My Inquiry
My Account
Infineon Technologies CY8C614ALQI-S2F42
- Part No.:
- CY8C614ALQI-S2F42
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C614ALQI-S2F42.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,814
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C614ALQI-S2F42 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and local decision-making.
For engineers reviewing the CY8C614ALQI-S2F42 datasheet, CY8C614ALQI-S2F42 pinout, CY8C614ALQI-S2F42 application, or CY8C614ALQI-S2F42 equivalent, this device supports concurrent firmware isolation (M4 for app, M0+ for system), on-the-fly encrypted XIP from external flash, and hardware-accelerated AES/SHA/TRNG - critical for OTA-updatable, tamper-resilient smart sensors and wearable controllers.
Technical Context
The CY8C614ALQI-S2F42 implements a tightly coupled dual-CPU subsystem where the Cortex-M4F (150 MHz) executes application code with FPU and MPU, while the Cortex-M0+ (100 MHz) handles system-level tasks including boot, security, and power management - with no application access to M0+. Its memory architecture includes RWW flash with two 8-KB CPU-specific caches, 1024-KB SRAM segmented into three independently controllable blocks for selective retention.
Peripherals are routed via a programmable interconnect fabric: 13 SCBs support mixed SPI/I²C/UART configurations (including one Deep Sleep-capable SCB), TCPWMs offer kill-signal triggering via comparators, and the SMIF enables octal-mode QSPI at up to 640 Mbps with 4-KB cache and real-time encryption/decryption - enabling deterministic execution from external memory without host CPU overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, with hardware IPC and independent MPUs |
| Memory | 2048-KB flash (RWW), 32-KB AUXflash, 32-KB SFlash; 1024-KB SRAM in three retention-controlled blocks |
| Power Efficiency | 7 µA Deep Sleep with 64-KB SRAM retention; 27 µA/MHz (M4 @ 0.9 V), 20 µA/MHz (M0+ @ 0.9 V) |
| Security | Hardware crypto accelerator (AES-128/256, SHA-1/256, ECC), TRNG, boot authentication, 8 protection contexts |
| Interface Speed | SMIF QSPI up to 640 Mbps (octal mode); USB Full-Speed (12 Mbps); SCBs configurable as UART/I²C/SPI up to 32 Mbps |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, averaging), 2 LP comparators (active in Deep Sleep), built-in temp sensor |
| Capacitive Sensing | CAPSENSE™ CSD with SmartSense™ auto-tuning, >100:1 SNR, liquid-tolerant self/mutual sensing up to 101 segments |
Pinout & Package
This device is housed in a 100-ball WLCSP (Wafer-Level Chip Scale Package) with 0.35 mm ball pitch, optimized for space-constrained IoT endpoints such as wearables and compact sensor hubs. Pin functions are fully configurable via firmware-defined routing, supporting dynamic I/O remapping across 102 GPIOs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Four independent 1.7–3.6 V domains enabling mixed-voltage interface operation (e.g., 1.8 V sensor + 3.3 V radio) |
| VDDD / VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V supplies for digital logic and analog subsystems; decoupling required per datasheet layout rules |
| XRES | External Reset Input | Active-low asynchronous reset pin; internal pull-up; compatible with open-drain reset supervisors |
| SWDCK / SWDIO | Debug Interface | Two-pin Serial Wire Debug interface supporting programming, real-time trace, and secure debug disable via eFuse |
| SMIF[7:0] | Serial Memory Interface Bus | Octal-capable bidirectional bus for external flash; supports DQS-strobed read/write and on-the-fly AES decryption |
| USB_DP / USB_DM | USB Full-Speed Differential Pair | Integrated transceiver compliant with USB 2.0 FS; requires 1.5-kΩ pull-up on DP for device enumeration |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot & Runtime Isolation | Hardware-enforced authentication of signed firmware images; M0+ manages secure services while M4 runs untrusted application code |
| Execute-In-Place (XIP) with Encryption | Direct code execution from external QSPI flash with real-time AES-128 decryption - eliminates RAM footprint for firmware storage |
| Smart I/O in Deep Sleep | Two 16-bit Smart I/O ports perform Boolean logic (AND/OR/XOR) on GPIO pins without waking CPUs - enables low-power event preprocessing |
| Programmable Analog Front End | Configurable SAR ADC with sequencer, averaging, and comparator-triggered PWM kill signals - supports closed-loop motor/sensor control |
| CAPSENSE™ with Liquid Tolerance | Hardware-accelerated sigma-delta capacitive sensing with automatic SmartSense™ tuning - enables reliable touch interfaces in humid or wet environments |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
Use Scenario: Continuous ECG/PPG signal acquisition, motion artifact correction, and BLE beacon transmission in a wrist-worn form factor. IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M4 processes sensor fusion algorithms; M0+ manages BLE stack timing, USB charging detection, and secure key provisioning. Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends battery life to >7 days on coin cell; CAPSENSE™ enables waterproof touch controls. |
Use Scenario: Multi-sensor aggregation (temp/humidity/air quality) with local anomaly detection and encrypted cloud upload via Wi-Fi module. IC Role / Device Role / Timing Role: Acts as secure edge controller: M4 runs ML inference on sensor data; M0+ enforces TLS handshake timing and crypto key lifecycle. Use Value: Hardware AES/SHA acceleration reduces encryption latency by 8× vs. software-only; SMIF XIP enables seamless firmware updates from external flash. |
