Infineon Technologies CY8C6245FNI-S3D41T
- Part No.:
- CY8C6245FNI-S3D41T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 49-XBGA, WLCSP
- Datasheet:
-
CY8C6245FNI-S3D41T.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 49WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:1,223
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C6245FNI-S3D41T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 512 KB flash, 256 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports XIP from external QSPI flash at up to 320 Mbps-targeted for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6245FNI-S3D41T datasheet, CY8C6245FNI-S3D41T pinout, CY8C6245FNI-S3D41T application, or CY8C6245FNI-S3D41T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), on-chip DC-DC buck (<1 µA quiescent), CAN FD + USB FS concurrency, and hardware TRNG + secure boot enforcement in ROM.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles complex signal processing and security-critical tasks while the Cortex-M0+ manages low-power peripheral orchestration and real-time I/O control. Inter-processor communication (IPC) uses dedicated hardware mailboxes with interrupt signaling and memory-mapped shared RAM.
Its clock architecture integrates an 8-MHz IMO (±2%), 32-kHz ILO, programmable PLL/FLL, and integer/fractional peripheral dividers-enabling independent clock domains for USB, CAN FD, and TCPWMs without cross-domain jitter coupling. The SMIF controller supports on-the-fly AES-128 decryption during XIP execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 512-KB flash (RWW), 256-KB SRAM with programmable retention, 1-Kb OTP eFuse array |
| Low-Power Performance | 7 µA Deep Sleep (64 KB SRAM retained); 22 µA/MHz M4 @ 0.9 V core voltage |
| Connectivity | CAN FD block, USB Full-Speed device interface, 7 configurable SCBs (SPI/I²C/UART) |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 low-power comparators active in Deep Sleep |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES/RSA/ECC/SHA), TRNG, 8 protection contexts |
| Package | 100-pin TQFP (64 GPIOs), RoHS-compliant, industrial temperature range (–40°C to +85°C) |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm, 0.5 mm pitch, exposed thermal pad. Compatible with standard reflow profiles and automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Bank 0 | Programmable drive modes (OD, PP, Hi-Z), slew rate control, Smart I/O Boolean logic support in Deep Sleep |
| P1[0]–P1[7] | GPIO Bank 1 | Includes two overvoltage-tolerant (OVT) pins; configurable as analog inputs or digital peripherals |
| USB_DP / USB_DM | USB Full-Speed Interface | Differential pair routed internally to USB PHY; requires 27-Ω series termination and 1.5-kΩ pull-up on DP |
| CAN_TX / CAN_RX | CAN FD Transceiver Interface | Direct connection to external CAN transceiver; supports bit rates up to 5 Mbps with flexible data phase timing |
| VDDIO0 / VDDIO1 | I/O Power Supply | Independent 1.7–3.6 V supplies per bank; enables mixed-voltage interfacing (e.g., 1.8 V logic with 3.3 V sensors) |
| XRES | External Reset Input | Active-low, Schmitt-triggered, debounced via internal RC filter; asserts system reset when held low ≥ 100 ns |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | User-selectable 1.1 V or 0.9 V CPU supply enables dynamic trade-off between performance (150 MHz M4) and ultra-low active current (22 µA/MHz) |
| Hardware Crypto Acceleration | Dedicated engine for AES-128/256, SHA-256, RSA-2048, ECC P-256, and TRNG-offloads encryption from CPUs, reducing latency and power |
| Segment LCD Driver | Drives up to 63 segments × 8 commons directly from SRAM buffers; operates in Deep Sleep mode without CPU wake-up |
| Capacitive Sensing (CSD) | Sigma-delta modulator with SmartSense auto-tuning; achieves >100 dB SNR, liquid-tolerant touch, and proximity detection without firmware calibration |
| QSPI SMIF with XIP | Execute-in-place from external flash with 4-KB cache, on-the-fly AES decryption, and quad/dual/single interface flexibility-reduces BOM cost and boot time |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
Use Scenario: Central gateway aggregating Zigbee, BLE, and Thread devices while running local AI inference and OTA updates. IC Role / Device Role / Timing Role: Dual-core orchestrator: M4 runs neural network inference and TLS stack; M0+ handles radio coexistence timing, GPIO event routing, and watchdog supervision. Use Value: On-chip CAN FD and USB FS enable wired diagnostics and legacy fieldbus bridging; 7 µA Deep Sleep extends battery life in backup power scenarios. |
Use Scenario: Battery-powered vibration/temperature node deployed in rotating machinery with predictive maintenance firmware. IC Role / Device Role / Timing Role: Real-time sensor hub: SAR ADC samples accelerometer and thermistor at 2 Msps; TCPWMs generate precise PWM excitation for piezoelectric sensors. Use Value: Hardware TRNG seeds secure firmware update signatures; CSD subsystem detects housing tamper via capacitive seal monitoring. |
| Medical Wearable | Automotive Body Controller |
