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Infineon Technologies CY8C6245AZI-S3D62

Part No.:
CY8C6245AZI-S3D62
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C6245AZI-S3D62.pdf
Description:
IC MCU 32BIT 512KB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,184

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Product details

Overview

CY8C6245AZI-S3D62 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 512-KB flash, 256-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration-designed for secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless connectivity.

For engineers reviewing the CY8C6245AZI-S3D62 datasheet, CY8C6245AZI-S3D62 pinout, CY8C6245AZI-S3D62 application, or CY8C6245AZI-S3D62 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC converter (<1 µA quiescent), Deep Sleep current (7 µA w/ 64-KB SRAM retention), and integrated CAPSENSE™ with SmartSense auto-tuning.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles complex signal processing and security tasks while the Cortex-M0+ manages low-power peripheral orchestration and real-time sensor I/O-interconnected via IPC and shared memory with hardware-enforced protection contexts. Both cores operate at independently configurable voltages (0.9 V or 1.1 V) to optimize dynamic power scaling.

Its programmable analog-digital fabric includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and a dedicated CAPSENSE™ sigma-delta subsystem supporting mutual/self-capacitive sensing with liquid tolerance-enabling robust touch and proximity interfaces without host CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory 512-KB flash (RWW), 256-KB SRAM with programmable retention granularity, 1-Kb OTP eFuse
Power Efficiency 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9 V core voltage (M4)
Analog Peripherals 12-bit 2-Msps SAR ADC with 16-channel sequencer and result averaging; two low-power comparators active in Deep Sleep
Connectivity CAN FD controller, USB Full-Speed device interface, seven configurable SCBs (SPI/I²C/UART), QSPI/SMIF with XIP and on-the-fly encryption
Security ROM-based Secure Boot, hardware crypto accelerator (AES/SHA/RSA/ECC), TRNG, eight protection contexts, debug disable capability
Capacitive Sensing CAPSENSE™ CSD subsystem with SmartSense auto-tuning, supports up to 63 segments, liquid-tolerant and proximity-aware operation

Pinout & Package

This device is packaged in a 100-pin TQFP (Thin Quad Flat Package) with 64 GPIOs, including two Smart I/O ports (8 pins total), two overvoltage-tolerant (OVT) pins, and dedicated pins for USB D+/D−, CAN H/L, QSPI, and crystal oscillators.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO / Smart I/O Port 0 Support Boolean logic operations during Deep Sleep; configurable drive strength/slew rate
P1[0]–P1[7] GPIO / Smart I/O Port 1 Same capabilities as Port 0; enables autonomous I/O state management without CPU wake-up
USB_DP / USB_DM USB Full-Speed differential pair Integrated transceiver compliant with USB 2.0 FS; requires no external PHY
CAN_H / CAN_L CAN FD bus interface terminals Direct connection to CAN transceiver; supports bit rates up to 5 Mbps with flexible data phase
XIN / XOUT External crystal oscillator input/output Supports 16–35 MHz crystals for high-accuracy timing; optional internal FLL/PLL multiplication
VDDIO0–VDDIO3 I/O power domains Independent 1.7–3.6 V supply rails per port group; enables mixed-voltage interfacing

Key Features

Feature Design Value
Dual-Voltage Core Operation Runtime-selectable 0.9 V or 1.1 V core voltage per CPU-enables fine-grained trade-off between performance and sub-µA/MHz efficiency
On-Chip DC-DC Buck Converter <1 µA quiescent current; eliminates need for external PMIC in battery-powered designs while maintaining >90% conversion efficiency
Segment LCD Driver Drives up to 63 segments × 8 commons directly from silicon; operates in Deep Sleep mode without CPU involvement
Hardware Crypto Acceleration Dedicated AES-128/256, SHA-256, ECC-256, RSA-2048 engines-offloads cryptographic operations from CPUs, reducing latency and power
SmartSense Auto-Tuning Fully automatic CAPSENSE™ calibration at runtime-eliminates manual tuning across temperature/humidity variations and PCB stackup differences

Applications

Smart Home Hub Industrial Sensor Node

Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices while managing local UI, OTA updates, and secure cloud handshakes.

IC Role / Device Role / Timing Role: Dual-core orchestrator: M4 runs TLS stack and UI rendering; M0+ handles radio coexistence, timer-triggered sampling, and watchdog supervision.

Use Value: 7 µA Deep Sleep enables multi-year battery life in hub standby; integrated CAN FD allows direct connection to HVAC or lighting control buses.

Use Scenario: Battery-powered vibration/temperature node deployed in rotating machinery with edge FFT preprocessing before wireless transmission.

IC Role / Device Role / Timing Role: Real-time signal acquisition engine: SAR ADC samples at 2 Msps with hardware averaging; M4 executes floating-point FFT; M0+ schedules radio bursts.

Use Value: On-chip DC-DC extends battery life by 3× vs linear regulators; Smart I/O ports filter noise autonomously during motor startup surges.

Medical Wearable Automotive Cabin Controller

Use Scenario: ECG/PPG patch with capacitive touch controls, motion sensing, and encrypted Bluetooth LE telemetry to smartphone.

