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Infineon Technologies CY8C6245AZI-S3D42

Part No.:
CY8C6245AZI-S3D42
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C6245AZI-S3D42.pdf
Description:
IC MCU 32BIT 512KB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:900

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Product details

Overview

CY8C6245AZI-S3D42 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 62 microcontroller with 512 KB flash, 256 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports capacitive sensing (CSD), segment LCD drive, and Quad-SPI XIP. It targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.

For engineers reviewing the CY8C6245AZI-S3D42 datasheet, CY8C6245AZI-S3D42 pinout, CY8C6245AZI-S3D42 application, or CY8C6245AZI-S3D42 equivalent, key selection considerations include dual-CPU power efficiency trade-offs (22 µA/MHz @ 0.9 V M4), on-chip DC-DC quiescent current (<1 µA), CAN FD timing compliance, and SMIF encryption support for secure external code execution.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles complex signal processing and security-critical tasks while the Cortex-M0+ manages low-power peripheral orchestration and real-time I/O control. Inter-processor communication (IPC) uses dedicated hardware mailboxes with interrupt signaling and memory protection unit (MPU) isolation between domains.

Its clock system integrates an 8-MHz IMO (±2%), 32-kHz ILO, programmable PLL/FLL, and integer/fractional dividers to deliver precise, low-jitter clocks to TCPWMs, SCBs, and USB. The CAN FD block supports data rates up to 5 Mbps with flexible bit timing and hardware message filtering.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory 512-KB flash (RWW), 256-KB SRAM with programmable retention, 1-Kb OTP eFuse
Power Efficiency 7 µA Deep Sleep (64 KB SRAM retained); 22 µA/MHz M4 active current at 0.9 V core
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer), two Deep Sleep-capable comparators, built-in temperature sensor
Digital Interfaces 7 configurable SCBs (SPI/I²C/UART), USB Full-Speed device, CAN FD controller, Quad-SPI/SMIF with XIP + AES encryption
Capacitive Sensing CAPSENSE™ CSD subsystem with SmartSense auto-tuning, liquid tolerance, and self/mutual sensing support
Security ROM-based Secure Boot, hardware crypto accelerator (AES, ECC, SHA), TRNG, eight protection contexts

Pinout & Package

This device is packaged in a 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 pins total) supporting Boolean logic in Deep Sleep mode.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO / Smart I/O Port 0 Support Boolean operations (AND/OR/XOR) during Deep Sleep; programmable drive strength/slew rate
P1[0]–P1[7] GPIO / Smart I/O Port 1 Same Smart I/O capability as Port 0; enables low-power state-machine offload without CPU wake-up
USB_DP / USB_DM USB Full-Speed differential pair Integrated transceiver compliant with USB 2.0 FS; requires no external PHY; supports suspend/resume signaling
CAN_TX / CAN_RX CAN FD physical layer interface Direct connection to external CAN transceiver; supports ISO 11898-1:2015 FD framing and bit rates up to 5 Mbps
VDDIO0–VDDIO3 I/O power domains Four independent 1.7–3.6 V supplies enabling mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V radios)
XRES External reset input Active-low asynchronous reset; internal pull-up; compatible with open-drain reset supervisors

Key Features

Feature Design Value
Dual-Voltage Core Operation User-selectable 1.1 V or 0.9 V CPU supply enables dynamic optimization of performance vs. ultra-low-power operation
On-Chip DC-DC Buck Converter Delivers regulated core voltage with <1 µA quiescent current-critical for battery lifetime in coin-cell applications
Segment LCD Driver Drives up to 63 segments × 8 commons directly from chip; operates in Deep Sleep mode without CPU intervention
Hardware Crypto Acceleration Dedicated engine for AES-128/256, ECC (NIST P-256), SHA-256, and TRNG-offloads CPU and ensures deterministic latency
Capacitive Sensing (CSD) Hardware sigma-delta modulator with >100 dB SNR, automatic SmartSense calibration, and proximity detection in wet environments

Applications

Smart Home Hub Industrial Sensor Node

Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices while running local decision logic and OTA updates.

IC Role / Device Role / Timing Role: Dual-core orchestrator: M4 runs ModusToolbox™ connectivity stacks and TLS; M0+ handles GPIO-triggered wake-up and sensor polling.

Use Value: 7 µA Deep Sleep extends 2xAA battery life beyond 5 years; SMIF encryption secures firmware images loaded from external QSPI flash.

Use Scenario: Wireless vibration/temperature node deployed in hazardous areas with 10-year maintenance cycles.

IC Role / Device Role / Timing Role: Real-time analog front-end: SAR ADC samples piezoelectric sensor at 2 Msps; TCPWMs generate precise PWM excitation for RTD measurement.

Use Value: On-chip temperature sensor calibrates ADC offset drift; CAN FD enables deterministic multi-node synchronization at 2 Mbps.

