Infineon Technologies CY8C6244AZI-S4D62
- Part No.:
- CY8C6244AZI-S4D62
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
CY8C6244AZI-S4D62.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C6244AZI-S4D62 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 256 KB flash, 128 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography accelerators. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports XIP from external Quad-SPI Flash at up to 320 Mbps-targeted for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6244AZI-S4D62 datasheet, CY8C6244AZI-S4D62 pinout, CY8C6244AZI-S4D62 application, or CY8C6244AZI-S4D62 equivalent, key selection criteria include dual-CPU power/performance tradeoff, on-chip DC-DC quiescent current (<1 µA), Deep Sleep SCB availability, Smart I/O Boolean logic capability during system sleep, and TRNG-enabled secure boot implementation.
Technical Context
The device implements a tightly coupled dual-CPU subsystem: a 150-MHz Cortex-M4F with FPU and MPU handles real-time signal processing and security-critical tasks, while a 100-MHz Cortex-M0+ manages low-power peripheral orchestration and protocol stacks. Inter-processor communication (IPC) uses dedicated hardware mailboxes with interrupt signaling and memory-mapped shared RAM.
Clock architecture integrates multiple independent oscillators-including 8-MHz IMO (±2%), 32-kHz ILO, programmable crystal oscillators (16–35 MHz and 32 kHz), PLL, and FLL-enabling dynamic clock source switching per power mode. The SMIF controller supports encrypted Execute-In-Place with 4-KB cache and quad/dual/single SPI modes, decoupling code execution from flash access latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F (FPU + MPU) + 100-MHz Cortex-M0+ (MPU), enabling asymmetric RTOS partitioning and secure boot isolation. |
| Memory | 256 KB application flash + 32 KB supervisory flash (RWW), 128 KB SRAM with programmable retention granularity, and 1 KB OTP eFuse for key storage. |
| Power Modes | Six fine-grained modes; Deep Sleep draws 7 µA with 64 KB SRAM retention and active Deep Sleep SCB, enabled by on-chip DC-DC converter (<1 µA IQ). |
| Analog Peripherals | Two 12-bit 2-Msps SAR ADCs with synchronized sampling and 16-channel sequencer; one 12-bit DAC (<2 µs settling); two opamps; two LP comparators operational in Deep Sleep. |
| Digital Interfaces | Six configurable SCBs (5x SPI/I²C/UART + 1x Deep Sleep SCB), USB Full-Speed device, CAN FD controller, 12x TCPWM, Smart I/O (6-pin Boolean logic in Deep Sleep). |
| Security | ROM-based Secure Boot, execute-only memory protection, eight hardware protection contexts, hardware crypto accelerators (AES-256, ECC, SHA-256), and True Random Number Generator (TRNG). |
| Package | 80-pin TQFP (12 × 12 mm, 0.5 mm pitch), RoHS-compliant, with 62 GPIOs including 2 overvoltage-tolerant (OVT) pins and capacitive sensing support. |
Pinout & Package
80-pin Thin Quad Flat Package (TQFP), body size 12 mm × 12 mm, lead pitch 0.5 mm, exposed thermal pad (EP), RoHS-compliant. Pinout validated per Infineon datasheet 002-29512 Rev. *O, Section 4 "Pinouts".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / CapSense / Smart I/O | Programmable drive strength/slew rate; supports CapSense CSD self/mutual sensing and Smart I/O Boolean logic during Deep Sleep. |
| P1[0]–P1[7] | GPIO / Analog Input / SCB | Configurable as ADC input, DAC output, or SCB interface (SPI/I²C/UART); includes two OVT pins (P1[0], P1[1]). |
| XRES | Reset Input | Active-low asynchronous reset with internal pull-up; supports external reset assertion and brown-out detection. |
| VDDIO0–VDDIO3 | I/O Power Supply | Four independent 1.7–3.6 V I/O domains enabling mixed-voltage interfacing and selective domain shutdown. |
| VDDD / VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V supplies for digital logic and analog subsystems; supports independent power gating and noise isolation. |
| SWDCK / SWDIO | Debug Interface | 2-pin Serial Wire Debug (SWD) interface; debug access can be permanently disabled via eFuse for production security. |
Key Features
| Feature | Design Value |
|---|---|
| Secure Dual-Core Architecture | Hardware-isolated M4F and M0+ cores with IPC mailboxes and eight protection contexts enable trusted execution environment (TEE) without software overhead. |
| Ultra-Low-Power Deep Sleep | 7 µA with 64 KB SRAM retention and active peripherals (Deep Sleep SCB, LP comparators, CapSense) eliminates need for external wake controllers in battery-powered sensors. |
| Encrypted XIP from External Flash | SMIF performs on-the-fly AES-128 decryption of code fetched from external Quad-SPI Flash, enabling secure firmware updates without full image loading into RAM. |
| Smart I/O in System Sleep | 6-pin Smart I/O block executes Boolean logic (AND/OR/XOR) on GPIO states during Deep Sleep, allowing autonomous event filtering before waking CPU. |
| Integrated CAN FD + USB FS | Single-chip support for automotive-grade CAN FD (up to 5 Mbps) and USB Full-Speed device eliminates companion transceivers and reduces BOM count in industrial gateways. |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central hub aggregating BLE/Zigbee/Wi-Fi sensor data while managing local automation rules and OTA updates. IC Role / Device Role / Timing Role: Dual-core orchestrator: M0+ handles radio stack timing and low-latency interrupts; M4F runs local inference and secure TLS stack. Use Value: On-chip crypto acceleration enables concurrent TLS handshakes and firmware signature verification without performance penalty or external security IC. |
Use Scenario: Battery-powered vibration/temperature node in predictive maintenance systems with 10-year lifespan. IC Role / Device Role / Timing Role: Ultra-low-power sensor processor: Deep Sleep SCB polls ADC every 5 s; Smart I/O filters threshold events; M0+ wakes only on anomaly. Use Value: 7 µA Deep Sleep with 64 KB retained SRAM allows full context preservation across years of intermittent operation, eliminating boot-time reinitialization delays. |
