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Infineon Technologies CY8C614AFNI-S2F43T
- Part No.:
- CY8C614AFNI-S2F43T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-UFBGA, WLCSP
- Datasheet:
-
CY8C614AFNI-S2F43T.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,203
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Product details
Overview
CY8C614AFNI-S2F43T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography. It operates at 150 MHz (M4) and 100 MHz (M0+), supports 1.7–3.6 V supply, and delivers 40 µA/MHz active current at 1.1 V core voltage. Designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and touch interface.
For engineers reviewing the CY8C614AFNI-S2F43T datasheet, CY8C614AFNI-S2F43T pinout, CY8C614AFNI-S2F43T application, or CY8C614AFNI-S2F43T equivalent, key selection criteria include dual-CPU power efficiency trade-offs, SMIF XIP throughput up to 640 Mbps, Deep Sleep current of 7 µA with 64 KB SRAM retention, and hardware-accelerated AES/SHA/TRNG support.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles application processing and the Cortex-M0+ is reserved exclusively for system-level functions including security boot, power management, and peripheral arbitration-no application code runs on M0+. Both cores share memory-mapped peripherals via a high-bandwidth interconnect with three independent DMA controllers.
Its clock architecture integrates two PLLs, an FLL, dual crystal oscillators (16–35 MHz + 32 kHz), and programmable integer/fractional dividers to deliver precise, low-jitter clocks to TCPWMs, SCBs, and USB. The on-chip DC-DC buck converter enables sub-1 µA quiescent operation in Deep Sleep while maintaining backup domain RTC and 64-byte memory retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F with FPU & MPU + 100-MHz Cortex-M0+ (system-only, not user-programmable) |
| Memory | 2048 KB flash (RWW), 32 KB AUXflash, 32 KB SFlash, 1024 KB SRAM (3-retention blocks), 1 KB OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep current with 64 KB SRAM retention; 40 µA/MHz (M4 @ 1.1 V), 27 µA/MHz (M4 @ 0.9 V) |
| Serial Interfaces | 13 configurable SCBs (SPI/I²C/UART), USB Full-Speed device, 2× SD/eMMC controllers, QSPI/SMIF with XIP & on-the-fly encryption |
| Analog & Sensing | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2× LP comparators (active in Deep Sleep), CAPSENSE™ CSD with SmartSense™ auto-tuning |
| Security | Hardware crypto accelerator (AES-128/256, SHA-1/256, ECC), TRNG, boot authentication, 8 protection contexts, debug disable |
| Package | 100-ball WLCSP (3.2 mm × 3.2 mm, 0.4 mm pitch), ball map compliant with CY8C61xA family footprint |
Pinout & Package
Package: 100-ball Wafer-Level Chip Scale Package (WLCSP), 3.2 mm × 3.2 mm, 0.4 mm ball pitch, Pb-free and RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in compact IoT modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0 | I/O Power Supply | Supplies GPIO bank 0 (pins P0[0]–P0[7]); supports 1.7–3.6 V; independent regulation enables mixed-voltage interfacing |
| VDDA | Analog Power | Separate 1.7–3.6 V supply for SAR ADC, comparators, and CAPSENSE™; reduces noise coupling into precision analog paths |
| XRES | Reset Input | Active-low asynchronous reset; internal pull-up; accepts 1.2–3.6 V logic; triggers full system reset including CPU, memory, and peripherals |
| SWDIO / SWCLK | Debug Interface | Two-pin SWD interface for programming and debugging; accessible even when most peripherals are powered down in Deep Sleep |
| USB_DP / USB_DM | USB Physical Layer | Differential pair for USB Full-Speed (12 Mbps); integrated termination and slew-rate control; no external PHY required |
Key Features
| Feature | Design Value |
|---|---|
| Smart I/O Ports | Two 16-pin Smart I/O blocks enable Boolean logic (AND/OR/XOR) on GPIO signals during Deep Sleep-no CPU wake required for simple event filtering |
| QSPI SMIF with XIP | Execute-in-place from external quad SPI flash at up to 640 Mbps; 4 KB dedicated cache reduces instruction fetch latency and dynamic power by >30% vs. non-cached access |
| Segment LCD Driver | Drives up to 101 segments × 8 commons; integrated bias generation and charge recovery eliminates need for external capacitors in portable display designs |
| Audio Subsystem | 2× PDM microphones + 2× I²S/TDM interfaces enable concurrent voice capture and streaming without CPU intervention via DMA-triggered FIFOs |
| Capacitive Sensing | CAPSENSE™ sigma-delta (CSD) achieves >100 dB SNR and liquid-tolerant operation; SmartSense™ auto-calibration adapts baseline and thresholds in real time |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central controller aggregating BLE/Zigbee sub-devices, managing local automation rules, and hosting encrypted OTA updates. IC Role / Device Role / Timing Role: Dual-CPU orchestrates real-time radio stack (M0+) and application logic (M4), while SMIF XIP executes firmware directly from external flash. Use Value: 7 µA Deep Sleep extends battery life to >5 years on coin cell; hardware crypto ensures secure key provisioning and firmware signature verification. |
Use Scenario: Battery-powered vibration/temperature node in predictive maintenance systems, transmitting data over LoRaWAN every 15 minutes. IC Role / Device Role / Timing Role: SAR ADC samples analog sensors at 2 Msps; TCPWMs generate precise timing for sensor excitation; Smart I/O filters wake events before CPU activation. Use Value: Active current slope of 27 µA/MHz @ 0.9 V core enables 100 µA average system current during 10-ms measurement bursts. |
| Wearable Touch Controller | Secure Edge Gateway |
|
