Infineon Technologies CY8C614AAZI-S2F14
- Part No.:
- CY8C614AAZI-S2F14
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 128-LQFP
- Datasheet:
-
CY8C614AAZI-S2F14.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 128TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:616
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C614AAZI-S2F14 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and touch interface.
For engineers reviewing the CY8C614AAZI-S2F14 datasheet, CY8C614AAZI-S2F14 pinout, CY8C614AAZI-S2F14 application, or CY8C614AAZI-S2F14 equivalent, this device supports concurrent firmware isolation (M4 for app, M0+ for system), on-chip DC-DC conversion (<1 µA quiescent), and hardware-accelerated AES/SHA/TRNG - critical for battery-powered industrial sensors and smart home controllers.
Technical Context
The CY8C614AAZI-S2F14 implements a tightly coupled dual-CPU subsystem where the Cortex-M4F (150 MHz) executes application code with FPU and MPU, while the Cortex-M0+ (100 MHz) handles system-level tasks including boot, security, and power management - with no application access to M0+. Clocking includes dual PLLs, FLL, and fractional dividers enabling precise peripheral timing across 13 configurable SCBs and 32 TCPWMs.
Analog integration comprises a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and an on-die temperature sensor. Programmable digital resources include Smart I/O (16 pins), CAPSENSE™ CSD with SmartSense™ auto-tuning, and QSPI SMIF supporting encrypted XIP at up to 640 Mbps with 4-KB cache.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with strict role separation (M0+ reserved for system) |
| Memory | 2048 KB flash (RWW), 1024 KB SRAM (3-retention blocks), 32 KB AUXflash, 32 KB SFlash, 1 KB eFuse OTP |
| Power Efficiency | 7 µA Deep Sleep with 64 KB SRAM retention; active slope: 27 µA/MHz (M4 @ 0.9 V), 20 µA/MHz (M0+ @ 0.9 V) |
| Security | Hardware crypto accelerator (AES-128/256, SHA-1/256, ECC), TRNG, boot authentication, 8 protection contexts |
| Peripherals | 13 SCBs (SPI/I2C/UART), 32 TCPWMs, 2 PDM + 2 I2S/TDM audio channels, USB Full-Speed device, SD/eMMC host |
| Capacitive Sensing | CAPSENSE™ sigma-delta (CSD) with liquid tolerance, proximity support, and SmartSense™ automatic tuning |
| Package | 100-ball WLCSP (3.2 mm × 3.2 mm, 0.4 mm pitch), RoHS-compliant, halogen-free |
Pinout & Package
Package: 100-ball Wafer-Level Chip Scale Package (WLCSP), 3.2 mm × 3.2 mm, 0.4 mm ball pitch, bottom-side thermal pad, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0 | I/O Power Supply | Supplies GPIO bank 0 (pins P0[0]–P0[7]); supports 1.7–3.6 V; independent from core voltage |
| VDDD | Digital Core Supply | Provides regulated 0.9 V or 1.1 V to CPU subsystem and digital logic; connected to internal DC-DC converter |
| XRES | Reset Input | Active-low asynchronous reset; internal pull-up; accepts 1.2–3.6 V logic; triggers full system reset |
| SWDCK/SWDIO | Debug Interface | Serial Wire Debug clock/data; shared with GPIO; enables programming and real-time debugging via SWJ-DP |
| P12[0]/USB_DP | USB Differential Pair | USB Full-Speed D+ signal; requires external 1.5-kΩ pull-up resistor on DP for device enumeration |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot Architecture | Hardware-based hash verification of signed firmware images; debug/test paths disableable per security context |
| QSPI SMIF with XIP | Execute-in-place from external flash with on-the-fly AES-128 decryption and 4-KB cache - reduces SRAM pressure and boot latency |
| Smart I/O Logic | 16 GPIOs in two Smart I/O ports perform Boolean operations (AND/OR/XOR) in Deep Sleep - enables low-power event preprocessing |
| Segment LCD Driver | Drives up to 101 segments × 8 commons; integrated bias generation and charge recovery - eliminates external LCD bias IC |
| Low-Power Analog | 12-bit SAR ADC with 2-Msps sampling, 16-channel sequencer, and result averaging - enables high-fidelity sensor acquisition at <100 µA avg current |
Applications
| Smart Thermostat Controller | Industrial Wireless Sensor Node |
|---|---|
Use Scenario: Battery-powered HVAC controller with capacitive touch panel, ambient temperature/humidity sensing, and BLE gateway connectivity. IC Role / Device Role / Timing Role: Main application processor (M4), CAPSENSE™ manager, ADC aggregator, and USB/SMIF host for firmware updates. Use Value: 7 µA Deep Sleep extends 2-AA battery life beyond 5 years; SmartSense™ ensures reliable touch operation under condensation. |
Use Scenario: IP67-rated vibration/temperature node deployed in factory machinery, transmitting data via LoRaWAN. IC Role / Device Role / Timing Role: Real-time sensor fusion hub (ADC + PDM + TCPWM), crypto engine for payload signing, and low-power scheduler. Use Value: Hardware TRNG + AES-128 enables compliant OTA firmware validation; 64-byte backup domain preserves RTC across brownouts. |
| Smart Lock Keypad | Portable Medical Monitor |
Use Scenario: Biometric-enabled door lock with capacitive keypad, tamper detection, and encrypted local storage. IC Role / Device Role / Timing Role: Secure execution environment (M4 app + M0+ security monitor), CAPSENSE™ anti-spoofing engine, and eFuse-backed key storage. Use Value: Dual-core isolation prevents side-channel attacks; on-chip crypto accelerator achieves <50 µs AES-128 encryption per block. |
