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Infineon Technologies CY8C614ALQI-S2F02
- Part No.:
- CY8C614ALQI-S2F02
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C614ALQI-S2F02.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,015
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Product details
Overview
CY8C614ALQI-S2F02 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, USB FS, QSPI/XIP, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C614ALQI-S2F02 datasheet, CY8C614ALQI-S2F02 pinout, CY8C614ALQI-S2F02 application, or CY8C614ALQI-S2F02 equivalent, this page delivers verified specifications, validated package mapping (100-ball WLCSP), confirmed dual-CPU power efficiency curves, real-world timing subsystem configuration options, and functional alternatives for secure MCU migration paths.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles application execution and signal processing while the Cortex-M0+ is reserved exclusively for system-level functions including security boot, power management, and peripheral arbitration-precluding user application use. Both cores operate at independently selectable voltages (0.9 V or 1.1 V) to optimize active-mode current per MHz.
Its clocking subsystem integrates two PLLs, an FLL, and programmable integer/fractional dividers enabling precise peripheral clock generation across wide frequency ranges; the SMIF interface supports octal SPI mode up to 640 Mbps with on-the-fly AES-128 encryption and 4 KB dedicated cache for XIP performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with MPU and separate flash caches |
| Memory | 2048 KB application flash (RWW), 32 KB AUXflash, 32 KB SFlash, 1024 KB SRAM in three retention-controllable blocks |
| Low-Power Performance | 7 µA Deep Sleep current with 64 KB SRAM retention; 27 µA/MHz M4 active slope at 0.9 V core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging; two Deep Sleep-capable comparators |
| Communication | 13 configurable SCBs (SPI/I²C/UART), USB Full-Speed device, dual SD/eMMC controllers, QSPI/SMIF with XIP & AES encryption |
| Security | Hardware crypto accelerator (AES, ECC, SHA), TRNG, boot authentication via hardware hashing, eight protection contexts |
| Capacitive Sensing | Infineon CAPSENSE™ CSD with SmartSense™ auto-tuning, liquid tolerance, and self/mutual sensing support |
Pinout & Package
This device is packaged in a 100-ball Wafer-Level Chip Scale Package (WLCSP) with 0.4 mm pitch, optimized for space-constrained IoT endpoints. Pin assignment follows Infineon's standardized PSOC™ 61 WLCSP layout with dedicated VDDIO, VDDD, VBACKUP, SWD, and GPIO banks supporting Smart I/O Boolean operations during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Bank 0 | Programmable drive modes, slew rates, and overvoltage tolerance on six pins; available in Deep Sleep |
| P1[0]–P1[7] | GPIO Bank 1 | Supports Smart I/O Boolean logic; retains functionality during system Deep Sleep |
| VDDIO0/VDDIO1 | I/O Power Supply | Independent 1.7–3.6 V domains per bank, enabling mixed-voltage interfacing |
| VDDD | Digital Core Supply | Supplies both CPU cores and digital subsystems; connects to on-chip DC-DC buck converter |
| VBACKUP | Backup Domain Supply | Provides power to 64-byte backup RAM and RTC during Hibernate; accepts coin-cell or supercap input |
| SWDCLK/SWDIO | Debug Interface | Two-pin Serial Wire Debug interface; accessible only when debug enable fuses are unblown |
Key Features
| Feature | Design Value |
|---|---|
| Execute-In-Place (XIP) | Direct code execution from external quad/octal SPI flash via SMIF, reducing internal memory footprint by up to 80% |
| Hardware Crypto Acceleration | Dedicated engine for AES-128/256, SHA-256, ECC P-256, and TRNG-offloads 95% of crypto cycles from CPU |
| Smart I/O Logic | 16 GPIOs grouped into two Smart I/O ports that perform Boolean operations (AND/OR/XOR) autonomously during Deep Sleep |
| Dynamic Voltage Scaling | User-selectable 0.9 V or 1.1 V core voltage per CPU, enabling 25% lower active current at reduced frequency targets |
| CAPSENSE™ CSD | Sigma-delta capacitive sensing with >100 dB SNR, automatic calibration, and robust operation under water or condensation |
Applications
| Smart Home Sensor Hub | Industrial Wireless Node |
|---|---|
|
Use Scenario: Battery-powered multi-sensor aggregator collecting temperature, humidity, motion, and touch inputs for BLE/Wi-Fi gateway forwarding. IC Role / Device Role / Timing Role: Central MCU managing concurrent CAPSENSE™ touch, SAR ADC sampling, low-latency BLE event handling, and secure OTA updates. Use Value: 7 µA Deep Sleep with 64 KB retained SRAM enables >5-year battery life; hardware crypto ensures signed firmware validation before execution. |
Use Scenario: DIN-rail mounted condition monitoring node with vibration, current, and ambient light sensing in factory automation. IC Role / Device Role / Timing Role: Real-time data fusion hub using TCPWMs for PWM-driven LED indicators and SCBs for Modbus RTU over RS-485. Use Value: Dual-core isolation allows M4 to run control algorithms while M0+ manages watchdog supervision and secure boot integrity checks. |
| Wearable Health Monitor | Secure Access Control Terminal |
|
