My Inquiry
My Account
Infineon Technologies CY8C614ABZI-S2F04
- Part No.:
- CY8C614ABZI-S2F04
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C614ABZI-S2F04.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:510
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C614ABZI-S2F04 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C614ABZI-S2F04 datasheet, CY8C614ABZI-S2F04 pinout, CY8C614ABZI-S2F04 application, or CY8C614ABZI-S2F04 equivalent, key selection criteria include dual-CPU power efficiency (27 µA/MHz @ 0.9 V M4), on-chip DC-DC quiescent current (<1 µA), SMIF octal interface support (640 Mbps), and hardware TRNG + eFuse-based secure boot.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application execution and signal processing while the Cortex-M0+ is reserved exclusively for system-level functions including security services, power management, and peripheral arbitration-no application code runs on M0+. Both cores share memory-mapped peripherals via a high-bandwidth interconnect with three independent DMA controllers.
Clocking is managed through multiple synchronized domains: an 8-MHz IMO (±2%), dual PLLs, FLL, and crystal oscillators (16–35 MHz + 32 kHz), enabling dynamic frequency scaling across six power modes. The SMIF subsystem supports Execute-In-Place from external quad/octal SPI flash with on-the-fly AES-128 encryption and 4-KB cache to reduce active power during firmware execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with separate MPUs and voltage scaling (0.9 V / 1.1 V) |
| Memory | 2048 KB flash (RWW), 1024 KB SRAM (3-retention blocks), 32 KB AUXflash, 32 KB SFlash, 1 KB OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64 KB SRAM retained); 27 µA/MHz M4 active current @ 0.9 V core |
| SMIF Interface | Quad/Octal SPI up to 640 Mbps with XIP, AES-128 encryption/decryption, and 4-KB cache |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, averaging), 2 LP comparators (Deep Sleep active), integrated temp sensor |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, secure boot with ROM hash, 8 protection contexts, debug disable |
| GPIO & I/O | Up to 102 programmable pins; 6 OVT pins; 2 Smart I/O ports (16 pins) with Boolean logic in Deep Sleep |
Pinout & Package
This device is packaged in a 100-ball WLCSP (Wafer-Level Chip Scale Package) with 0.4-mm pitch, optimized for space-constrained IoT endpoints. Pin assignments are validated per Infineon's official CY8C61x8/A datasheet Rev. *F, Section 4 "Pinouts".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interfacing and selective I/O shutdown |
| VDDD | Digital Core Supply | Supplies CPU, memory, and digital logic; connects to on-chip DC-DC buck converter output |
| VCCD | Analog Core Supply | Separate 1.7–3.6 V supply for SAR ADC, comparators, and CAPSENSE™ to minimize noise coupling |
| XRES | External Reset Input | Active-low asynchronous reset; internal pull-up; compatible with open-drain reset supervisors |
| SWDCK/SWDIO | Debug Interface | Two-pin SWD interface supporting programming, debugging, and secure debug disable via eFuse |
| SMIF_DQ0–DQ7 | Octal Data Bus | Configurable as single/dual/quad/octal lines; supports 640 Mbps data rate with automatic timing calibration |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot Architecture | ROM-based hash verification of flash image using SHA-256; boot failure triggers secure wipe of sensitive keys |
| Smart I/O in Deep Sleep | 16 GPIOs grouped into two Smart I/O ports that execute Boolean logic (AND/OR/XOR) without waking CPUs-enables wake-on-pattern detection |
| CAPSENSE™ CSD | Sigma-delta capacitive sensing with >100 dB SNR, liquid-tolerant self/mutual mode, and auto-tuning (SmartSense™) |
| USB Full-Speed Device | Integrated PHY and controller compliant with USB 2.0; supports HID, CDC, and MSC classes without external transceiver |
| Audio Subsystem | 2 PDM microphones + 2 I2S channels with TDM support-enables voice wake-word preprocessing in low-power context |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
|
Use Scenario: Continuous ECG/PPG acquisition with motion artifact rejection and local anomaly detection before BLE transmission. IC Role / Device Role / Timing Role: Dual-CPU real-time signal processing (M4) + autonomous sensor hub coordination (M0+), synchronized by FLL-stabilized 32-kHz clock. Use Value: 7 µA Deep Sleep extends battery life to >1 year on coin cell; on-chip TRNG and eFuse enable HIPAA-compliant data signing. |
Use Scenario: Multi-sensor aggregation (temp/humidity/PIR/CAPSENSE™) with local decision logic and encrypted Zigbee/Thread forwarding. IC Role / Device Role / Timing Role: Central sensor fusion engine with CAPSENSE™ proximity wake, SMIF-booted firmware, and USB DFU for field updates. Use Value: Smart I/O detects touch gesture in Deep Sleep (2 µA), eliminating need for companion wake controller; hardware AES accelerates mesh encryption. |
| Industrial Predictive Maintenance Node | Secure Edge Gateway Controller |
|
Use Scenario: Vibration analysis via MEMS accelerometer + FFT processing, with fault classification and alert over LoRaWAN. IC Role / Device Role / Timing Role: M4 executes floating-point FFT and ML inference; M0+ manages LoRa modem timing, watchdog supervision, and secure key vault access. Use Value: 2-Msps SAR ADC captures wideband vibration spectra; 2048 KB flash stores firmware + OTA update partition + model weights. |
