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Infineon Technologies CY8C614AFNI-S2F03T
- Part No.:
- CY8C614AFNI-S2F03T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-UFBGA, WLCSP
- Datasheet:
-
CY8C614AFNI-S2F03T.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,285
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Product details
Overview
CY8C614AFNI-S2F03T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, USB FS, QSPI/XIP, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and touch interface.
For engineers reviewing the CY8C614AFNI-S2F03T datasheet, CY8C614AFNI-S2F03T pinout, CY8C614AFNI-S2F03T application, or CY8C614AFNI-S2F03T equivalent, key selection criteria include dual-CPU power efficiency (27 µA/MHz @ 0.9 V M4), on-chip DC-DC quiescent current (<1 µA), SMIF octal interface support (640 Mbps), and hardware-accelerated AES/SHA/TRNG for secure boot and OTA updates.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application execution and signal processing while the Cortex-M0+ is reserved exclusively for system-level functions including security monitoring, interrupt arbitration, and low-power state management - not user application code. Memory protection units (MPUs) enforce isolation between cores and firmware domains.
Its clock architecture integrates two PLLs, an FLL, and programmable integer/fractional dividers to independently scale CPU, peripheral, and SMIF clocks. The SMIF subsystem supports Execute-In-Place (XIP) from external quad/octal SPI flash with on-the-fly AES-128 decryption and a dedicated 4-KB cache to reduce active memory fetches and dynamic power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with independent MPUs and voltage scaling (0.9 V / 1.1 V) |
| Memory | 2048 KB flash (RWW), 1024 KB SRAM (3-retention blocks), 32 KB AUXflash, 32 KB SFlash, 2×8 KB CPU caches |
| Low-Power Performance | 7 µA Deep Sleep current with 64 KB SRAM retention; 27 µA/MHz M4 active current @ 0.9 V core |
| SMIF Interface | Quad/Octal SPI with XIP, on-the-fly AES-128 decryption, 4-KB cache, up to 640 Mbps throughput |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, averaging), 2 LP comparators (Deep Sleep active), built-in temp sensor |
| Security | Hardware crypto accelerator (AES-128/256, SHA-1/256, ECC), TRNG, boot authentication, 8 protection contexts |
| GPIO & Sensing | Up to 102 GPIOs; 6 OVT pins; Smart I/O (16-pin Boolean logic in Deep Sleep); CAPSENSE™ CSD with SmartSense™ auto-tuning |
Pinout & Package
This device is packaged in a 100-ball WLCSP (Wafer-Level Chip Scale Package) with 0.4 mm pitch, optimized for space-constrained IoT endpoints such as wearables and smart sensors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply Banks | Independent 1.7–3.6 V supplies per bank enable mixed-voltage interfacing (e.g., 1.8 V sensor + 3.3 V radio) |
| VDDD | Digital Core Supply | Supplies M4/M0+ cores and digital logic; connects to on-chip DC-DC buck converter output |
| VCCD | Analog Core Supply | Separate 1.7–3.6 V supply for SAR ADC, comparators, and CAPSENSE™ to minimize noise coupling |
| XRES | External Reset Input | Active-low asynchronous reset; internal pull-up; compatible with open-drain supervisors |
| SWDCK/SWDIO | Debug Interface | 2-pin SWD interface for programming and debug; accessible in most power modes except Hibernate |
| USB_DP/USB_DM | USB Full-Speed PHY | Differential pair compliant with USB 2.0 FS (12 Mbps); internal termination and pull-ups configurable via firmware |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot Architecture | Hardware-hashed authentication of signed firmware images prevents unauthorized code execution at boot |
| Smart I/O in Deep Sleep | 16-pin Boolean logic engine remains active during Deep Sleep to preprocess GPIO events without waking CPUs |
| Dynamic Voltage Scaling | User-selectable 0.9 V / 1.1 V core voltage enables trade-off between performance (150 MHz M4) and ultra-low active current |
| CAPSENSE™ CSD | Sigma-delta sensing with >100 dB SNR, liquid-tolerant operation, and hardware-accelerated SmartSense™ tuning |
| SMIF Octal Mode | Octal DTR interface doubles bandwidth vs quad SPI, enabling fast XIP from high-density external flash without external bus expansion |
Applications
| Smart Wearable Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Compact wrist-worn device aggregating PPG, accelerometer, and ambient light data with capacitive touch UI. IC Role / Device Role / Timing Role: Dual-core MCU executes real-time sensor fusion (M4) while M0+ manages CAPSENSE™ gestures and USB HID reporting. Use Value: 7 µA Deep Sleep with 64 KB retained SRAM enables multi-week battery life; Smart I/O processes touch wake events without CPU wake-up. |
Use Scenario: Battery-powered wireless node monitoring temperature, humidity, and vibration in factory machinery. IC Role / Device Role / Timing Role: Acts as sensor hub and secure edge processor-collects analog/digital inputs, runs local anomaly detection, and signs telemetry before BLE transmission. Use Value: Hardware crypto accelerator offloads AES-256 signing from M4, reducing latency and power; on-chip DC-DC extends battery runtime by >30% vs LDO-only solutions. |
| Smart Home Touch Panel | Medical Patch Monitor |
|
Use Scenario: Wall-mounted control panel with segmented LCD, proximity wake, and multi-gesture touch interface. IC Role / Device Role / Timing Role: Manages CAPSENSE™ self/mutual sensing, drives 101-segment LCD, and handles encrypted Zigbee/Thread stack via SCBs. Use Value: Integrated segment LCD driver eliminates external display controller; CAPSENSE™ SmartSense™ auto-compensates for condensation and glove use. |
