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Infineon Technologies CY8C6244LQI-S4D12

Part No.:
CY8C6244LQI-S4D12
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C6244LQI-S4D12.pdf
Description:
IC MCU 32BIT 256KB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,914

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Product details

Overview

CY8C6244LQI-S4D12 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 256 KB flash, 128 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.

For engineers reviewing the CY8C6244LQI-S4D12 datasheet, CY8C6244LQI-S4D12 pinout, CY8C6244LQI-S4D12 application, or CY8C6244LQI-S4D12 equivalent, key selection criteria include dual-CPU power/performance trade-off, on-chip DC-DC buck efficiency below 1 µA quiescent current, QSPI XIP with on-the-fly encryption, and hardware-accelerated AES/SHA/TRNG for secure firmware updates.

Technical Context

The device integrates two independent CPU subsystems: a 150-MHz Cortex-M4F with FPU and MPU for application processing, and a 100-MHz Cortex-M0+ for real-time control and low-power background tasks. Inter-processor communication (IPC) enables synchronized task partitioning and secure context isolation across eight protection contexts.

Its programmable analog subsystem includes two 12-bit 2-Msps SAR ADCs with synchronized sampling and Deep Sleep operation, one 12-bit DAC with <2-µs settling time, two opamps, and two low-power comparators - all functional in Deep Sleep mode to support always-on sensing without wake-up latency.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with single-cycle multiply and MPU
Memory 256 KB application flash (RWW), 32 KB supervisory flash, 128 KB SRAM with programmable retention granularity
Low-Power Performance 7 µA Deep Sleep current with 64 KB SRAM retention; on-chip DC-DC buck with <1 µA quiescent current
Analog Peripherals Two 12-bit 2-Msps SAR ADCs (16-channel sequencer, result averaging), one 12-bit DAC (<2 µs settling), two opamps, two LP comparators
Digital Interfaces Six configurable SCBs (SPI/I²C/UART), one Deep Sleep SCB, USB Full-Speed device, one CAN FD block, QSPI/SMIF with XIP and hardware encryption
Security ROM-based Secure Boot, execute-only memory, debug/test ingress disable, hardware crypto accelerators (AES, SHA, ECC, TRNG)
Operating Voltage 1.7 V to 3.6 V supply range; user-selectable core logic at 1.1 V or 0.9 V for dynamic power scaling

Pinout & Package

This device is housed in an 80-pin TQFP package (LQI suffix), with 62 GPIOs including six Smart I/O pins supporting Boolean operations in Deep Sleep, two overvoltage-tolerant (OVT) pins, and dedicated JTAG/SWJ debug interface pins.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] General-purpose I/O bank 0 Configurable drive modes, slew rates; supports capacitive sensing (CSD) and Smart I/O logic
P1[0]–P1[7] General-purpose I/O bank 1 Includes two OVT pins; supports analog input, comparator inputs, and TCPWM capture
P12[0]–P12[7] General-purpose I/O bank 12 Supports LCD segment/common outputs and QSPI data lines (IO0–IO3)
SWDCLK / SWDIO JTAG/SWJ debug interface Provides non-intrusive debug access; can be disabled permanently for production security
VDDA / VSSA Analog power supply/ground Separate analog domain for ADC/DAC/Opamp operation; requires local decoupling for noise immunity
USB_DP / USB_DM USB Full-Speed differential pair Integrated transceiver compliant with USB 2.0 FS; no external PHY required
CAN_TX / CAN_RX CAN FD physical layer interface Dedicated pins for CAN FD controller; supports bit rates up to 5 Mbps with flexible data phase

Key Features

Feature Design Value
Dual-CPU Power Gating Independent voltage scaling (0.9 V / 1.1 V) and clock gating per core enable fine-grained energy optimization for mixed workloads
QSPI XIP with Encryption Execute-in-place from external flash with on-the-fly AES decryption and 4-KB cache reduces boot latency and external memory bandwidth
Deep Sleep Analog Operation ADC, DAC, comparators, and opamps remain active in Deep Sleep mode, enabling continuous sensor monitoring without CPU wake-up
Hardware Crypto Acceleration Dedicated engines for AES-128/256, SHA-1/256, ECC P-256, and TRNG deliver cryptographic throughput without CPU overhead or software stack vulnerability
Smart I/O Logic Six GPIOs form a programmable logic block supporting Boolean functions (AND/OR/XOR) and state machines during system Deep Sleep

Applications

Industrial Sensor Node Secure Wireless Gateway

Use Scenario: Battery-powered vibration and temperature monitoring in predictive maintenance systems.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles ADC sampling, filtering, and CAN FD telemetry; M4F runs ML inference and secure OTA update verification.

Use Value: 7 µA Deep Sleep with 64 KB SRAM retention extends battery life to >5 years; on-chip DC-DC buck minimizes voltage conversion loss.

Use Scenario: BLE/Wi-Fi gateway aggregating data from multiple sensor clusters and forwarding via TLS-secured cloud uplink.

IC Role / Device Role / Timing Role: M4F executes ModusToolbox™ middleware, TLS stack, and USB CDC virtual COM; M0+ manages BLE HCI transport and hardware crypto offload.

Use Value: Hardware AES/SHA/TRNG accelerates TLS handshake by 8× vs. software-only; USB Full-Speed enables direct PC-side firmware recovery without external programmer.

