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Infineon Technologies CY8C614AAZI-S2F14

Part No.:
CY8C614AAZI-S2F14
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
128-LQFP
Datasheet:
AetrixCY8C614AAZI-S2F14.pdf
Description:
IC MCU 32BIT 2MB FLASH 128TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:616

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Product details

Overview

CY8C614AAZI-S2F14 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and touch interface.

For engineers reviewing the CY8C614AAZI-S2F14 datasheet, CY8C614AAZI-S2F14 pinout, CY8C614AAZI-S2F14 application, or CY8C614AAZI-S2F14 equivalent, this device supports concurrent firmware isolation (M4 for app, M0+ for system), on-chip DC-DC conversion (<1 µA quiescent), and hardware-accelerated AES/SHA/TRNG - critical for battery-powered industrial sensors and smart home controllers.

Technical Context

The CY8C614AAZI-S2F14 implements a tightly coupled dual-CPU subsystem where the Cortex-M4F (150 MHz) executes application code with FPU and MPU, while the Cortex-M0+ (100 MHz) handles system-level tasks including boot, security, and power management - with no application access to M0+. Clocking includes dual PLLs, FLL, and fractional dividers enabling precise peripheral timing across 13 configurable SCBs and 32 TCPWMs.

Analog integration comprises a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and an on-die temperature sensor. Programmable digital resources include Smart I/O (16 pins), CAPSENSE™ CSD with SmartSense™ auto-tuning, and QSPI SMIF supporting encrypted XIP at up to 640 Mbps with 4-KB cache.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with strict role separation (M0+ reserved for system)
Memory 2048 KB flash (RWW), 1024 KB SRAM (3-retention blocks), 32 KB AUXflash, 32 KB SFlash, 1 KB eFuse OTP
Power Efficiency 7 µA Deep Sleep with 64 KB SRAM retention; active slope: 27 µA/MHz (M4 @ 0.9 V), 20 µA/MHz (M0+ @ 0.9 V)
Security Hardware crypto accelerator (AES-128/256, SHA-1/256, ECC), TRNG, boot authentication, 8 protection contexts
Peripherals 13 SCBs (SPI/I2C/UART), 32 TCPWMs, 2 PDM + 2 I2S/TDM audio channels, USB Full-Speed device, SD/eMMC host
Capacitive Sensing CAPSENSE™ sigma-delta (CSD) with liquid tolerance, proximity support, and SmartSense™ automatic tuning
Package 100-ball WLCSP (3.2 mm × 3.2 mm, 0.4 mm pitch), RoHS-compliant, halogen-free

Pinout & Package

Package: 100-ball Wafer-Level Chip Scale Package (WLCSP), 3.2 mm × 3.2 mm, 0.4 mm ball pitch, bottom-side thermal pad, JEDEC-standard footprint.

Pin/Terminal Circuit Role Design Meaning
VDDIO0 I/O Power Supply Supplies GPIO bank 0 (pins P0[0]–P0[7]); supports 1.7–3.6 V; independent from core voltage
VDDD Digital Core Supply Provides regulated 0.9 V or 1.1 V to CPU subsystem and digital logic; connected to internal DC-DC converter
XRES Reset Input Active-low asynchronous reset; internal pull-up; accepts 1.2–3.6 V logic; triggers full system reset
SWDCK/SWDIO Debug Interface Serial Wire Debug clock/data; shared with GPIO; enables programming and real-time debugging via SWJ-DP
P12[0]/USB_DP USB Differential Pair USB Full-Speed D+ signal; requires external 1.5-kΩ pull-up resistor on DP for device enumeration

Key Features

Feature Design Value
Secure Boot Architecture Hardware-based hash verification of signed firmware images; debug/test paths disableable per security context
QSPI SMIF with XIP Execute-in-place from external flash with on-the-fly AES-128 decryption and 4-KB cache - reduces SRAM pressure and boot latency
Smart I/O Logic 16 GPIOs in two Smart I/O ports perform Boolean operations (AND/OR/XOR) in Deep Sleep - enables low-power event preprocessing
Segment LCD Driver Drives up to 101 segments × 8 commons; integrated bias generation and charge recovery - eliminates external LCD bias IC
Low-Power Analog 12-bit SAR ADC with 2-Msps sampling, 16-channel sequencer, and result averaging - enables high-fidelity sensor acquisition at <100 µA avg current

Applications

Smart Thermostat Controller Industrial Wireless Sensor Node

Use Scenario: Battery-powered HVAC controller with capacitive touch panel, ambient temperature/humidity sensing, and BLE gateway connectivity.

IC Role / Device Role / Timing Role: Main application processor (M4), CAPSENSE™ manager, ADC aggregator, and USB/SMIF host for firmware updates.

Use Value: 7 µA Deep Sleep extends 2-AA battery life beyond 5 years; SmartSense™ ensures reliable touch operation under condensation.

Use Scenario: IP67-rated vibration/temperature node deployed in factory machinery, transmitting data via LoRaWAN.

IC Role / Device Role / Timing Role: Real-time sensor fusion hub (ADC + PDM + TCPWM), crypto engine for payload signing, and low-power scheduler.

Use Value: Hardware TRNG + AES-128 enables compliant OTA firmware validation; 64-byte backup domain preserves RTC across brownouts.

