subsystem includes RWW flash with two 8-KB CPU-specific caches and three independent SRAM blocks enabling selective retention during Deep Sleep.
Timing is managed through flexible clock sources: an 8-MHz IMO (±2%), 32-kHz ILO, dual PLLs, FLL, and programmable integer/fractional dividers - allowing precise clock domain isolation between radio, analog, and digital subsystems. The SMIF interface supports octal-mode QSPI at up to 640 Mbps with 4-KB cache and hardware AES-128 encryption/decryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+ (system-reserved); enables real-time deterministic control with secure firmware separation. |
| Memory | 2048 KB flash (RWW), 32 KB AUXflash, 32 KB SFlash, 1024 KB SRAM (3 retention-controllable blocks); supports OTA updates and secure boot partitioning. |
| Power Efficiency | 7 µA Deep Sleep current with 64 KB SRAM retention; enables multi-year battery life in coin-cell-powered sensors. |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), 2 LP comparators active in Deep Sleep, integrated temperature sensor. |
| Digital Interfaces | 13 configurable SCBs (SPI/I²C/UART), USB Full-Speed device, 2 SD/eMMC controllers, QSPI/SMIF with XIP + AES encryption, 32 TCPWMs. |
| Security | Hardware crypto accelerator (AES, SHA, ECC, TRNG), 8 protection contexts, debug/test path disable, boot authentication via hardware hashing. |
| Capacitive Sensing | Infineon CAPSENSE™ CSD with SmartSense™ auto-tuning, >100:1 SNR, liquid-tolerant self/mutual sensing for touch UI in harsh environments. |
Pinout & Package
This device is housed in a 100-ball WLCSP package (0.4-mm pitch, 5.29 × 5.29 mm) optimized for space-constrained wearables and compact IoT modules. Pin assignments are validated per Infineon's official CY8C61x8/A datasheet Rev. *F, Table 4-1 (Page 32).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply Banks | Independent 1.7–3.6 V supplies per bank enable mixed-voltage interfacing (e.g., 1.8-V sensors + 3.3-V radios). |
| VDDD / VDDA | Digital & Analog Core Supplies | Separate domains allow analog noise isolation; VDDA supports precision ADC/CSD operation down to 1.7 V. |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; meets 100-ns minimum pulse width requirement for reliable cold start. |
| SWDCK / SWDIO | Debug Interface | 2-pin Serial Wire Debug port supporting programming, trace, and secure debug lock after production provisioning. |
| SMIF[7:0] | QSPI/SMIF Data Bus | Octal-capable pins support 640 Mbps read throughput; essential for executing code directly from external encrypted flash. |
| SCB[0:12]_SCL/SDA/SCLK/MOSI/MISO/CS | Configurable Serial I/O | Runtime-reconfigurable pins reduce BOM count - single SCB can serve as I²C master for sensors or SPI slave for display drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Smart I/O Boolean Logic | Two 16-pin Smart I/O ports perform GPIO-level logic (AND/OR/XOR) in Deep Sleep - enables wake-on-combination events without CPU wake. |
| Programmable Drive Strength | Configurable 0.5–20 mA drive per GPIO with slew rate control - eliminates external level shifters for driving LEDs or relays directly. |
| Overvoltage-Tolerant Pins | Six pins tolerate 5.5 V input while powered from 1.7–3.6 V - simplifies integration with legacy 5-V peripherals without voltage translators. |
| Segment LCD Driver | Supports up to 101 segments × 8 commons - enables direct drive of segmented displays in thermostats and medical devices without external glass drivers. |
| Audio Subsystem | 2 PDM microphones + 2 I²S channels with TDM mode - enables stereo voice capture and low-latency audio streaming for voice-controlled edge devices. |
Applications
| Smart Wearable Health Monitor | Industrial Wireless Sensor Node |
|---|---|
Use Scenario: Continuous ECG/PPG monitoring with Bluetooth LE telemetry and onboard motion artifact correction. IC Role / Device Role / Timing Role: Dual-core real-time signal processing (M4F) + secure BLE stack execution (M0+), synchronized ADC sampling and TCPWM-driven LED pulsing. Use Value: 7 µA Deep Sleep extends battery life beyond 14 days on a 120-mAh cell; CAPSENSE™ enables dry-electrode contact detection. |
Use Scenario: Battery-powered vibration/temperature node transmitting predictive maintenance data over LoRaWAN or NB-IoT. IC Role / Device Role / Timing Role: Low-power sensor hub aggregating data from MEMS accelerometers and thermistors, then encrypting and packetizing for radio transmission. Use Value: Hardware AES acceleration reduces encryption latency by 8× vs. software-only; 64 KB SRAM retention preserves context across radio sleep cycles. |
| Smart Home Touch Control Panel | Secure Edge Gateway for Building Automation |
Use Scenario: Wall-mounted capacitive touch interface with ambient light adaptive backlight and local voice command preprocessing. IC Role / Device Role / Timing Role: CAPSENSE™ CSD for water-tolerant touch, PDM microphone array for far-field voice, and M4F-based keyword spotting engine. Use Value: SmartSense™ auto-calibration maintains touch accuracy across humidity swings; 2-Msps ADC samples ambient light at 100 Hz for smooth dimming. |