Use Scenario: Disposable ECG/SpO₂ patch transmitting clinical-grade waveforms via Bluetooth Low Energy. IC Role / Device Role / Timing Role: Performs analog front-end conditioning (SAR ADC + LP comparators), real-time R-peak detection, and secure firmware updates over BLE. Use Value: 12-bit 2-Msps SAR ADC with hardware averaging achieves <1 µV RMS noise floor; TRNG + secure boot meets IEC 62304 Class B requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FMI-D52 | Same PSOC™ 6 platform but with 124-ball BGA package, no WLCSP; includes additional USB HS PHY and 2 MB flash | Better suited for board-level designs needing USB host capability and higher I/O count; not drop-in compatible due to package and pinout mismatch | Select when PCB layout allows BGA and USB host functionality is required; not suitable for ultra-thin wearable form factors. |
| STM32WB55RGV | Single-core Cortex-M4 + dedicated Cortex-M0+ radio coprocessor; lacks integrated CAPSENSE™, SMIF octal mode, and hardware AES-256 | Optimized for BLE-centric applications; requires external touch controller and flash for XIP; lower analog integration | Choose for cost-sensitive BLE endpoint designs where touch UI and external flash XIP are handled separately. |
Compared with CY8C614AFNI-S2F03T, CY8C6247FMI-D52 offers higher I/O density and USB HS but sacrifices WLCSP compactness, while STM32WB55RGV reduces BOM cost and simplifies RF design but adds external components for touch and secure flash execution.
Availability
CY8C614AFNI-S2F03T is available at Aetrix Electronics and suitable for smart wearables, industrial sensor nodes, medical patches, and smart home touch panels requiring stable component supply, long-term lifecycle support, and qualified wafer lots for production ramp.
Supply support for CY8C614AFNI-S2F03T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure embedded solutions, with global manufacturing and quality certifications including ISO/TS 16949 and ISO 9001.
This part belongs to the PSOC™ 61 MCU product line-designed specifically for secure, battery-operated IoT endpoints demanding concurrent real-time processing, ultra-low-power operation, and integrated human interface (CAPSENSE™, LCD, audio).
FAQ
Does CY8C614AFNI-S2F03T support USB device enumeration without external components?
Yes. The part integrates a full-speed USB 2.0 device PHY with internal 1.5-kΩ pull-up resistor on D+, configurable 3.3-V regulator output for VBUS sensing, and on-chip transceiver termination. No external resistors, level shifters, or voltage regulators are required for basic HID or CDC class operation.
What is the maximum supported external flash size for SMIF XIP mode?
The SMIF controller supports up to 2 GB of external flash in XIP mode using octal DTR interface. Address space is mapped into the CY8C614AFNI-S2F03T's 32-bit memory map starting at 0x18000000, with hardware decryption applied transparently to all fetches from this region.
Can the Cortex-M0+ core execute custom firmware in CY8C614AFNI-S2F03T?
No. In PSOC™ 61 devices, the Cortex-M0+ is reserved exclusively for system-level firmware-including interrupt routing, security monitor, and power management-and is not accessible to user applications. Only the Cortex-M4F core runs customer code.
How does CAPSENSE™ CSD achieve liquid tolerance on this device?
Liquid tolerance is achieved through sigma-delta modulation with adaptive baseline tracking, shield electrode support, and hardware-based noise rejection. The CSD block dynamically adjusts scan parameters and uses differential sensing to distinguish finger touch from water film, validated per IEC 61000-4-6 conducted immunity testing.
CY8C614AFNI-S2F03T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-UFBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614AFNI-S2F03T FAQ
1.How can I place an order for CY8C614AFNI-S2F03T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614AFNI-S2F03T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614AFNI-S2F03T reliable?
The price and inventory of CY8C614AFNI-S2F03T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614AFNI-S2F03T is usually 5 days.
3.What payment methods are accepted for CY8C614AFNI-S2F03T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614AFNI-S2F03T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614AFNI-S2F03T?
CY8C614AFNI-S2F03T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614AFNI-S2F03T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614AFNI-S2F03T?
For technical support, including CY8C614AFNI-S2F03T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614AFNI-S2F03T requirements.
6.How does Aetrix verify that CY8C614AFNI-S2F03T is sourced from the original manufacturer or authorized distributors?
All CY8C614AFNI-S2F03T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614AFNI-S2F03T meets industry standards.
7.What is the process for return or replacement of CY8C614AFNI-S2F03T?
All CY8C614AFNI-S2F03T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614AFNI-S2F03T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614AFNI-S2F03T part is unused and in its original packaging.
Return procedure for CY8C614AFNI-S2F03T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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