| Industrial Predictive Maintenance Node | Medical Disposable Device |
Use Scenario: Vibration and temperature monitoring on rotating equipment with local FFT analysis and alert generation before wireless transmission. IC Role / Device Role / Timing Role: Real-time signal processing engine: M4 executes floating-point FFT; TCPWMs generate precise PWM drive for piezo actuators used in self-test. Use Value: 150-MHz M4F with FPU delivers 3× faster FFT throughput than comparable MCUs; 12-bit SAR ADC supports 16-channel synchronized sampling. |
Use Scenario: Single-use glucose meter with touch interface, optical sensing, and disposable battery - requiring zero-touch calibration and tamper-proof firmware. IC Role / Device Role / Timing Role: System-on-chip controller: M0+ handles FDA-compliant audit logging and secure boot; M4 runs calibrated photodiode signal processing. Use Value: One-time-programmable eFuse array stores device-specific calibration constants and disables debug post-manufacture - meeting IEC 62304 Class B requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RP2040 | No hardware crypto accelerator, no secure boot, no analog peripherals (ADC/comparators), no CAPSENSE™ | Suitable for cost-sensitive consumer devices without security or analog sensing needs | Select only if cryptographic offload, analog front-end integration, and certified secure boot are not required |
| STM32U575 | Single-core Cortex-M33 (160 MHz), TrustZone-based security, 2.5 µA Stop2 mode, but no programmable analog/digital fabric | Better for high-integrity RTOS deployments with minimal peripheral customization | Prefer when deterministic interrupt latency and PSA Certified Level 3 are mandatory, but programmable logic and CAPSENSE™ are unnecessary |
Compared with RP2040 and STM32U575, CY8C614ALQI-S2F42 uniquely combines dual-core isolation, hardware-accelerated crypto, CAPSENSE™, and programmable analog/digital fabric - making it optimal for IoT endpoints requiring both rich peripheral integration and field-upgradable security.
Availability
CY8C614ALQI-S2F42 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and medical disposable devices requiring stable component supply across multi-year production cycles.
Supply support for CY8C614ALQI-S2F42 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D infrastructure.
The PSOC™ 61 MCU product line was designed specifically for ultra-low-power, secure, and sensor-rich IoT edge devices - integrating programmable analog/digital fabric with Arm dual-core compute and hardware crypto to reduce system BOM and enable firmware-defined functionality.
FAQ
Does CY8C614ALQI-S2F42 support JTAG debugging?
No - this device uses Serial Wire Debug (SWD) only, with dedicated SWDCK and SWDIO pins. JTAG is not implemented; debug access is restricted after eFuse programming to disable SWD, enforcing production security policies defined in the device's protection contexts.
What is the maximum external QSPI flash size supported via SMIF?
The SMIF interface supports up to 4 GB of external flash using 32-bit addressing. The CY8C614ALQI-S2F42's SMIF controller natively handles octal DDR mode with DQS strobing, enabling sustained read throughput of 640 Mbps - sufficient for streaming audio/video or large firmware images.
Can the Cortex-M0+ core be used for application code?
No - per Infineon's PSOC™ 61 architecture, the Cortex-M0+ is reserved exclusively for system functions including boot, security services, and power management. Application firmware must run solely on the Cortex-M4F core; M0+ firmware is preloaded and non-modifiable by end users.
Is CAPSENSE™ tuning required during production calibration?
No - SmartSense™ provides fully automatic hardware-based tuning at runtime, eliminating production-line calibration. The subsystem dynamically adjusts IDAC current, scan speed, and filtering based on electrode parasitics and environmental conditions, ensuring consistent performance across temperature and humidity ranges.
CY8C614ALQI-S2F42 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, PMC, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C614ALQI-S2F42 FAQ
1.How can I place an order for CY8C614ALQI-S2F42 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C614ALQI-S2F42 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C614ALQI-S2F42 reliable?
The price and inventory of CY8C614ALQI-S2F42 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C614ALQI-S2F42 is usually 5 days.
3.What payment methods are accepted for CY8C614ALQI-S2F42?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C614ALQI-S2F42 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C614ALQI-S2F42?
CY8C614ALQI-S2F42 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C614ALQI-S2F42 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C614ALQI-S2F42?
For technical support, including CY8C614ALQI-S2F42 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C614ALQI-S2F42 requirements.
6.How does Aetrix verify that CY8C614ALQI-S2F42 is sourced from the original manufacturer or authorized distributors?
All CY8C614ALQI-S2F42 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C614ALQI-S2F42 meets industry standards.
7.What is the process for return or replacement of CY8C614ALQI-S2F42?
All CY8C614ALQI-S2F42 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C614ALQI-S2F42, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C614ALQI-S2F42 part is unused and in its original packaging.
Return procedure for CY8C614ALQI-S2F42:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C614ALQI-S2F42 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