Use Scenario: Protocol-agnostic gateway bridging BACnet MS/TP, KNX, and Zigbee devices with TLS-secured cloud uplink. IC Role / Device Role / Timing Role: Secure boot-enforced trust anchor, crypto-accelerated TLS handshake, and dual SCBs managing concurrent serial fieldbus and wireless interfaces. Use Value: Eight protection contexts isolate protocol stacks; eFuse-based key storage prevents firmware rollback attacks in certified installations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RP2040 | No hardware crypto accelerator, no CAPSENSE™, no Deep Sleep below 200 µA, lacks SMIF/XIP support. | Better suited for cost-sensitive consumer accessories without security or ultra-low-power requirements. | Select only if AES/SHA acceleration, sub-10-µA sleep, or robust capacitive sensing are unnecessary. |
| STM32WB55 | Single Cortex-M4 core with integrated BLE radio; no M0+ companion core, smaller flash (1 MB), no SMIF or segment LCD driver. | Optimized for BLE-centric endpoints; lacks parallel processing capability for sensor fusion + radio + UI. | Prefer when BLE SoC integration outweighs need for dual-core determinism and external flash XIP. |
Compared with RP2040 and STM32WB55, CY8C614AAZI-S2F04 uniquely delivers simultaneous ultra-low-power operation, hardware-enforced security, and programmable analog/digital fabric - making it the only choice for certified industrial edge nodes requiring <10-µA sleep, encrypted firmware updates, and adaptive human-machine interfaces.
Availability
CY8C614AAZI-S2F04 is available at Aetrix Electronics and suitable for smart wearables, industrial wireless sensors, building automation gateways, and secure medical edge devices requiring stable component supply across multi-year production cycles.
Supply support for CY8C614AAZI-S2F04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and quality certification to ISO 9001 and IATF 16949.
The PSOC™ 6 family targets secure, ultra-low-power IoT endpoints - combining programmable analog/digital fabric with Arm dual-core processing to replace discrete signal chains and accelerate time-to-certification for industrial and medical applications.
FAQ
Is CY8C614AAZI-S2F04 pin-compatible with other CY8C61xx variants?
Yes - all CY8C614A devices in the 100-ball WLCSP package share identical pinouts, including CY8C614ABZI-S2F04 and CY8C614ALZI-S2F04. Differences lie in flash size (2048 KB vs. 1024 KB) and SRAM configuration, not physical layout or peripheral mapping.
Does this MCU support external memory execution (XIP) with hardware encryption?
Yes - the SMIF interface enables Execute-In-Place from external quad/octal SPI flash with on-the-fly AES-128 decryption using dedicated crypto hardware, eliminating software overhead and ensuring code integrity without RAM loading.
What debug and programming interfaces are supported?
It supports Serial Wire Debug (SWD) via SWDCK/SWDIO pins, compatible with standard CMSIS-DAP and J-Link probes. Programming is performed through ModusToolbox™ or Infineon's PSoC™ Programmer, with secure debug lock enabled via eFuse provisioning.
Can the CAPSENSE™ subsystem operate during Deep Sleep mode?
Yes - CAPSENSE™ CSD can run autonomously in Deep Sleep using the ILO clock source, detecting touch or proximity events and waking the CPU only upon threshold crossing, maintaining 7 µA system current throughout idle periods.
CY8C614AAZI-S2F04 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 128-LQFP
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 102
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8 SAR, 16x10/12b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614AAZI-S2F04 FAQ
1.How can I place an order for CY8C614AAZI-S2F04 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614AAZI-S2F04 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614AAZI-S2F04 reliable?
The price and inventory of CY8C614AAZI-S2F04 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614AAZI-S2F04 is usually 5 days.
3.What payment methods are accepted for CY8C614AAZI-S2F04?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614AAZI-S2F04 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614AAZI-S2F04?
CY8C614AAZI-S2F04 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614AAZI-S2F04 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614AAZI-S2F04?
For technical support, including CY8C614AAZI-S2F04 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614AAZI-S2F04 requirements.
6.How does Aetrix verify that CY8C614AAZI-S2F04 is sourced from the original manufacturer or authorized distributors?
All CY8C614AAZI-S2F04 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614AAZI-S2F04 meets industry standards.
7.What is the process for return or replacement of CY8C614AAZI-S2F04?
All CY8C614AAZI-S2F04 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614AAZI-S2F04, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614AAZI-S2F04 part is unused and in its original packaging.
Return procedure for CY8C614AAZI-S2F04:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C614AAZI-S2F04 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