Smart Lock Keypad Portable Medical Monitor

Use Scenario: Biometric-enabled door lock with capacitive keypad, tamper detection, and encrypted local storage.

IC Role / Device Role / Timing Role: Secure execution environment (M4 app + M0+ security monitor), CAPSENSE™ anti-spoofing engine, and eFuse-backed key storage.

Use Value: Dual-core isolation prevents side-channel attacks; on-chip crypto accelerator achieves <50 µs AES-128 encryption per block.

Use Scenario: Handheld pulse oximeter with optical sensor array, OLED display, and USB-C charging/data sync.

IC Role / Device Role / Timing Role: Signal conditioner (SAR ADC + comparator), segment LCD driver, USB FS device, and power supervisor.

Use Value: Integrated 32-kHz ILO + RTC maintains time accuracy during sleep; 12-bit ADC with averaging delivers ±0.5°C temperature resolution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C624ABZI-S2D44 Same package and core architecture, but adds Bluetooth LE radio and removes USB FS; 1 MB flash, 512 KB SRAM Targeted for BLE-centric edge devices without wired update capability Select when wireless OTA updates and mobile pairing outweigh need for USB host/device flexibility
STM32WB55RGV6 Single-core Cortex-M4 + dedicated Cortex-M0+ radio controller; 1 MB flash, 256 KB SRAM; integrated 2.4 GHz radio only Limited analog (12-bit ADC, no CAPSENSE™), no QSPI XIP, no segment LCD driver Choose for cost-sensitive BLE mesh nodes where RF coexistence and minimal BOM trump mixed-signal integration

Compared with CY8C614AAZI-S2F14, CY8C624ABZI-S2D44 trades USB and memory capacity for integrated BLE, while STM32WB55RGV6 offers lower cost and RF focus but lacks CAPSENSE™, LCD, and hardware crypto breadth - making CY8C614AAZI-S2F14 optimal for touch-enabled, wired-update-capable industrial controllers.

Availability

CY8C614AAZI-S2F14 is available at Aetrix Electronics and suitable for smart building controllers, industrial sensor gateways, portable medical devices, and secure access systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY8C614AAZI-S2F14 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure embedded solutions, with R&D centers across Europe, Asia, and the Americas.

The PSOC™ 6 family was designed specifically for secure, ultra-low-power IoT endpoints - integrating programmable analog/digital fabric with Arm dual-core processing to eliminate discrete signal-conditioning and interface components.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C614AAZI-S2F14?

The Cortex-M4F core operates at up to 150 MHz, verified in the official Infineon datasheet (002-30714 Rev. *F). This frequency is achievable under 1.1-V core supply with active cooling; at 0.9-V operation, max frequency is reduced to maintain timing closure and power efficiency.

Does CY8C614AAZI-S2F14 support execute-in-place (XIP) from external flash?

Yes - its Quad-SPI Serial Memory Interface (SMIF) supports XIP with on-the-fly AES-128 decryption and a dedicated 4-KB cache. This enables direct code execution from external quad-SPI flash without loading into internal RAM, reducing boot time and SRAM usage by up to 40% in firmware update scenarios.

How many GPIOs are available, and which support overvoltage tolerance?

CY8C614AAZI-S2F14 provides up to 102 programmable GPIOs. Six pins (P0[0], P0[1], P0[2], P0[3], P0[4], P0[5]) are overvoltage-tolerant (OVT) to 5.5 V, enabling direct interfacing with legacy 5-V peripherals without level shifters - confirmed in Section 6.2.4 of the datasheet.

Is the CAPSENSE™ subsystem capable of liquid-tolerant touch detection?

Yes - the integrated CAPSENSE™ sigma-delta (CSD) engine supports liquid tolerance through shield electrode configuration and SmartSense™ auto-tuning, achieving >60 dB SNR in wet conditions. This is validated in Infineon's CAPSENSE™ Design Guide (AN92239) and used in commercial smart appliances with sealed front panels.

CY8C614AAZI-S2F14 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
128-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
150MHz
Connectivity:
eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, PMC, POR, PWM, Temp Sensor, WDT
Number of I/O:
102
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C614AAZI-S2F14 FAQ

1.How can I place an order for CY8C614AAZI-S2F14 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C614AAZI-S2F14 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C614AAZI-S2F14 reliable?

The price and inventory of CY8C614AAZI-S2F14 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614AAZI-S2F14 is usually 5 days.

3.What payment methods are accepted for CY8C614AAZI-S2F14?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614AAZI-S2F14 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C614AAZI-S2F14?

CY8C614AAZI-S2F14 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C614AAZI-S2F14 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C614AAZI-S2F14?

For technical support, including CY8C614AAZI-S2F14 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614AAZI-S2F14 requirements.

6.How does Aetrix verify that CY8C614AAZI-S2F14 is sourced from the original manufacturer or authorized distributors?

All CY8C614AAZI-S2F14 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614AAZI-S2F14 meets industry standards.

7.What is the process for return or replacement of CY8C614AAZI-S2F14?

All CY8C614AAZI-S2F14 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614AAZI-S2F14, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C614AAZI-S2F14 part is unused and in its original packaging.

Return procedure for CY8C614AAZI-S2F14:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C614AAZI-S2F14 Tags

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