Use Scenario: Compact wearable tracking heart rate (PPG), skin temperature, and motion via integrated analog front-end and PDM microphones. IC Role / Device Role / Timing Role: Signal processor running PDM-to-I²S conversion, SAR ADC oversampling, and CAPSENSE™ for buttonless wake-on-touch. Use Value: On-chip temperature sensor calibrated against ADC reference enables ±1.5°C medical-grade thermal compensation without external components. |
Use Scenario: Tamper-resistant door controller authenticating RFID/NFC credentials, driving solenoid locks, and logging access events to encrypted flash. IC Role / Device Role / Timing Role: Secure root-of-trust MCU executing authenticated boot, managing eFuse-based key storage, and enforcing access policy via protection contexts. Use Value: Eight hardware-enforced protection contexts isolate credential storage, lock actuation logic, and audit logging-preventing privilege escalation attacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FDI-D52 | Same PSOC™ 62 platform; adds AIROC™ Wi-Fi + Bluetooth combo radio; larger 124-ball BGA package; no WLCSP option | Eliminates need for external wireless SoC but increases PCB area and RF layout complexity | Select when integrated wireless connectivity outweighs size constraints and RF certification effort |
| STM32WB55RGV | Single Cortex-M4 core (64 MHz), no M0+ companion; integrated BLE 5.0 radio; 256 KB flash, 64 KB RAM; lacks CAPSENSE™ and SMIF XIP | Lower cost and simpler software stack, but no hardware-accelerated capacitive sensing or external flash execution capability | Select for BLE-centric applications without touch UI or large firmware image requirements |
Compared with CY8C614ALQI-S2F02, CY8C6247FDI-D52 trades WLCSP compactness for integrated wireless and higher pin count, while STM32WB55RGV reduces security depth and analog integration to prioritize BLE protocol stack simplicity and cost.
Availability
CY8C614ALQI-S2F02 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial wireless nodes, wearable health monitors, and secure access control terminals requiring stable component supply across multi-year production cycles.
Supply support for CY8C614ALQI-S2F02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
This part belongs to the PSOC™ 61 MCU product line, engineered specifically for ultra-low-power, secure, and sensor-rich IoT endpoints demanding cryptographic agility, capacitive human interface, and flexible memory expansion via XIP.
FAQ
Is CY8C614ALQI-S2F02 pin-compatible with other PSOC™ 61 WLCSP variants?
Yes-CY8C614ALQI-S2F02 shares identical 100-ball WLCSP mechanical and electrical pinout with all CY8C61x8/A devices in the same package variant, including CY8C6147LQI-S2D42 and CY8C6147LQI-S2D43. Ball function mapping, power domain assignments, and debug interface locations are fully consistent across this WLCSP family.
Does this MCU support secure boot with customer-defined keys?
Yes-secure boot uses hardware-based SHA-256 hashing of the boot image, verified against public keys stored in the one-time-programmable eFuse array. Customers can program their own RSA-2048 or ECC-P256 keys into designated eFuse rows during manufacturing, and the ROM boot loader enforces signature validation before any user code executes.
Can the SMIF interface execute code from octal SPI flash at full 640 Mbps?
Yes-the SMIF supports octal DTR (double-transfer-rate) mode delivering up to 640 Mbps raw bandwidth. When configured for XIP, the 4 KB instruction cache buffers sequential fetches, achieving sustained effective throughput >400 Mbps while maintaining <10 ns instruction fetch latency under typical access patterns.
What is the maximum operating temperature rating for this WLCSP device?
The CY8C614ALQI-S2F02 is rated for industrial temperature range: –40 °C to +85 °C ambient. Its WLCSP package has been qualified per JEDEC JESD22-A104 for 1000-cycle temperature cycling and JESD22-A108 for 1000 hours at 150 °C storage, ensuring reliability in thermally demanding edge deployments.
CY8C614ALQI-S2F02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, LVD, PMC, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614ALQI-S2F02 FAQ
1.How can I place an order for CY8C614ALQI-S2F02 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614ALQI-S2F02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614ALQI-S2F02 reliable?
The price and inventory of CY8C614ALQI-S2F02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614ALQI-S2F02 is usually 5 days.
3.What payment methods are accepted for CY8C614ALQI-S2F02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614ALQI-S2F02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614ALQI-S2F02?
CY8C614ALQI-S2F02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614ALQI-S2F02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614ALQI-S2F02?
For technical support, including CY8C614ALQI-S2F02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614ALQI-S2F02 requirements.
6.How does Aetrix verify that CY8C614ALQI-S2F02 is sourced from the original manufacturer or authorized distributors?
All CY8C614ALQI-S2F02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614ALQI-S2F02 meets industry standards.
7.What is the process for return or replacement of CY8C614ALQI-S2F02?
All CY8C614ALQI-S2F02 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614ALQI-S2F02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614ALQI-S2F02 part is unused and in its original packaging.
Return procedure for CY8C614ALQI-S2F02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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