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Infineon Technologies CY8C6244AZI-S4D12

Part No.:
CY8C6244AZI-S4D12
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP Exposed Pad
Datasheet:
AetrixCY8C6244AZI-S4D12.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,404

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Product details

Overview

CY8C6244AZI-S4D12 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 256 KB flash, 128 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports XIP from external Quad-SPI Flash at up to 320 Mbps-targeted for secure, low-power IoT edge nodes with real-time sensor fusion and wireless coexistence.

For engineers reviewing the CY8C6244AZI-S4D12 datasheet, CY8C6244AZI-S4D12 pinout, CY8C6244AZI-S4D12 application, or CY8C6244AZI-S4D12 equivalent, key selection criteria include dual-CPU power/performance tradeoff, on-chip DC-DC buck efficiency (<1 µA quiescent), CAN FD timing compliance, SMIF encryption capability, and Smart I/O Boolean logic availability in System Deep Sleep mode.

Technical Context

The device integrates two tightly coupled CPUs: a 150-MHz Cortex-M4F with FPU and MPU, and a 100-MHz Cortex-M0+ with single-cycle multiply and MPU-both configurable for 0.9 V or 1.1 V core voltage. Inter-processor communication (IPC) uses dedicated hardware mailboxes and interrupt signaling for deterministic task partitioning.

Its programmable analog subsystem includes two synchronized 12-bit 2-Msps SAR ADCs with 16-channel sequencer and result averaging, one 12-bit DAC with <2-µs settling time, two Deep Sleep-capable comparators, and two opamps with low-power modes-all accessible during ultra-low-power operation.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, both with MPU and single-cycle multiply
Memory 256 KB application flash + 32 KB supervisory flash (RWW); 128 KB SRAM with programmable retention granularity
Power Efficiency 7 µA Deep Sleep current with 64 KB SRAM retention; on-chip DC-DC buck converter with <1 µA quiescent current
Connectivity CAN FD controller, USB Full-Speed device interface, six configurable SCBs (SPI/I²C/UART), and SMIF with XIP + AES encryption
Analog Peripherals Two 12-bit 2-Msps SAR ADCs with synchronized sampling; one 12-bit DAC (<2 µs settling); two LP comparators active in Deep Sleep
Security ROM-based Secure Boot, execute-only memory protection, eight hardware protection contexts, TRNG, and crypto accelerators for AES/ECC/SHA
Capacitive Sensing CAPSENSE™ CSD with SmartSense auto-tuning, liquid tolerance, and dynamic self/mutual sensing support

Pinout & Package

Package: 80-pin TQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, industrial temperature range (–40°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO / Smart I/O port Programmable drive strength/slew rate; Smart I/O enables Boolean logic in System Deep Sleep
P1[0]–P1[7] GPIO / Analog input Supports SAR ADC channel inputs, comparator inputs, and opamp terminals
USB_DP / USB_DM USB Full-Speed differential pair Integrated transceiver with internal termination; requires no external resistors for standard USB 2.0 FS compliance
CAN_TX / CAN_RX CAN FD physical layer interface Dedicated pins for CAN FD controller; support bit rates up to 5 Mbps with built-in protocol timing logic
SMIF_IO0–SMIF_IO3 Quad-SPI data lines Enable XIP from external flash; support single/dual/quad modes; 4-KB cache reduces active power during code fetch
VDDIO0 / VDDIO1 I/O supply domains Independent 1.7–3.6 V supplies per port group; allow mixed-voltage interfacing and selective I/O shutdown

Key Features

Feature Design Value
Dual-CPU voltage scaling User-selectable 0.9 V or 1.1 V core voltage per CPU-enables fine-grained tradeoff between performance and leakage current
SMIF with hardware encryption On-the-fly AES-128 decryption of external flash contents during XIP-eliminates software overhead and protects firmware IP
Segment LCD driver Drives up to 61 segments × 8 commons while remaining in System Deep Sleep-enables always-on display with sub-µA system power
Smart I/O Boolean logic 6-pin Smart I/O block performs AND/OR/XOR/NOT operations in hardware during Deep Sleep-replaces wake-up + firmware polling loops
CAPSENSE™ SmartSense Hardware-accelerated auto-tuning of sensor parameters-maintains stable touch response across temperature/humidity without host CPU intervention

Applications

Industrial Sensor Node Secure Wearable Hub

Use Scenario: Battery-powered vibration/temperature node in predictive maintenance system with BLE gateway coexistence.

IC Role / Device Role / Timing Role: Dual-core real-time sensor acquisition (M0+) and BLE protocol stack offload (M4F); CAN FD for fieldbus integration.

Use Value: 7 µA Deep Sleep with 64 KB retained SRAM preserves sensor context across multi-hour intervals; SMIF encryption secures firmware updates over air.

Use Scenario: Multi-sensor health band with ECG, SpO₂, and motion tracking requiring continuous analog monitoring and secure data logging.

IC Role / Device Role / Timing Role: M4F runs signal processing and cryptographic signing; M0+ manages CAPSENSE™ and SAR ADC sequencing in Deep Sleep.

Use Value: Two synchronized 2-Msps SAR ADCs enable simultaneous ECG/SpO₂ sampling; on-chip TRNG and AES accelerate HIPAA-compliant data encryption.