| Medical Wearable | Automotive Body Control Module |
|
Use Scenario: ECG/PPG patch with real-time motion artifact cancellation and encrypted health data transmission. IC Role / Device Role / Timing Role: Signal processing engine: M4F executes adaptive filtering and HRV analysis; CapSense enables dry-electrode contact detection. Use Value: Synchronized dual 12-bit SAR ADCs sample analog front-end channels simultaneously, enabling precise phase-aligned bio-signal acquisition. |
Use Scenario: LIN/CAN FD gateway controlling lighting, HVAC, and door modules in 12 V vehicle architectures. IC Role / Device Role / Timing Role: Protocol bridge: CAN FD handles high-speed ECU communication; SCBs manage LIN transceivers and PWM dimming drivers. Use Value: Integrated CAN FD controller with bit-rate switching (up to 5 Mbps) and built-in CRC offload reduces MCU load and improves diagnostic response time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247AZI-D54 | Same die revision, but 512 KB flash, 256 KB SRAM, and additional QFN-80 package option; no change in peripheral set or power specs. | Targeted for larger firmware footprints (e.g., multi-protocol stacks with full Bluetooth LE + Thread + Matter) | Select when >256 KB flash or >128 KB SRAM is required; identical pinout and software compatibility. |
| STM32WB55RGV | Single Cortex-M4 core (64 MHz), integrated BLE 5.0 radio, 1 MB flash, 256 KB SRAM; lacks CAN FD, Deep Sleep SCB, and Smart I/O. | Better suited for BLE-centric devices where RF integration outweighs dual-CPU flexibility and ultra-low-power analog features. | Choose for cost-sensitive BLE endpoints; avoid when CAN FD, deterministic Deep Sleep peripheral control, or CapSense are mandatory. |
Compared with CY8C6244AZI-S4D62, CY8C6247AZI-D54 offers scalable memory for complex firmware, while STM32WB55RGV trades dual-core flexibility and analog richness for integrated BLE-but lacks the deterministic low-power peripheral autonomy critical for industrial sensing.
Availability
CY8C6244AZI-S4D62 is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, medical wearables, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C6244AZI-S4D62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, security ICs, and industrial sensors, with global manufacturing and R&D infrastructure.
The PSOC™ 62 product line targets secure, ultra-low-power IoT edge devices-designed to unify real-time processing, hardware-enforced security, and intelligent analog front-ends in a single chip for battery-operated and safety-critical applications.
FAQ
What is the maximum operating frequency of each CPU core in the CY8C6244AZI-S4D62?
The CY8C6244AZI-S4D62 features a 150-MHz Arm Cortex-M4F core with floating-point unit and memory protection unit, and a 100-MHz Cortex-M0+ core with single-cycle multiply and MPU. Both cores operate at their rated frequencies under 3.3 V supply and 25°C ambient, with dynamic voltage scaling supporting 1.1 V or 0.9 V core logic operation.
Does the CY8C6244AZI-S4D62 support hardware-accelerated cryptographic operations?
Yes-it integrates dedicated hardware accelerators for AES-128/256, SHA-256, ECC (NIST P-256), and RSA-2048, plus a True Random Number Generator (TRNG). These units operate independently of the CPU cores, enabling concurrent encryption/decryption during active firmware execution without performance degradation.
Can the CY8C6244AZI-S4D62 execute code directly from external Quad-SPI Flash?
Yes-via the Serial Memory Interface (SMIF), it supports Execute-In-Place (XIP) from external Quad-SPI Flash with on-the-fly AES-128 decryption and a 4-KB instruction cache. Throughput reaches 320 Mbps in quad mode, and the feature remains functional in all active power modes except Hibernate.
How many GPIOs support capacitive sensing, and what CapSense™ modes are available?
All 62 GPIOs are CapSense™-capable. The device supports Capacitive Sigma-Delta (CSD) with both self-capacitance and mutual-capacitance sensing, dynamic reconfiguration between modes, automatic hardware tuning (SmartSense™), and Deep Sleep operation-enabling touch, proximity, and liquid-tolerant interfaces with <60 dB SNR.
CY8C6244AZI-S4D62 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- PSOC™
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- CANbus, FIFO, I2C, LINbus, QSPI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6244AZI-S4D62 FAQ
1.How can I place an order for CY8C6244AZI-S4D62 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6244AZI-S4D62 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6244AZI-S4D62 reliable?
The price and inventory of CY8C6244AZI-S4D62 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6244AZI-S4D62 is usually 5 days.
3.What payment methods are accepted for CY8C6244AZI-S4D62?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6244AZI-S4D62 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6244AZI-S4D62?
CY8C6244AZI-S4D62 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6244AZI-S4D62 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6244AZI-S4D62?
For technical support, including CY8C6244AZI-S4D62 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6244AZI-S4D62 requirements.
6.How does Aetrix verify that CY8C6244AZI-S4D62 is sourced from the original manufacturer or authorized distributors?
All CY8C6244AZI-S4D62 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6244AZI-S4D62 meets industry standards.
7.What is the process for return or replacement of CY8C6244AZI-S4D62?
All CY8C6244AZI-S4D62 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6244AZI-S4D62, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6244AZI-S4D62 part is unused and in its original packaging.
Return procedure for CY8C6244AZI-S4D62:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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