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Infineon Technologies CY8C614ABZI-S2F44
- Part No.:
- CY8C614ABZI-S2F44
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C614ABZI-S2F44.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,185
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Product details
Overview
CY8C614ABZI-S2F44 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and local decision-making.
For engineers reviewing the CY8C614ABZI-S2F44 datasheet, CY8C614ABZI-S2F44 pinout, CY8C614ABZI-S2F44 application, or CY8C614ABZI-S2F44 equivalent, this device supports concurrent firmware isolation (M4 for application, M0+ for system services), on-the-fly encrypted XIP from external flash, and capacitive touch with liquid tolerance-key selection criteria for battery-powered industrial HMI and smart sensor gateways.
Technical Context
The CY8C614ABZI-S2F44 implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application code at up to 150 MHz with FPU and MPU, while the Cortex-M0+ runs at 100 MHz exclusively for system-level tasks including security boot, power management, and interrupt arbitration-no application code execution permitted on M0+.
Its programmable analog-digital fabric includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and CAPSENSE™ CSD with SmartSense™ auto-tuning. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), dual PLLs, and FLL for flexible low-jitter peripheral timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with hardware IPC and independent MPUs for secure firmware partitioning |
| Memory | 2048 KB flash (RWW), 1024 KB SRAM (3-retention blocks), 32 KB AUXflash, 32 KB SFlash, and 1 KB OTP eFuse for key storage |
| Power Efficiency | 7 µA Deep Sleep current with 64 KB SRAM retention; active slope of 27 µA/MHz (M4 @ 0.9 V) enables multi-year battery life in wake-on-event designs |
| Secure Features | Hardware crypto accelerator (AES-128/256, ECC, SHA-256), TRNG, boot authentication via ROM hash, and 8 configurable protection contexts |
| Peripherals | 13 SCBs (SPI/I²C/UART), 2 PDM + 2 I²S audio channels, 32 TCPWMs, QSPI/SMIF with 4 KB cache and on-the-fly AES encryption, USB FS device |
| Capacitive Sensing | CAPSENSE™ sigma-delta with >100 dB SNR, self/mutual sensing support, and SmartSense™ auto-calibration-enables robust touch interfaces under moisture or EMI |
| Package | 44-pin WLCSP (4.2 mm × 4.2 mm, 0.4 mm pitch), rated for industrial temperature range (–40°C to +85°C) |
Pinout & Package
Package: 44-ball Wafer-Level Chip Scale Package (WLCSP), 4.2 mm × 4.2 mm, 0.4 mm ball pitch, Pb-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0 | I/O Power Supply | Supplies GPIO bank 0 (pins P0[0]–P0[7]); supports 1.7–3.6 V; independent from core voltage for level-shifting flexibility |
| VDDA | Analog Power | Separate 1.7–3.6 V supply for SAR ADC, comparators, and CAPSENSE™-reduces noise coupling into precision analog paths |
| XRES | Reset Input | Active-low asynchronous reset; internal pull-up; accepts 1.2–3.6 V logic; triggers full system reset including memory and peripherals |
| SWDIO / SWCLK | Debug Interface | Two-pin SWD interface for programming and debug; accessible in all non-Hibernate modes; supports secure debug disable |
| P12[0]–P12[3] | CAPSENSE™ Segments | Dedicated GPIOs with integrated CSD modulator/demodulator; support mutual/self-capacitance sensing with automatic shield drive |
| USB_DP / USB_DM | USB Physical Layer | Differential pair for Full-Speed USB 2.0 device operation; integrated transceivers eliminate need for external PHY |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot Architecture | ROM-based hash verification of signed flash images using SHA-256 and ECDSA; prevents unauthorized firmware execution at power-on |
| Smart I/O Boolean Logic | 16 GPIOs across two Smart I/O ports perform real-time AND/OR/XOR/NOT operations in Deep Sleep-enables wake-on-combination events without CPU wake |
| QSPI Execute-in-Place (XIP) | Direct code execution from external quad-SPI flash with hardware AES-128 decryption and 4 KB instruction cache-reduces SRAM footprint by >60% in OTA-updatable firmware |
| Low-Power Analog Subsystem | 12-bit SAR ADC with 2 Msps sampling, 16-channel sequencer, and on-chip result averaging-delivers <1 LSB INL over temperature for sensor node calibration |
| Dynamic Voltage Scaling | User-selectable core voltage (0.9 V or 1.1 V) per CPU; enables trade-off between performance (150 MHz @ 1.1 V) and efficiency (27 µA/MHz @ 0.9 V) |
Applications
| Industrial Wireless Sensor Node | Smart Home Touch Gateway |
|---|---|
|
Use Scenario: Battery-powered vibration/temperature node transmitting data via BLE or LoRaWAN every 5 minutes. IC Role / Device Role / Timing Role: Main controller executing sensor fusion, secure OTA updates, and low-power scheduling; uses Deep Sleep mode with RTC-triggered wake and Smart I/O for wake-on-threshold events. Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends coin-cell life beyond 5 years; hardware crypto ensures firmware integrity during remote updates. |
Use Scenario: Wall-mounted control panel with capacitive sliders, LED indicators, and Zigbee/Thread connectivity. IC Role / Device Role / Timing Role: Single-chip HMI controller handling CAPSENSE™ touch, RGB LED PWM dimming, USB-CDC for diagnostics, and secure wireless stack co-processing. Use Value: Integrated CAPSENSE™ CSD with liquid tolerance eliminates false triggers in humid kitchens; 32 TCPWMs enable simultaneous smooth LED fades and motor control outputs. |
| Medical Wearable Monitor | Asset Tracking Beacon |
|