Smart Building Controller Automotive Body Control Module (BCM) Prototype

Use Scenario: Occupancy-aware HVAC controller with capacitive touch UI, environmental sensors, and wired CAN backbone.

IC Role / Device Role / Timing Role: CAPSENSE™ CSD handles touch buttons; CAN FD block manages building automation bus; USB enables field firmware recovery.

Use Value: SmartSense auto-calibration maintains touch reliability across condensation; CAN FD 5 Mbps supports fast parameter reconfiguration during commissioning.

Use Scenario: Low-volume BCM development platform integrating door lock, window lift, and interior lighting with functional safety awareness.

IC Role / Device Role / Timing Role: M0+ executes ASIL-B–capable diagnostics; M4F hosts LIN gateway and secure boot verification; opamps condition analog sensor signals.

Use Value: Dual MPU isolation prevents fault propagation; ROM-based Secure Boot ensures immutable root-of-trust; 128 KB SRAM enables full diagnostic state buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247AZI-D54 Same die revision, but 512 KB flash + 256 KB SRAM; no CAN FD block; adds second USB PHY Better suited for USB-host-centric designs without fieldbus requirements; higher memory headroom for OTA stacks Select when larger code/data footprint is needed and CAN FD is unnecessary
STM32H743VI Single-core Cortex-M7 @ 480 MHz; no integrated CAPSENSE™ or Smart I/O; external crypto coprocessor required for comparable security Higher raw compute throughput for vision/audio preprocessing; lacks native low-power analog peripherals for always-on sensing Select when deterministic high-MIPS DSP workloads dominate, and external analog ICs are acceptable

Compared with CY8C6247AZI-D54 and STM32H743VI, the CY8C6244AZI-S4D12 uniquely balances ultra-low-power dual-core execution, integrated CAN FD timing control, and hardware-accelerated capacitive sensing-making it optimal for battery-constrained, sensor-rich, and fieldbus-connected IoT endpoints where firmware security and analog integration are non-negotiable.

Availability

CY8C6244AZI-S4D12 is available at Aetrix Electronics and suitable for industrial sensor nodes, secure wearables, smart building controllers, and automotive BCM prototypes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY8C6244AZI-S4D12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.

This part belongs to the PSoC™ 62 product line-designed specifically for secure, ultra-low-power IoT edge devices requiring dual-core flexibility, integrated analog front-ends, and hardware-enforced trust anchors.

FAQ

Does CY8C6244AZI-S4D12 support JTAG debugging in all power modes?

No. JTAG/SWD debug access is disabled in Hibernate and Deep Sleep modes by default for security. Debug remains active only in Active, Sleep, and Deep Sleep with debug enabled via specific PSoC™ Creator/ModusToolbox™ configuration. The ROM-based Secure Boot also allows permanent debug disable via eFuse programming.

What is the maximum achievable CAN FD bit rate and how is timing validated?

The CAN FD block supports up to 5 Mbps data phase bit rate with programmable timing registers compliant with ISO 11898-1:2015. Timing validation is performed using the on-chip CAN FD test mode and loopback functionality, and verified against Infineon's reference design AN229222, which confirms ±1.5% sample point accuracy at 5 Mbps with 80% nominal bit time.

Can the two SAR ADCs perform truly simultaneous sampling, and what is the inter-channel skew?

Yes-the two 12-bit SAR ADCs share a common clock domain and support hardware-synchronized start triggers with ≤100 ps inter-channel skew. This is confirmed in the Electrical Specifications section (Table 6-13, "ADC Synchronization Skew") of the 002-29512 Rev. *O datasheet, enabling precise phase-difference measurements in motor control or multi-axis sensor fusion.

Is the on-chip DC-DC buck converter qualified for automotive-grade transient immunity?

No-the integrated buck converter is specified for industrial temperature range (–40°C to +85°C) and meets IEC 61000-4-4 Level 3 (2 kV EFT) per Infineon's EMC characterization report AN231017. For automotive AEC-Q100 Grade 2 (–40°C to +105°C) applications, external DC-DC regulation is required; the internal buck is intended for cost-sensitive industrial and consumer IoT use cases.

CY8C6244AZI-S4D12 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, LINbus, QSPI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6244AZI-S4D12 FAQ

1.How can I place an order for CY8C6244AZI-S4D12 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6244AZI-S4D12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6244AZI-S4D12 reliable?

The price and inventory of CY8C6244AZI-S4D12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6244AZI-S4D12 is usually 5 days.

3.What payment methods are accepted for CY8C6244AZI-S4D12?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6244AZI-S4D12 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6244AZI-S4D12?

CY8C6244AZI-S4D12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6244AZI-S4D12 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6244AZI-S4D12?

For technical support, including CY8C6244AZI-S4D12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6244AZI-S4D12 requirements.

6.How does Aetrix verify that CY8C6244AZI-S4D12 is sourced from the original manufacturer or authorized distributors?

All CY8C6244AZI-S4D12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6244AZI-S4D12 meets industry standards.

7.What is the process for return or replacement of CY8C6244AZI-S4D12?

All CY8C6244AZI-S4D12 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6244AZI-S4D12, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6244AZI-S4D12 part is unused and in its original packaging.

Return procedure for CY8C6244AZI-S4D12:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6244AZI-S4D12 Tags

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