Capacitive Touch HMI Automotive Body Control Module

Use Scenario: Waterproof touch panel for smart home appliances with proximity wake-up and liquid tolerance.

IC Role / Device Role / Timing Role: CAPSENSE™ CSD subsystem performs self/mutual sensing with SmartSense auto-tuning; M0+ processes gesture logic in Deep Sleep.

Use Value: Best-in-class SNR and automatic calibration eliminate manual tuning; Smart I/O enables wake-on-touch with zero CPU involvement.

Use Scenario: Low-voltage body electronics node controlling door locks, interior lighting, and LIN bus peripherals.

IC Role / Device Role / Timing Role: CAN FD interface communicates with central ECU; segmented LCD driver displays status; opamps condition hall-effect sensor signals.

Use Value: Integrated CAN FD PHY eliminates external transceiver; 1.7–3.6 V operation supports wide automotive battery range; OTP eFuse stores calibration data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RGV6 Single Cortex-M4 core with Cortex-M0+ radio controller; lacks dual-application CPU, no on-chip DC-DC, lower analog integration (no DAC/opamps) Optimized for Bluetooth LE + MCU integration; not suitable for simultaneous high-throughput analog acquisition and CAN FD comms Select when BLE coexistence is primary requirement and analog peripheral count is minimal
NXP LPC55S69JBD100 Dual Cortex-M33 cores with TrustZone; no CAN FD, no integrated DC-DC, higher Deep Sleep current (25 µA) Focused on secure boot and trusted execution; weaker low-power analog subsystem and no QSPI XIP encryption Select when hardware-enforced security isolation (TrustZone) outweighs ultra-low-power analog and CAN FD needs

Compared with STM32WB55RGV6 and LPC55S69JBD100, CY8C6244LQI-S4D12 uniquely combines dual-application CPU performance, sub-10 µA Deep Sleep with full analog operation, CAN FD + USB + QSPI encryption, and hardware crypto - making it optimal for resource-constrained, multi-interface IoT edge controllers.

Availability

CY8C6244LQI-S4D12 is available at Aetrix Electronics and suitable for industrial sensor nodes, secure wireless gateways, capacitive touch HMIs, and automotive body control modules requiring stable component supply across long-lifecycle deployments.

Supply support for CY8C6244LQI-S4D12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The PSOC™ 62 product line delivers programmable, ultra-low-power, and security-hardened MCUs for IoT endpoints - integrating analog, digital, and radio-adjacent peripherals into a single chip to reduce system complexity and bill-of-materials cost.

FAQ

What is the maximum operating frequency of each CPU core in the CY8C6244LQI-S4D12?

The CY8C6244LQI-S4D12 features a 150-MHz Arm Cortex-M4F core with floating-point unit and memory protection unit, and a 100-MHz Cortex-M0+ core with single-cycle multiply and MPU. Both cores operate independently with separate clock trees and voltage domains, enabling concurrent real-time and application-level processing without contention.

Does this MCU support hardware-accelerated cryptographic operations, and which algorithms are implemented?

Yes, the CY8C6244LQI-S4D12 includes a dedicated cryptography accelerator supporting AES-128/256 (ECB/CBC/CTR/GCM), SHA-1/256, ECC P-256, and true random number generation (TRNG). These functions execute in hardware without CPU intervention, reducing latency and eliminating software-based side-channel vulnerabilities in secure boot and TLS operations.

Can the device perform analog-to-digital conversion while in Deep Sleep mode?

Yes, both 12-bit SAR ADCs operate fully in Deep Sleep mode with synchronized sampling, 16-channel sequencer, and result averaging. The ADCs retain configuration and can trigger interrupts or DMA transfers upon completion - enabling continuous sensor monitoring at 7 µA system current without waking the CPU cores.

What package type and pin count does the CY8C6244LQI-S4D12 use, and are there thermal or layout considerations?

The CY8C6244LQI-S4D12 uses an 80-pin TQFP (Thin Quad Flat Package) with 0.5-mm pitch and exposed thermal pad. Layout requires solid ground plane beneath the pad, symmetric thermal vias (≥6 × 0.3-mm), and strict separation between analog (VDDA/VSSA) and digital (VDDD/VSSD) power domains to maintain ADC/DAC accuracy and noise immunity.

CY8C6244LQI-S4D12 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6244LQI-S4D12 FAQ

1.How can I place an order for CY8C6244LQI-S4D12 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6244LQI-S4D12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6244LQI-S4D12 reliable?

The price and inventory of CY8C6244LQI-S4D12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6244LQI-S4D12 is usually 5 days.

3.What payment methods are accepted for CY8C6244LQI-S4D12?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6244LQI-S4D12 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6244LQI-S4D12?

CY8C6244LQI-S4D12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6244LQI-S4D12 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6244LQI-S4D12?

For technical support, including CY8C6244LQI-S4D12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6244LQI-S4D12 requirements.

6.How does Aetrix verify that CY8C6244LQI-S4D12 is sourced from the original manufacturer or authorized distributors?

All CY8C6244LQI-S4D12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6244LQI-S4D12 meets industry standards.

7.What is the process for return or replacement of CY8C6244LQI-S4D12?

All CY8C6244LQI-S4D12 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6244LQI-S4D12, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6244LQI-S4D12 part is unused and in its original packaging.

Return procedure for CY8C6244LQI-S4D12:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6244LQI-S4D12 Tags

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