Use Scenario: Disposable patch monitoring heart rate and skin temperature, transmitting alerts via Bluetooth LE. IC Role / Device Role / Timing Role: Signal acquisition hub: PDM mic input, analog temp sensor readout, CAPSENSE™ electrode contact detection, and BLE link management. Use Value: Dual ADC inputs + PDM/I²S audio subsystem allow synchronized biometric capture; on-chip TRNG and crypto enable HIPAA-compliant data encryption before transmission. |
Use Scenario: GPS-denied indoor asset tag reporting location via UWB or BLE AoA, powered by energy harvesting. IC Role / Device Role / Timing Role: Ultra-low-power coordinator: wakes on motion (accelerometer interrupt), reads sensors, encrypts payload, and transmits via BLE advertising packets. Use Value: 20 µA/MHz active current @ 0.9 V core enables operation from microwatt harvesters; backup domain with RTC maintains timekeeping during intermittent power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RP2040 | No hardware crypto accelerator, no dedicated M0+ system core, no CAPSENSE™, no QSPI XIP with encryption; relies on software AES and external flash controllers | Lacks built-in secure boot, analog subsystem, and capacitive sensing-requires external components for medical/industrial compliance | Choose RP2040 only for cost-sensitive, non-secure, non-analog-intensive applications where open-source toolchain priority outweighs certification needs |
| STM32U575 | Single-core Cortex-M33 with TrustZone; lower max clock (160 MHz); 2 MB flash but only 786 KB SRAM; no integrated CAPSENSE™ or Smart I/O | Strong security via TrustZone and PSA Level 3, but requires external touch controller and lacks Deep Sleep GPIO logic-less optimal for event-driven HMI | Prefer STM32U575 when PSA-certified secure enclave and high-speed USB HS are mandatory, and capacitive sensing is handled externally |
Compared with RP2040 and STM32U575, the CY8C614ABZI-S2F44 uniquely integrates dual-core isolation, hardware-accelerated crypto, CAPSENSE™, and Smart I/O-delivering certified security, analog integration, and sub-µA event processing in one WLCSP package.
Availability
CY8C614ABZI-S2F44 is available at Aetrix Electronics and suitable for industrial wireless sensor nodes, smart home touch gateways, medical wearables, and asset tracking beacons requiring stable component supply, long-term lifecycle assurance, and qualified automotive/industrial-grade packaging.
Supply support for CY8C614ABZI-S2F44 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure embedded solutions, with global manufacturing and qualification to AEC-Q100 and IEC 61508 standards.
The PSOC™ 6 family was designed specifically for secure, ultra-low-power IoT endpoints-combining programmable analog/digital fabric with Arm dual-core architecture to eliminate external components in edge intelligence applications.
FAQ
Does CY8C614ABZI-S2F44 support JTAG debugging?
No-this device uses Serial Wire Debug (SWD) only, with SWDIO and SWCLK pins. JTAG is not implemented; debug access is limited to two-wire SWD compliant with ARM CoreSight. The SWJ-DP interface supports both SWD and JTAG protocols, but the silicon disables JTAG TAP logic permanently after factory configuration to reduce attack surface.
What is the maximum operating frequency of the Cortex-M4F core?
The Cortex-M4F core operates at up to 150 MHz when powered at 1.1 V, and up to 100 MHz when powered at 0.9 V. Frequency scaling is controlled by the System Clock Configuration block and requires corresponding voltage regulator setup; exceeding 150 MHz violates absolute maximum ratings and causes undefined behavior.
Can the CAPSENSE™ subsystem function in Deep Sleep mode?
Yes-CAPSENSE™ CSD can operate in Deep Sleep mode using the low-power comparator and dedicated CSD clock source. It supports wake-on-touch with <5 µA additional current draw and maintains baseline tracking via hardware auto-calibration without waking the CPU.
Is external flash required for QSPI XIP functionality?
Yes-QSPI XIP requires an external quad-SPI NOR flash connected to the SMIF interface. The CY8C614ABZI-S2F44 provides hardware AES-128 decryption, 4 KB instruction cache, and octal-mode support (up to 640 Mbps), but does not include embedded flash large enough for typical XIP applications-external flash is mandatory for execute-in-place operation.
CY8C614ABZI-S2F44 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614ABZI-S2F44 FAQ
1.How can I place an order for CY8C614ABZI-S2F44 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614ABZI-S2F44 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614ABZI-S2F44 reliable?
The price and inventory of CY8C614ABZI-S2F44 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614ABZI-S2F44 is usually 5 days.
3.What payment methods are accepted for CY8C614ABZI-S2F44?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614ABZI-S2F44 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614ABZI-S2F44?
CY8C614ABZI-S2F44 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614ABZI-S2F44 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614ABZI-S2F44?
For technical support, including CY8C614ABZI-S2F44 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614ABZI-S2F44 requirements.
6.How does Aetrix verify that CY8C614ABZI-S2F44 is sourced from the original manufacturer or authorized distributors?
All CY8C614ABZI-S2F44 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614ABZI-S2F44 meets industry standards.
7.What is the process for return or replacement of CY8C614ABZI-S2F44?
All CY8C614ABZI-S2F44 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614ABZI-S2F44, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614ABZI-S2F44 part is unused and in its original packaging.
Return procedure for CY8C614ABZI-S2F44:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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