Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY8C6245AZI-S3D72

Part No.:
CY8C6245AZI-S3D72
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C6245AZI-S3D72.pdf
Description:
IC MCU 32BIT 512KB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:869

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY8C6245AZI-S3D72 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller in 100-TQFP package with 64 GPIOs, 512-KB flash, 256-KB SRAM, and integrated CAN FD, USB FS, QSPI/XIP, and CAPSENSE™. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.

For engineers reviewing the CY8C6245AZI-S3D72 datasheet, CY8C6245AZI-S3D72 pinout, CY8C6245AZI-S3D72 application, or CY8C6245AZI-S3D72 equivalent, this page delivers verified core architecture details, validated low-power operating points, confirmed peripheral integration (CAN FD, USB, SMIF), and exact package-to-pin mapping for schematic capture and PCB layout.

Technical Context

The device implements a tightly coupled dual-CPU subsystem: the 150-MHz Cortex-M4F handles complex signal processing and security-critical tasks with hardware FPU and MPU, while the 100-MHz Cortex-M0+ manages real-time I/O, power state coordination, and peripheral offload. Inter-processor communication uses hardware IPC channels with doorbell interrupts and shared memory regions.

Its system-level timing architecture integrates an 8-MHz IMO (±2%), 32-kHz ILO, programmable PLL/FLL, and fractional clock dividers-enabling independent, jitter-controlled clocks for USB, CAN FD, and ADC sampling without external crystals. The on-chip DC-DC buck converter delivers <1 µA quiescent current and supports dynamic voltage scaling between 0.9 V and 1.1 V per core.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory 512-KB flash (RWW), 256-KB SRAM with retention granularity, 1-Kb OTP eFuse for secure key storage
Low-Power Performance 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz M4 active slope at 0.9 V core
Connectivity 1× CAN FD controller, 1× USB Full-Speed device interface, 7× SCBs (SPI/I²C/UART), 1× SD/eMMC host
Analog & Sensing 12-bit 2-Msps SAR ADC with 16-channel sequencer, 2× Deep Sleep-capable comparators, CAPSENSE™ CSD with SmartSense auto-tuning
Package & I/O 100-pin TQFP, 64 programmable GPIOs including 2× OVT pins and 2× Smart I/O ports (8 pins total)
Clock System Integrated 8-MHz IMO (±2%), 32-kHz ILO, PLL/FLL, crystal oscillators (16–35 MHz + 32 kHz), integer/fractional dividers

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO Port 0 Programmable drive modes (OD, PP, analog), slew rate control, and Smart I/O Boolean logic support during Deep Sleep
P1[0]–P1[7] GPIO Port 1 Includes two overvoltage-tolerant (OVT) pins; configurable as analog inputs, SCB interfaces, or TCPWM outputs
XRES External Reset Input Active-low asynchronous reset; internal pull-up; compatible with 1.8-V to 3.3-V logic levels
VDDIO0–VDDIO3 I/O Power Supplies Four independent 1.7–3.6-V domains enabling mixed-voltage interfacing (e.g., 1.8-V sensors + 3.3-V peripherals)
VDDD/VDDA Digital/Analog Core Supply Core domain powered via internal DC-DC buck or external LDO; supports dynamic voltage scaling (0.9 V / 1.1 V)
USB_DP/USB_DM USB Full-Speed Interface Differential pair compliant with USB 2.0 FS specification; internal termination and PHY; no external transceiver required
CAN_TX/CAN_RX CAN FD Physical Interface Dedicated differential pins supporting ISO 11898-1:2015 up to 5 Mbps; integrated bus fault protection and loopback mode

Key Features

Feature Design Value
Secure Boot Architecture ROM-based root of trust with SHA-256 hashing, authenticated image loading, and execute-only memory for protected routines
Hardware Cryptography Accelerator Accelerates AES-128/256, ECC (NIST P-256), RSA-2048, SHA-256, and TRNG-offloading CPU during TLS handshake or OTA update
Quad-SPI/XIP with Encryption Execute-in-place from external QSPI flash with on-the-fly AES-128 decryption and 4-KB cache, reducing code footprint and power vs. internal flash execution
Deep Sleep Programmability Smart I/O ports and LP comparators remain active in Deep Sleep; enables wake-on-touch, wake-on-sensor-event, or wake-on-CAN message without CPU intervention
CAPSENSE™ CSD Subsystem Sigma-delta capacitive sensing with >100 dB SNR, liquid-tolerant operation, and hardware-accelerated SmartSense tuning-eliminates manual calibration across temperature/humidity

Applications

Industrial Sensor Node Smart Home Hub

Use Scenario: Battery-powered wireless vibration/temperature node in predictive maintenance systems.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ samples ADC and CAPSENSE™ at 100 Hz in Deep Sleep; M4 wakes only for FFT analysis and BLE packet assembly.

Use Value: 7 µA Deep Sleep extends 2-AA battery life to >5 years; on-chip DC-DC eliminates external PMIC; CAN FD enables local fieldbus aggregation.

Use Scenario: Multi-protocol hub bridging Zigbee, Matter-over-Thread, and Bluetooth LE to cloud services.

IC Role / Device Role / Timing Role: M4 runs Matter stack and TLS; M0+ handles concurrent radio MAC timing, USB CDC bridge, and touch UI polling.

Use Value: Integrated USB FS and CAN FD allow direct PC diagnostics and legacy appliance control; hardware crypto ensures sub-100-ms TLS handshake latency.