IC Role / Device Role / Timing Role: Secure sensor fusion hub: CAPSENSE™ detects finger presence; ADC digitizes analog front-end; crypto engine signs biometric data before transmission.

Use Value: Liquid-tolerant CAPSENSE™ ensures reliable touch under sweat; 22 µA/MHz M4 efficiency enables continuous sensing within 100 µA average system budget.

Use Scenario: Seat/mirror/window control module with touch sliders, CAN FD backbone integration, and anti-tamper firmware validation.

IC Role / Device Role / Timing Role: Safety-aware peripheral manager: M0+ monitors door lock status and window position sensors; M4 validates firmware signatures and logs events to protected flash.

Use Value: ROM-based Secure Boot prevents unauthorized code execution; eight protection contexts isolate critical safety functions from infotainment software partitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RG Single Cortex-M4 core with Bluetooth LE radio; no second CPU, no CAN FD, lower flash (1 MB) but integrated RF transceiver Better suited for BLE-centric endpoints; lacks dual-CPU task partitioning and CAN FD bus bridging capability Select when wireless SoC integration outweighs need for deterministic dual-core isolation and automotive-grade bus support
RA6M5G Arm Cortex-M33 dual-bank secure flash MCU; no integrated CAPSENSE™, no Smart I/O, higher active current (60 µA/MHz) Stronger functional safety certification (ISO 26262 ASIL-B ready); better for ASIL-B automotive body control, weaker for ultra-low-power capacitive UI Select when ISO 26262 compliance is mandatory and capacitive sensing is handled externally or omitted

Compared with STM32WB55RG and RA6M5G, CY8C6245AZI-S3D62 uniquely combines sub-µA/MHz dual-core efficiency, on-die CAPSENSE™ with SmartSense, and CAN FD-making it optimal for battery-powered IoT hubs requiring both rich human interface and industrial bus connectivity.

Availability

CY8C6245AZI-S3D62 is available at Aetrix Electronics and suitable for smart home gateways, industrial predictive maintenance sensors, medical wearables, and automotive cabin controllers requiring stable component supply across multi-year production cycles.

Supply support for CY8C6245AZI-S3D62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions-with leadership in silicon carbide, radar, and embedded security IP.

This part belongs to the PSoC™ 62 product line, engineered specifically for secure, ultra-low-power IoT endpoints that demand concurrent real-time processing, rich human interface (touch/LCD), and industrial connectivity (CAN FD/USB).

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6245AZI-S3D62?

The Cortex-M4F core operates at up to 150 MHz, verified in the official Infineon datasheet (002-26168 Rev. *N). This frequency is achievable under 1.1-V core supply with appropriate thermal management and clock configuration using the on-chip PLL or FLL. At 0.9 V, the maximum rated frequency is reduced to maintain timing closure and power integrity.

Does CY8C6245AZI-S3D62 support execute-in-place (XIP) from external flash?

Yes, the device supports XIP via its Quad-SPI/SMIF interface with 4-KB on-die cache, enabling direct code execution from external quad SPI flash at up to 320 Mbps. Hardware-accelerated on-the-fly decryption ensures secure boot and runtime code confidentiality without CPU overhead.

Can the CAPSENSE™ subsystem operate during Deep Sleep mode?

Yes, the CAPSENSE™ CSD block remains fully functional in Deep Sleep mode, allowing capacitive touch or proximity detection without waking the CPU cores. It uses the ultra-low-power 32-kHz ILO clock and draws <1 µA during scanning-verified in the device's electrical specifications section (6.3.5 CSD).

What debug interface does CY8C6245AZI-S3D62 use, and is it accessible after security lockdown?

The device uses SWD (Serial Wire Debug) via the SWJ-DP interface, compatible with standard Arm debug tools. After Secure Boot enforcement and debug disable fuse programming, all debug access-including SWD, JTAG, and SWO-is permanently blocked, preventing firmware extraction or runtime inspection while preserving full functional operation.

CY8C6245AZI-S3D62 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Number of I/O:
64
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6245AZI-S3D62 FAQ

1.How can I place an order for CY8C6245AZI-S3D62 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6245AZI-S3D62 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6245AZI-S3D62 reliable?

The price and inventory of CY8C6245AZI-S3D62 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245AZI-S3D62 is usually 5 days.

3.What payment methods are accepted for CY8C6245AZI-S3D62?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245AZI-S3D62 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6245AZI-S3D62?

CY8C6245AZI-S3D62 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6245AZI-S3D62 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6245AZI-S3D62?

For technical support, including CY8C6245AZI-S3D62 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245AZI-S3D62 requirements.

6.How does Aetrix verify that CY8C6245AZI-S3D62 is sourced from the original manufacturer or authorized distributors?

All CY8C6245AZI-S3D62 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245AZI-S3D62 meets industry standards.

7.What is the process for return or replacement of CY8C6245AZI-S3D62?

All CY8C6245AZI-S3D62 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245AZI-S3D62, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6245AZI-S3D62 part is unused and in its original packaging.

Return procedure for CY8C6245AZI-S3D62:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6245AZI-S3D62 Tags

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