Infineon Technologies CY8C6245AZI-S3D62
- Part No.:
- CY8C6245AZI-S3D62
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C6245AZI-S3D62.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C6245AZI-S3D62 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 512-KB flash, 256-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration-designed for secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless connectivity.
For engineers reviewing the CY8C6245AZI-S3D62 datasheet, CY8C6245AZI-S3D62 pinout, CY8C6245AZI-S3D62 application, or CY8C6245AZI-S3D62 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC converter (<1 µA quiescent), Deep Sleep current (7 µA w/ 64-KB SRAM retention), and integrated CAPSENSE™ with SmartSense auto-tuning.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles complex signal processing and security tasks while the Cortex-M0+ manages low-power peripheral orchestration and real-time sensor I/O-interconnected via IPC and shared memory with hardware-enforced protection contexts. Both cores operate at independently configurable voltages (0.9 V or 1.1 V) to optimize dynamic power scaling.
Its programmable analog-digital fabric includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and a dedicated CAPSENSE™ sigma-delta subsystem supporting mutual/self-capacitive sensing with liquid tolerance-enabling robust touch and proximity interfaces without host CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 512-KB flash (RWW), 256-KB SRAM with programmable retention granularity, 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9 V core voltage (M4) |
| Analog Peripherals | 12-bit 2-Msps SAR ADC with 16-channel sequencer and result averaging; two low-power comparators active in Deep Sleep |
| Connectivity | CAN FD controller, USB Full-Speed device interface, seven configurable SCBs (SPI/I²C/UART), QSPI/SMIF with XIP and on-the-fly encryption |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES/SHA/RSA/ECC), TRNG, eight protection contexts, debug disable capability |
| Capacitive Sensing | CAPSENSE™ CSD subsystem with SmartSense auto-tuning, supports up to 63 segments, liquid-tolerant and proximity-aware operation |
Pinout & Package
This device is packaged in a 100-pin TQFP (Thin Quad Flat Package) with 64 GPIOs, including two Smart I/O ports (8 pins total), two overvoltage-tolerant (OVT) pins, and dedicated pins for USB D+/D−, CAN H/L, QSPI, and crystal oscillators.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O Port 0 | Support Boolean logic operations during Deep Sleep; configurable drive strength/slew rate |
| P1[0]–P1[7] | GPIO / Smart I/O Port 1 | Same capabilities as Port 0; enables autonomous I/O state management without CPU wake-up |
| USB_DP / USB_DM | USB Full-Speed differential pair | Integrated transceiver compliant with USB 2.0 FS; requires no external PHY |
| CAN_H / CAN_L | CAN FD bus interface terminals | Direct connection to CAN transceiver; supports bit rates up to 5 Mbps with flexible data phase |
| XIN / XOUT | External crystal oscillator input/output | Supports 16–35 MHz crystals for high-accuracy timing; optional internal FLL/PLL multiplication |
| VDDIO0–VDDIO3 | I/O power domains | Independent 1.7–3.6 V supply rails per port group; enables mixed-voltage interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | Runtime-selectable 0.9 V or 1.1 V core voltage per CPU-enables fine-grained trade-off between performance and sub-µA/MHz efficiency |
| On-Chip DC-DC Buck Converter | <1 µA quiescent current; eliminates need for external PMIC in battery-powered designs while maintaining >90% conversion efficiency |
| Segment LCD Driver | Drives up to 63 segments × 8 commons directly from silicon; operates in Deep Sleep mode without CPU involvement |
| Hardware Crypto Acceleration | Dedicated AES-128/256, SHA-256, ECC-256, RSA-2048 engines-offloads cryptographic operations from CPUs, reducing latency and power |
| SmartSense Auto-Tuning | Fully automatic CAPSENSE™ calibration at runtime-eliminates manual tuning across temperature/humidity variations and PCB stackup differences |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices while managing local UI, OTA updates, and secure cloud handshakes. IC Role / Device Role / Timing Role: Dual-core orchestrator: M4 runs TLS stack and UI rendering; M0+ handles radio coexistence, timer-triggered sampling, and watchdog supervision. Use Value: 7 µA Deep Sleep enables multi-year battery life in hub standby; integrated CAN FD allows direct connection to HVAC or lighting control buses. |
Use Scenario: Battery-powered vibration/temperature node deployed in rotating machinery with edge FFT preprocessing before wireless transmission. IC Role / Device Role / Timing Role: Real-time signal acquisition engine: SAR ADC samples at 2 Msps with hardware averaging; M4 executes floating-point FFT; M0+ schedules radio bursts. Use Value: On-chip DC-DC extends battery life by 3× vs linear regulators; Smart I/O ports filter noise autonomously during motor startup surges. |
| Medical Wearable | Automotive Cabin Controller |
|
Use Scenario: ECG/PPG patch with capacitive touch controls, motion sensing, and encrypted Bluetooth LE telemetry to smartphone. IC Role / Device Role / Timing Role: Secure sensor fusion hub: CAPSENSE™ detects finger presence; ADC digitizes analog front-end; crypto engine signs biometric data before transmission. Use Value: Liquid-tolerant CAPSENSE™ ensures reliable touch under sweat; 22 µA/MHz M4 efficiency enables continuous sensing within 100 µA average system budget. |