Medical Wearable Automotive Body Controller

Use Scenario: ECG patch with dry-electrode CAPSENSE™ touch interface and Bluetooth LE coexistence.

IC Role / Device Role / Timing Role: Capacitive sensing hub: CSD subsystem detects finger presence and gesture; M0+ manages low-power sleep/wake transitions.

Use Value: SmartSense auto-tunes baseline in sweat-prone conditions; 64-byte backup domain retains RTC and alarm state across power cycles.

Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN/CAN FD bridging.

IC Role / Device Role / Timing Role: Mixed-signal controller: CAN FD receives body ECU commands; GPIOs drive H-bridge motor drivers via PWM from TCPWMs.

Use Value: Two OVT pins tolerate load-dump transients up to ±24 V; hardware CRC accelerates LIN frame checksum generation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RG Single Cortex-M4 core + Cortex-M0+ radio coprocessor; lacks CAN FD, no SMIF/XIP, smaller flash (1 MB but no RWW) Optimized for Bluetooth LE + proprietary 2.4 GHz; no native CAN FD or high-speed serial memory interface Select when BLE coexistence dominates over industrial fieldbus integration and external encrypted code storage is not required.
RA6M5G Single Cortex-M33 core (no M0+ companion); includes CAN FD and USB, but no integrated capacitive sensing or Smart I/O Targets functional safety (IEC 61508 SIL3) and motor control; lacks hardware CSD and Deep Sleep Boolean logic Select when ASIL-B compliance, larger SRAM (1 MB), or Ethernet MAC is prioritized over ultra-low-power touch and autonomous I/O offload.

Compared with STM32WB55RG and RA6M5G, CY8C6245AZI-S3D42 uniquely combines dual-application-core partitioning, on-die SMIF encryption, and hardware-accelerated capacitive sensing-enabling single-chip solutions for battery-powered IoT endpoints requiring both security and human interface intelligence.

Availability

CY8C6245AZI-S3D42 is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, medical wearables, and automotive body controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY8C6245AZI-S3D42 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and automotive ICs, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

This part belongs to the PSoC™ 62 family-designed specifically for secure, ultra-low-power IoT endpoints that demand concurrent wireless connectivity, rich human interface (touch/LCD), and real-time sensor processing in constrained energy budgets.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6245AZI-S3D42?

The Cortex-M4F core operates at up to 150 MHz, verified by the device's internal PLL configuration and electrical specifications in the Infineon datasheet (002-26168 Rev. *N). This frequency is achievable under 1.1 V core voltage with ambient temperature ≤85°C and proper decoupling per layout guidelines.

Does CY8C6245AZI-S3D42 support execute-in-place (XIP) from external flash?

Yes-it features a Quad-SPI/Serial Memory Interface (SMIF) with hardware XIP support, including a 4-KB cache and on-the-fly AES-128 decryption. External flash must be quad-SPI compatible and configured for single/dual/quad mode per the SMIF register map in the technical reference manual.

How many GPIOs support Deep Sleep Boolean logic (Smart I/O)?

Sixteen GPIOs support Smart I/O functionality: eight pins in Port 0 (P0[0]–P0[7]) and eight in Port 1 (P1[0]–P1[7]). These pins retain Boolean logic capability-including AND, OR, XOR, and invert-in Deep Sleep mode without waking either CPU core.

Is CAN FD timing compliant with ISO 11898-1:2015?

Yes-the integrated CAN FD controller meets ISO 11898-1:2015 requirements for arbitration and data phase bit timing, supporting programmable sample points, propagation delay compensation, and bit rates up to 5 Mbps in the data phase, as confirmed in the device's functional description section.

CY8C6245AZI-S3D42 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Number of I/O:
64
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6245AZI-S3D42 FAQ

1.How can I place an order for CY8C6245AZI-S3D42 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6245AZI-S3D42 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6245AZI-S3D42 reliable?

The price and inventory of CY8C6245AZI-S3D42 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245AZI-S3D42 is usually 5 days.

3.What payment methods are accepted for CY8C6245AZI-S3D42?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245AZI-S3D42 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6245AZI-S3D42?

CY8C6245AZI-S3D42 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6245AZI-S3D42 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6245AZI-S3D42?

For technical support, including CY8C6245AZI-S3D42 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245AZI-S3D42 requirements.

6.How does Aetrix verify that CY8C6245AZI-S3D42 is sourced from the original manufacturer or authorized distributors?

All CY8C6245AZI-S3D42 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245AZI-S3D42 meets industry standards.

7.What is the process for return or replacement of CY8C6245AZI-S3D42?

All CY8C6245AZI-S3D42 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245AZI-S3D42, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6245AZI-S3D42 part is unused and in its original packaging.

Return procedure for CY8C6245AZI-S3D42:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6245AZI-S3D42 Tags

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