Use Scenario: ECG patch with dry-electrode sensing, Bluetooth LE telemetry, and on-device arrhythmia detection. IC Role / Device Role / Timing Role: Analog front-end controller: Low-power comparators monitor lead-off in Deep Sleep; ADC oversamples with result averaging for noise suppression. Use Value: 64-byte backup domain retains RTC and critical state across power cycles; OVT pins interface safely with ±5 V ECG electrode drivers. |
Use Scenario: Door module managing window lift, mirror fold, and interior lighting with LIN/CAN FD communication. IC Role / Device Role / Timing Role: Mixed-signal body controller: CAN FD handles high-speed bus messaging; Smart I/O ports implement hardware debounce and latched fault reporting. Use Value: On-chip DC-DC buck eliminates external regulator; 100-MHz M0+ executes deterministic LIN timing with <1 µs jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247FMI-S4D43 | Same die revision, 68-QFN package (53 GPIOs), no USB FS interface, adds 2x additional SCBs | Better suited for space-constrained designs without USB host/device requirements but needing more serial interfaces | Select when board layout prioritizes smaller footprint and USB is not required; verify QFN thermal pad soldering process. |
| NXP LPC55S69-JBD100 | Single Cortex-M33 core (150 MHz), no CAN FD, includes DSP extensions and dual-core TFM secure world, 256 KB flash | Stronger cryptographic isolation via TrustZone, but lacks integrated CAN FD and segment LCD driver | Prefer when Arm TrustZone-based secure enclave is mandatory and CAN FD is handled externally or omitted. |
Compared with CY8C6245FNI-S3D41T, the CY8C6247FMI-S4D43 trades USB FS and TQFP for compactness and extra SCBs, while the LPC55S69 offers TrustZone but requires external CAN transceivers and lacks low-power LCD driving capability.
Availability
CY8C6245FNI-S3D41T is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, medical wearables, and automotive body controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C6245FNI-S3D41T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
This device belongs to the PSOC™ 62 MCU product line-designed specifically for secure, battery-operated IoT endpoints that demand concurrent wireless connectivity, real-time analog sensing, and hardware-enforced firmware integrity.
FAQ
Does CY8C6245FNI-S3D41T support secure boot from external flash?
No. Secure Boot is enforced exclusively from internal flash or ROM. The device verifies the authenticity and integrity of the boot image using hardware hashing before execution, and only allows boot from internal flash sectors marked as protected. External flash may be used for application code storage post-boot, but not for initial boot vector loading.
What is the maximum supported QSPI clock frequency for XIP operation?
The SMIF controller supports QSPI read clocks up to 80 MHz in quad mode, enabling effective throughput of 320 Mbps. This is achieved with internal 4-KB cache and on-the-fly decryption, allowing zero-wait-state execution from external flash under typical operating conditions.
Can both CPUs access the cryptography accelerator simultaneously?
No. The hardware crypto accelerator is a shared resource with arbitration logic. Requests from either CPU are serialized, and the accelerator signals completion via dedicated interrupts. Software must implement mutual exclusion or use the PSoC™ 6 HAL's crypto manager to avoid contention.
Is the 32-kHz ILO accurate enough for RTC applications without external crystal?
Yes. The internal low-speed oscillator (ILO) has ±5% accuracy over temperature and voltage, sufficient for non-precision RTC functions like calendar tracking or periodic wake-up scheduling. For time-critical applications requiring ±20 ppm accuracy, the device supports optional 32.768-kHz external crystal connection to the WCO pins.
CY8C6245FNI-S3D41T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 49-XBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6245FNI-S3D41T FAQ
1.How can I place an order for CY8C6245FNI-S3D41T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6245FNI-S3D41T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6245FNI-S3D41T reliable?
The price and inventory of CY8C6245FNI-S3D41T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245FNI-S3D41T is usually 5 days.
3.What payment methods are accepted for CY8C6245FNI-S3D41T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245FNI-S3D41T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6245FNI-S3D41T?
CY8C6245FNI-S3D41T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6245FNI-S3D41T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6245FNI-S3D41T?
For technical support, including CY8C6245FNI-S3D41T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245FNI-S3D41T requirements.
6.How does Aetrix verify that CY8C6245FNI-S3D41T is sourced from the original manufacturer or authorized distributors?
All CY8C6245FNI-S3D41T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245FNI-S3D41T meets industry standards.
7.What is the process for return or replacement of CY8C6245FNI-S3D41T?
All CY8C6245FNI-S3D41T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245FNI-S3D41T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6245FNI-S3D41T part is unused and in its original packaging.
Return procedure for CY8C6245FNI-S3D41T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C6245FNI-S3D41T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