Use Scenario: Seat/mirror/window control module with touch sliders, CAN FD backbone integration, and anti-tamper firmware validation. IC Role / Device Role / Timing Role: Safety-aware peripheral manager: M0+ monitors door lock status and window position sensors; M4 validates firmware signatures and logs events to protected flash. Use Value: ROM-based Secure Boot prevents unauthorized code execution; eight protection contexts isolate critical safety functions from infotainment software partitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55RG | Single Cortex-M4 core with Bluetooth LE radio; no second CPU, no CAN FD, lower flash (1 MB) but integrated RF transceiver | Better suited for BLE-centric endpoints; lacks dual-CPU task partitioning and CAN FD bus bridging capability | Select when wireless SoC integration outweighs need for deterministic dual-core isolation and automotive-grade bus support |
| RA6M5G | Arm Cortex-M33 dual-bank secure flash MCU; no integrated CAPSENSE™, no Smart I/O, higher active current (60 µA/MHz) | Stronger functional safety certification (ISO 26262 ASIL-B ready); better for ASIL-B automotive body control, weaker for ultra-low-power capacitive UI | Select when ISO 26262 compliance is mandatory and capacitive sensing is handled externally or omitted |
Compared with STM32WB55RG and RA6M5G, CY8C6245AZI-S3D62 uniquely combines sub-µA/MHz dual-core efficiency, on-die CAPSENSE™ with SmartSense, and CAN FD-making it optimal for battery-powered IoT hubs requiring both rich human interface and industrial bus connectivity.
Availability
CY8C6245AZI-S3D62 is available at Aetrix Electronics and suitable for smart home gateways, industrial predictive maintenance sensors, medical wearables, and automotive cabin controllers requiring stable component supply across multi-year production cycles.
Supply support for CY8C6245AZI-S3D62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions-with leadership in silicon carbide, radar, and embedded security IP.
This part belongs to the PSoC™ 62 product line, engineered specifically for secure, ultra-low-power IoT endpoints that demand concurrent real-time processing, rich human interface (touch/LCD), and industrial connectivity (CAN FD/USB).
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6245AZI-S3D62?
The Cortex-M4F core operates at up to 150 MHz, verified in the official Infineon datasheet (002-26168 Rev. *N). This frequency is achievable under 1.1-V core supply with appropriate thermal management and clock configuration using the on-chip PLL or FLL. At 0.9 V, the maximum rated frequency is reduced to maintain timing closure and power integrity.
Does CY8C6245AZI-S3D62 support execute-in-place (XIP) from external flash?
Yes, the device supports XIP via its Quad-SPI/SMIF interface with 4-KB on-die cache, enabling direct code execution from external quad SPI flash at up to 320 Mbps. Hardware-accelerated on-the-fly decryption ensures secure boot and runtime code confidentiality without CPU overhead.
Can the CAPSENSE™ subsystem operate during Deep Sleep mode?
Yes, the CAPSENSE™ CSD block remains fully functional in Deep Sleep mode, allowing capacitive touch or proximity detection without waking the CPU cores. It uses the ultra-low-power 32-kHz ILO clock and draws <1 µA during scanning-verified in the device's electrical specifications section (6.3.5 CSD).
What debug interface does CY8C6245AZI-S3D62 use, and is it accessible after security lockdown?
The device uses SWD (Serial Wire Debug) via the SWJ-DP interface, compatible with standard Arm debug tools. After Secure Boot enforcement and debug disable fuse programming, all debug access-including SWD, JTAG, and SWO-is permanently blocked, preventing firmware extraction or runtime inspection while preserving full functional operation.
CY8C6245AZI-S3D62 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6245AZI-S3D62 FAQ
1.How can I place an order for CY8C6245AZI-S3D62 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6245AZI-S3D62 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6245AZI-S3D62 reliable?
The price and inventory of CY8C6245AZI-S3D62 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245AZI-S3D62 is usually 5 days.
3.What payment methods are accepted for CY8C6245AZI-S3D62?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245AZI-S3D62 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6245AZI-S3D62?
CY8C6245AZI-S3D62 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6245AZI-S3D62 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6245AZI-S3D62?
For technical support, including CY8C6245AZI-S3D62 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245AZI-S3D62 requirements.
6.How does Aetrix verify that CY8C6245AZI-S3D62 is sourced from the original manufacturer or authorized distributors?
All CY8C6245AZI-S3D62 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245AZI-S3D62 meets industry standards.
7.What is the process for return or replacement of CY8C6245AZI-S3D62?
All CY8C6245AZI-S3D62 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245AZI-S3D62, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6245AZI-S3D62 part is unused and in its original packaging.
Return procedure for CY8C6245AZI-S3D62:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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