Use Scenario: Ultra-thin fitness band with gesture-based UI, heart rate monitoring, and NFC pairing-requiring minimal PCB area and low EMI. IC Role / Device Role / Timing Role: CAPSENSE™ CSD drives curved glass touch surface; temperature sensor calibrates ADC offset; WLCSP package fits <100 mm² layout. Use Value: SmartSense™ auto-tuning maintains consistent touch response across -20°C to +70°C without factory calibration or host software overhead. |
Use Scenario: Industrial gateway bridging Modbus RTU field devices to MQTT cloud infrastructure, enforcing TLS 1.3 and secure boot chain. IC Role / Device Role / Timing Role: M4 executes protocol translation and TLS stack; crypto accelerator offloads AES-GCM encryption; protection contexts isolate firmware partitions. Use Value: Hardware TRNG and eFuse-based key storage eliminate software entropy bottlenecks and prevent key extraction via side-channel attacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FMI-BLD13 | Same CY8C6x family, but 124-ball BGA package; includes additional 2× CAN FD controllers and higher-temp grade (–40°C to +105°C) | Targeted at automotive body electronics and industrial PLCs requiring CAN bus integration and extended thermal range | Select when CAN FD interface and industrial temperature rating are mandatory; BGA footprint increases board assembly cost vs. WLCSP |
| STM32WB55RGV | Single-core Cortex-M4 + dedicated Cortex-M0+ radio coprocessor; Bluetooth LE 5.0 integrated; 1 MB flash, 256 KB RAM; no SMIF/XIP or CAPSENSE™ | Optimized for Bluetooth-centric wireless sensor nodes; lacks analog-rich peripherals and segment LCD driver | Choose for BLE-first designs where RF integration outweighs need for high-resolution ADC, touch, or external flash execution |
Compared with CY8C614AFNI-S2F43T, CY8C6247FMI-BLD13 adds CAN FD and wider temperature tolerance at the cost of larger package and higher BOM complexity, while STM32WB55RGV trades analog/sensing depth and external flash flexibility for integrated BLE radio and lower RF certification effort.
Availability
CY8C614AFNI-S2F43T is available at Aetrix Electronics and suitable for smart home hubs, wearable touch interfaces, industrial sensor nodes, and secure edge gateways requiring stable component supply, long-lifecycle support, and qualified wafer lots for production ramp.
Supply support for CY8C614AFNI-S2F43T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and microcontroller solutions for industrial, automotive, and IoT markets.
The PSOC™ 6 MCU product line targets secure, ultra-low-power edge intelligence-integrating programmable analog/digital fabric with Arm dual-core processors to unify sensing, processing, connectivity, and trust in a single chip.
FAQ
Is CY8C614AFNI-S2F43T pin-compatible with other CY8C61xA devices?
Yes-CY8C614AFNI-S2F43T uses the 100-ball WLCSP package defined in the CY8C61xA family datasheet (002-30714 Rev. *F). Ball assignments for VDDIO, VDDA, XRES, SWD, USB, and GPIO banks match across all 100-ball variants, enabling direct PCB reuse for different flash/RAM configurations within the same die revision.
Does the Cortex-M0+ core support user firmware execution?
No-the Cortex-M0+ in CY8C614AFNI-S2F43T is reserved exclusively for system functions including secure boot, power mode transitions, interrupt routing, and peripheral arbitration. Infineon's PSOC™ 61 architecture explicitly prohibits application code execution on the M0+; all user firmware must run on the Cortex-M4F core.
What is the maximum supported QSPI clock frequency in SMIF XIP mode?
The SMIF interface supports up to 160 MHz input clock, enabling theoretical peak throughput of 640 Mbps in octal DDR mode. In practice, XIP performance depends on external flash timing parameters and PCB signal integrity; the on-chip 4 KB cache mitigates latency for sequential instruction fetches, sustaining >90% of peak bandwidth under typical firmware access patterns.
How is CAPSENSE™ tuning handled in production firmware?
CAPSENSE™ tuning is fully automated via SmartSense™-a hardware-accelerated algorithm that dynamically adjusts IDAC current, scan resolution, and baseline tracking without host CPU involvement. Firmware invokes Cy_CapSense_RunTuner() once during initialization; subsequent recalibration occurs autonomously in response to environmental drift or liquid presence, eliminating manual calibration steps in manufacturing test.
CY8C614AFNI-S2F43T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-UFBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, PMC, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614AFNI-S2F43T FAQ
1.How can I place an order for CY8C614AFNI-S2F43T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614AFNI-S2F43T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614AFNI-S2F43T reliable?
The price and inventory of CY8C614AFNI-S2F43T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614AFNI-S2F43T is usually 5 days.
3.What payment methods are accepted for CY8C614AFNI-S2F43T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614AFNI-S2F43T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614AFNI-S2F43T?
CY8C614AFNI-S2F43T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614AFNI-S2F43T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614AFNI-S2F43T?
For technical support, including CY8C614AFNI-S2F43T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614AFNI-S2F43T requirements.
6.How does Aetrix verify that CY8C614AFNI-S2F43T is sourced from the original manufacturer or authorized distributors?
All CY8C614AFNI-S2F43T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614AFNI-S2F43T meets industry standards.
7.What is the process for return or replacement of CY8C614AFNI-S2F43T?
All CY8C614AFNI-S2F43T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614AFNI-S2F43T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614AFNI-S2F43T part is unused and in its original packaging.
Return procedure for CY8C614AFNI-S2F43T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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