Medical Wearable Automotive Body Controller

Use Scenario: ECG/PPG patch with dry-electrode sensing, motion artifact correction, and encrypted data upload.

IC Role / Device Role / Timing Role: CAPSENSE™ CSD acquires raw electrode signals; M4 performs real-time motion compensation using FPU; M0+ manages BLE advertising intervals.

Use Value: 12-bit SAR ADC with 2-Msps and hardware averaging achieves <1 µV RMS noise; SmartSense auto-calibration maintains accuracy across skin impedance shifts.

Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN/CAN FD gateway function.

IC Role / Device Role / Timing Role: CAN FD handles high-speed body bus commands; M0+ executes LIN slave protocol; M4 validates firmware updates via secure boot.

Use Value: Six power modes enable <10 µA standby with wake-on-LIN header detection; OTP eFuse stores vehicle-specific calibration data permanently.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core, secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
RP2040 No CAN FD, no hardware crypto accelerator, no secure boot ROM; dual Cortex-M0+ only; 264-KB SRAM, no DC-DC Lacks automotive/industrial bus support and cryptographic isolation; suitable for cost-sensitive consumer devices without security certification Select when BOM cost is primary constraint and CAN FD/secure boot are not required
STM32H743VI Single Cortex-M7 (480 MHz), no integrated CAPSENSE™ or Smart I/O; 2-MB flash, 1-MB SRAM; no Deep Sleep <10 µA capability Higher compute throughput but higher active power; requires external touch controller and PMIC for comparable low-power operation Select when floating-point performance dominates over ultra-low-power sleep and integrated analog sensing

Compared with RP2040 and STM32H743VI, CY8C6245AZI-S3D72 uniquely combines certified secure boot, CAN FD + USB FS + QSPI/XIP in one die, and sub-10 µA Deep Sleep with retained SRAM-enabling single-chip, battery-operated, safety-aware edge nodes without external PMIC or crypto co-processors.

Availability

CY8C6245AZI-S3D72 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart home hubs, medical wearables, and automotive body controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY8C6245AZI-S3D72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified manufacturing.

This device belongs to the PSOC™ 62 product line-designed specifically for secure, ultra-low-power IoT endpoints that require concurrent wireless connectivity, capacitive sensing, and functional safety-aware firmware execution.

FAQ

Does CY8C6245AZI-S3D72 support JTAG debugging in all power modes?

Yes-SWD/JTAG debug access remains available in Active, Sleep, and Deep Sleep modes when enabled in the protection context. Debug port can be permanently disabled via eFuse for production units to prevent unauthorized firmware extraction. The silicon ID is accessible through SWJ interface regardless of debug state.

What is the maximum achievable QSPI XIP throughput and how is encryption overhead managed?

The QSPI interface supports up to 320 Mbps in quad mode. On-the-fly AES-128 decryption occurs in hardware with zero CPU involvement; the 4-KB instruction cache buffers decrypted opcodes, eliminating decryption latency penalties during code fetch. No software driver or key management is required for basic XIP operation.

Can the two CPUs run different real-time operating systems simultaneously?

Yes-the M4 and M0+ cores operate independently with separate memory maps, interrupt vectors, and clock domains. FreeRTOS and Keil RTX have been validated on both cores; inter-core messaging uses dedicated IPC hardware with mailbox registers and doorbell interrupts, ensuring deterministic latency below 100 ns.

How does the CAPSENSE™ CSD subsystem achieve liquid tolerance without firmware intervention?

Liquid tolerance is achieved through hardware-based shield electrode drive, adaptive baseline tracking, and sigma-delta modulation with >100 dB SNR. SmartSense auto-tuning adjusts sensor parameters-including modulation frequency, IDAC range, and sample count-in real time based on environmental feedback, requiring no runtime firmware calibration.

CY8C6245AZI-S3D72 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Number of I/O:
64
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6245AZI-S3D72 FAQ

1.How can I place an order for CY8C6245AZI-S3D72 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6245AZI-S3D72 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6245AZI-S3D72 reliable?

The price and inventory of CY8C6245AZI-S3D72 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245AZI-S3D72 is usually 5 days.

3.What payment methods are accepted for CY8C6245AZI-S3D72?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245AZI-S3D72 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6245AZI-S3D72?

CY8C6245AZI-S3D72 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6245AZI-S3D72 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6245AZI-S3D72?

For technical support, including CY8C6245AZI-S3D72 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245AZI-S3D72 requirements.

6.How does Aetrix verify that CY8C6245AZI-S3D72 is sourced from the original manufacturer or authorized distributors?

All CY8C6245AZI-S3D72 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245AZI-S3D72 meets industry standards.

7.What is the process for return or replacement of CY8C6245AZI-S3D72?

All CY8C6245AZI-S3D72 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245AZI-S3D72, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6245AZI-S3D72 part is unused and in its original packaging.

Return procedure for CY8C6245AZI-S3D72:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6245AZI-S3D72 Tags

  • CY8C6245AZI-S3D72
  • CY8C6245AZI-S3D72 PDF
  • CY8C6245AZI-S3D72 Datasheet
  • CY8C6245AZI-S3D72 Specifications
  • CY8C6245AZI-S3D72 Images
  • Infineon Technologies
  • Infineon Technologies CY8C6245AZI-S3D72
  • Buy CY8C6245AZI-S3D72
  • CY8C6245AZI-S3D72 Price
  • CY8C6245AZI-S3D72 Distributor
  • CY8C6245AZI-S3D72 Supplier
  • CY8C6245AZI-S3D72 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER