Infineon Technologies CY8C6245AZI-S3D12
- Part No.:
- CY8C6245AZI-S3D12
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C6245AZI-S3D12.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C6245AZI-S3D12 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 512 KB flash, 256 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports XIP from external QSPI flash at up to 320 Mbps. Designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6245AZI-S3D12 datasheet, CY8C6245AZI-S3D12 pinout, CY8C6245AZI-S3D12 application, or CY8C6245AZI-S3D12 equivalent, this MCU delivers verified dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC (<1 µA quiescent), and production-ready security features including ROM-based Secure Boot, eFuse protection contexts, and TRNG-critical for certified industrial and medical endpoint designs.
Technical Context
The device implements a tightly coupled dual-CPU subsystem: the 150-MHz Cortex-M4F handles compute-intensive tasks (e.g., sensor preprocessing, encryption) while the 100-MHz Cortex-M0+ manages low-latency I/O and peripheral control. Inter-processor communication uses hardware IPC channels with mailbox and interrupt support.
Its clock system integrates an 8-MHz IMO (±2%), 32-kHz ILO, programmable PLL/FLL, and integer/fractional dividers-enabling independent clock domains for CPU cores, peripherals, and SMIF. The CAN FD block supports data rates up to 5 Mbps and ISO 11898-1:2015 compliance with flexible bit timing configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 512 KB flash (RWW), 256 KB SRAM (programmable retention), 1 KB OTP eFuse array |
| Power Efficiency | 7 µA Deep Sleep (64 KB SRAM retained); 22 µA/MHz active current @ 0.9 V core voltage (M4) |
| Connectivity | CAN FD (5 Mbps), USB Full-Speed device, 7 configurable SCBs (SPI/I²C/UART), SD/eMMC host controller |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), 2 LP comparators (active in Deep Sleep), built-in temperature sensor |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES-128/256, ECC, SHA-256), TRNG, 8 protection contexts |
| Package | 100-pin TQFP (14 × 14 mm), 64 GPIOs, 2 Smart I/O ports, 2 OVT pins |
Pinout & Package
CY8C6245AZI-S3D12 is housed in a 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are validated per Infineon's official pinout diagram (Document 002-26168 Rev. *N, Section 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interface operation |
| VDDD / VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V rails; VDDA powers ADC, comparators, and reference circuits |
| XRES | Active-Low Reset Input | Asynchronous reset with internal pull-up; initiates cold boot or system recovery sequence |
| SWDCLK / SWDIO | JTAG/SWD Debug Interface | Two-pin Serial Wire Debug; supports firmware update, real-time tracing, and secure debug disable |
| USB_DP / USB_DM | USB Full-Speed Differential Pair | Integrated transceiver compliant with USB 2.0 FS; no external PHY required |
| CAN_TX / CAN_RX | CAN FD Transceiver Interface | Direct connection to external CAN transceiver; supports FD frame payloads up to 64 bytes |
Key Features
| Feature | Design Value |
|---|---|
| Quad-SPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption and 4 KB cache-reduces BOM cost and boot latency |
| Smart I/O Boolean Logic | Two 8-pin Smart I/O blocks perform real-time combinational logic (AND/OR/XOR) during Deep Sleep-enables wake-on-pattern without CPU wake |
| Capacitive Sensing (CSD) | Sigma-delta CAPSENSE™ with SmartSense auto-tuning, liquid tolerance, and mutual/self-sensing-supports robust touch HMI in humid environments |
| Segment LCD Driver | Drives up to 63 segments × 8 commons with dedicated low-power waveform generator-operates fully in Deep Sleep mode |
| Programmable Analog | Configurable 12-bit SAR ADC with differential input, programmable gain, and hardware averaging-eliminates need for external signal conditioning |
Applications
| Industrial Sensor Node | Medical Wearable |
|---|---|
Use Scenario: Battery-powered vibration and temperature monitoring node in predictive maintenance systems. IC Role / Device Role / Timing Role: Dual-core coordination: M0+ samples analog sensors via SAR ADC and LP comparators; M4 runs FFT analysis and encrypts data before CAN FD transmission. Use Value: 7 µA Deep Sleep extends 2-year battery life; on-chip crypto ensures HIPAA-compliant data integrity without external security IC. |
Use Scenario: ECG patch with capacitive touch controls and real-time heart-rate variability analysis. IC Role / Device Role / Timing Role: M4 processes raw ADC data using CMSIS-DSP libraries; M0+ drives segment LCD and manages CAPSENSE™ buttons during sleep. Use Value: Smart I/O wake-on-touch reduces average current to <10 µA; integrated temperature sensor calibrates ADC offset drift across body temperature range. |
| Automotive Telematics Gateway | Smart Home Hub |
Use Scenario: Low-power vehicle-to-cloud gateway aggregating CAN FD bus data and BLE/Wi-Fi telemetry. IC Role / Device Role / Timing Role: M0+ handles CAN FD protocol stack and message filtering; M4 manages TLS 1.2 handshake and secure OTA updates over USB or QSPI. Use Value: Hardware crypto accelerator cuts TLS handshake time by 65% vs. software-only; DC-DC converter maintains efficiency across 9–16 V automotive input range. |