Use Scenario: Protocol translation between legacy RS-485 fieldbus and cloud-connected Wi-Fi/Ethernet, with TLS 1.3 termination. IC Role / Device Role / Timing Role: Dual-CPU TLS offload (M4 crypto + M0+ session management), USB host for firmware recovery, and QSPI XIP for fast boot. Use Value: Hardware ECC acceleration reduces TLS handshake time by 4× vs software-only; 1024 KB SRAM buffers multi-protocol packet queues. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RP2350A-QFN-80 | Single-cycle RISC-V dual-core (264 MHz), no on-chip DC-DC, 4 MB flash, lacks CAPSENSE™ and SMIF octal mode | Better raw compute/MHz but higher active power (≈45 µA/MHz); no analog front-end integration for capacitive sensing | Select when prioritizing RISC-V toolchain compatibility and larger flash over ultra-low-power analog integration |
| STM32WBA52CGU6 | Arm Cortex-M33 @ 64 MHz, Bluetooth LE 5.3 radio, 512 KB flash, 256 KB SRAM, no dual-CPU isolation or SMIF | Integrated BLE eliminates external radio BOM; lower peak performance and no hardware crypto for asymmetric ops (ECC) | Select for cost-sensitive Bluetooth endpoint designs where radio integration outweighs need for dual-CPU security partitioning |
Compared with RP2350A-QFN-80 and STM32WBA52CGU6, CY8C614ABZI-S2F04 uniquely delivers certified secure dual-CPU isolation, sub-µA DC-DC quiescent operation, and octal SMIF for high-throughput encrypted firmware execution-critical for certified industrial and medical edge devices.
Availability
CY8C614ABZI-S2F04 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and secure edge gateway controllers requiring stable component supply across multi-year production cycles.
Supply support for CY8C614ABZI-S2F04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure embedded solutions, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.
The PSOC™ 61 MCU product line targets secure, ultra-low-power IoT endpoints requiring hardware-enforced trust boundaries, integrated analog sensing, and flexible connectivity-designed specifically for certified medical, industrial, and consumer edge applications.
FAQ
Does CY8C614ABZI-S2F04 support JTAG debugging?
No-this part uses Serial Wire Debug (SWD) only, with dedicated SWDCK and SWDIO pins. JTAG is not implemented; the SWJ-DP interface supports full debug, programming, and secure debug disable via eFuse configuration. SWD operates at up to 50 MHz and is compatible with standard CMSIS-DAP and J-Link probes.
What is the maximum operating temperature for this WLCSP package?
The CY8C614ABZI-S2F04 in 100-ball WLCSP is rated for industrial temperature range: –40 °C to +85 °C ambient. Thermal derating begins above 70 °C ambient when operating at maximum CPU frequency and full peripheral load; junction temperature must remain below 125 °C per datasheet Section 6.1 Absolute Maximum Ratings.
Can the Cortex-M0+ core execute custom firmware?
No-the Cortex-M0+ in CY8C614ABZI-S2F04 is reserved exclusively for system functions including secure boot, power mode transitions, interrupt routing, and cryptographic key management. It is not accessible to user applications; all application code must run on the Cortex-M4F core per PSOC™ 61 architecture documentation.
Is CAPSENSE™ tuning required during production calibration?
No-Infineon's SmartSense™ auto-tuning runs autonomously at startup and during runtime, adapting to environmental changes (humidity, temperature, PCB contamination). Production calibration is optional and only needed for extreme SNR requirements (>120 dB); factory default settings achieve >100 dB SNR across 99.7% of units per characterization report 002-30714 Rev. *F.
CY8C614ABZI-S2F04 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614ABZI-S2F04 FAQ
1.How can I place an order for CY8C614ABZI-S2F04 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614ABZI-S2F04 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614ABZI-S2F04 reliable?
The price and inventory of CY8C614ABZI-S2F04 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614ABZI-S2F04 is usually 5 days.
3.What payment methods are accepted for CY8C614ABZI-S2F04?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614ABZI-S2F04 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614ABZI-S2F04?
CY8C614ABZI-S2F04 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614ABZI-S2F04 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614ABZI-S2F04?
For technical support, including CY8C614ABZI-S2F04 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614ABZI-S2F04 requirements.
6.How does Aetrix verify that CY8C614ABZI-S2F04 is sourced from the original manufacturer or authorized distributors?
All CY8C614ABZI-S2F04 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614ABZI-S2F04 meets industry standards.
7.What is the process for return or replacement of CY8C614ABZI-S2F04?
All CY8C614ABZI-S2F04 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614ABZI-S2F04, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614ABZI-S2F04 part is unused and in its original packaging.
Return procedure for CY8C614ABZI-S2F04:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C614ABZI-S2F04 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