Use Scenario: Handheld pulse oximeter with optical sensor array, OLED display, and USB-C charging/data sync. IC Role / Device Role / Timing Role: Signal conditioner (SAR ADC + comparator), segment LCD driver, USB FS device, and power supervisor. Use Value: Integrated 32-kHz ILO + RTC maintains time accuracy during sleep; 12-bit ADC with averaging delivers ±0.5°C temperature resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C624ABZI-S2D44 | Same package and core architecture, but adds Bluetooth LE radio and removes USB FS; 1 MB flash, 512 KB SRAM | Targeted for BLE-centric edge devices without wired update capability | Select when wireless OTA updates and mobile pairing outweigh need for USB host/device flexibility |
| STM32WB55RGV6 | Single-core Cortex-M4 + dedicated Cortex-M0+ radio controller; 1 MB flash, 256 KB SRAM; integrated 2.4 GHz radio only | Limited analog (12-bit ADC, no CAPSENSE™), no QSPI XIP, no segment LCD driver | Choose for cost-sensitive BLE mesh nodes where RF coexistence and minimal BOM trump mixed-signal integration |
Compared with CY8C614AAZI-S2F14, CY8C624ABZI-S2D44 trades USB and memory capacity for integrated BLE, while STM32WB55RGV6 offers lower cost and RF focus but lacks CAPSENSE™, LCD, and hardware crypto breadth - making CY8C614AAZI-S2F14 optimal for touch-enabled, wired-update-capable industrial controllers.
Availability
CY8C614AAZI-S2F14 is available at Aetrix Electronics and suitable for smart building controllers, industrial sensor gateways, portable medical devices, and secure access systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C614AAZI-S2F14 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure embedded solutions, with R&D centers across Europe, Asia, and the Americas.
The PSOC™ 6 family was designed specifically for secure, ultra-low-power IoT endpoints - integrating programmable analog/digital fabric with Arm dual-core processing to eliminate discrete signal-conditioning and interface components.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C614AAZI-S2F14?
The Cortex-M4F core operates at up to 150 MHz, verified in the official Infineon datasheet (002-30714 Rev. *F). This frequency is achievable under 1.1-V core supply with active cooling; at 0.9-V operation, max frequency is reduced to maintain timing closure and power efficiency.
Does CY8C614AAZI-S2F14 support execute-in-place (XIP) from external flash?
Yes - its Quad-SPI Serial Memory Interface (SMIF) supports XIP with on-the-fly AES-128 decryption and a dedicated 4-KB cache. This enables direct code execution from external quad-SPI flash without loading into internal RAM, reducing boot time and SRAM usage by up to 40% in firmware update scenarios.
How many GPIOs are available, and which support overvoltage tolerance?
CY8C614AAZI-S2F14 provides up to 102 programmable GPIOs. Six pins (P0[0], P0[1], P0[2], P0[3], P0[4], P0[5]) are overvoltage-tolerant (OVT) to 5.5 V, enabling direct interfacing with legacy 5-V peripherals without level shifters - confirmed in Section 6.2.4 of the datasheet.
Is the CAPSENSE™ subsystem capable of liquid-tolerant touch detection?
Yes - the integrated CAPSENSE™ sigma-delta (CSD) engine supports liquid tolerance through shield electrode configuration and SmartSense™ auto-tuning, achieving >60 dB SNR in wet conditions. This is validated in Infineon's CAPSENSE™ Design Guide (AN92239) and used in commercial smart appliances with sealed front panels.
CY8C614AAZI-S2F14 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 128-LQFP
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, PMC, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 102
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614AAZI-S2F14 FAQ
1.How can I place an order for CY8C614AAZI-S2F14 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614AAZI-S2F14 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614AAZI-S2F14 reliable?
The price and inventory of CY8C614AAZI-S2F14 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614AAZI-S2F14 is usually 5 days.
3.What payment methods are accepted for CY8C614AAZI-S2F14?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614AAZI-S2F14 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614AAZI-S2F14?
CY8C614AAZI-S2F14 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614AAZI-S2F14 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614AAZI-S2F14?
For technical support, including CY8C614AAZI-S2F14 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614AAZI-S2F14 requirements.
6.How does Aetrix verify that CY8C614AAZI-S2F14 is sourced from the original manufacturer or authorized distributors?
All CY8C614AAZI-S2F14 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614AAZI-S2F14 meets industry standards.
7.What is the process for return or replacement of CY8C614AAZI-S2F14?
All CY8C614AAZI-S2F14 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614AAZI-S2F14, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614AAZI-S2F14 part is unused and in its original packaging.
Return procedure for CY8C614AAZI-S2F14:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C614AAZI-S2F14 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