Use Scenario: Voice-controlled home automation hub with multi-sensor environmental monitoring (temp/humidity/air quality). IC Role / Device Role / Timing Role: M4 runs sensor fusion algorithms and local voice wake-word detection; M0+ interfaces with multiple I²C sensors and drives LCD status display. Use Value: 256 KB SRAM enables concurrent execution of FreeRTOS tasks and ML inference buffers; QSPI XIP allows seamless firmware A/B updates without external memory stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55RGV | Single Cortex-M4 core + Cortex-M0+ radio controller; lacks CAN FD, integrated DC-DC, and Smart I/O logic | Optimized for Bluetooth LE + MCU integration; no native CAN FD or segment LCD driver | Choose when BLE coexistence is primary requirement and CAN FD is handled externally |
| RA6M5G32FPKBE | Single Cortex-M33 core (no M0+ companion); higher flash (2 MB) but no on-chip DC-DC or CAPSENSE™ | Targets functional safety (IEC 61508 SIL3); lacks hardware crypto acceleration for asymmetric algorithms (ECC/SHA) | Prefer for ASIL-B automotive control where safety certification outweighs ultra-low-power edge sensing |
Compared with STM32WB55RGV and RA6M5G32FPKBE, CY8C6245AZI-S3D12 uniquely combines dual-core deterministic partitioning, CAN FD + USB + QSPI in one die, and sub-10 µA Deep Sleep with SRAM retention-making it optimal for resource-constrained, multi-interface IoT endpoints needing both security and longevity.
Availability
CY8C6245AZI-S3D12 is available at Aetrix Electronics and suitable for industrial sensor nodes, medical wearables, automotive telematics gateways, and smart home hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C6245AZI-S3D12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.
This device belongs to the PSoC™ 62 product line-designed specifically for secure, ultra-low-power IoT endpoints that demand concurrent connectivity (CAN FD, USB, QSPI), hardware-enforced trust, and intelligent analog/digital integration without external components.
FAQ
Does CY8C6245AZI-S3D12 support JTAG debugging?
Yes, it supports Serial Wire Debug (SWD) via SWDCLK and SWDIO pins, compatible with standard ARM debug probes. JTAG is not implemented; SWD provides full debug access including breakpoints, memory inspection, and secure debug disable via eFuse programming. The device ID is accessible through the SWJ-DP interface as a 32-bit value with defined revision and manufacturer fields.
What is the maximum operating frequency of the CAN FD peripheral?
The CAN FD block supports data bit rates up to 5 Mbps in fast-phase mode, compliant with ISO 11898-1:2015. It uses dedicated clock dividers tied to the system PLL and supports programmable timing quanta, sample point, and synchronization jump width-enabling robust operation across automotive and industrial CAN FD networks.
Can the SAR ADC operate during Deep Sleep mode?
No-the 12-bit SAR ADC requires active CPU or DMA context and cannot run autonomously in Deep Sleep. However, two low-power comparators remain fully operational in Deep Sleep and can trigger wake events or drive Smart I/O logic without waking the CPUs, enabling ultra-low-power threshold monitoring.
Is external flash required for QSPI XIP functionality?
Yes-QSPI XIP requires an external quad-SPI NOR flash connected to the dedicated SMIF pins (e.g., IO[0]–IO[3], SCK, SS). The on-chip 4 KB SMIF cache and hardware decryption engine enable secure, low-latency execution directly from that flash, eliminating the need to copy code to internal RAM during boot or runtime.
CY8C6245AZI-S3D12 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6245AZI-S3D12 FAQ
1.How can I place an order for CY8C6245AZI-S3D12 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6245AZI-S3D12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6245AZI-S3D12 reliable?
The price and inventory of CY8C6245AZI-S3D12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245AZI-S3D12 is usually 5 days.
3.What payment methods are accepted for CY8C6245AZI-S3D12?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245AZI-S3D12 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6245AZI-S3D12?
CY8C6245AZI-S3D12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6245AZI-S3D12 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6245AZI-S3D12?
For technical support, including CY8C6245AZI-S3D12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245AZI-S3D12 requirements.
6.How does Aetrix verify that CY8C6245AZI-S3D12 is sourced from the original manufacturer or authorized distributors?
All CY8C6245AZI-S3D12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245AZI-S3D12 meets industry standards.
7.What is the process for return or replacement of CY8C6245AZI-S3D12?
All CY8C6245AZI-S3D12 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245AZI-S3D12, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6245AZI-S3D12 part is unused and in its original packaging.
Return procedure for CY8C6245AZI-S3D12:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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