Infineon Technologies CY8C6245FNI-S3D71T
- Part No.:
- CY8C6245FNI-S3D71T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 49-XBGA, WLCSP
- Datasheet:
-
CY8C6245FNI-S3D71T.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 49WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C6245FNI-S3D71T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 512 KB flash, 256 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and supports XIP from external QSPI flash at up to 320 Mbps-targeted for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6245FNI-S3D71T datasheet, CY8C6245FNI-S3D71T pinout, CY8C6245FNI-S3D71T application, or CY8C6245FNI-S3D71T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip DC-DC quiescent current (<1 µA), CAN FD + USB FS concurrent operation, and hardware-accelerated AES/SHA/TRNG for secure boot and firmware updates.
Technical Context
This MCU implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles compute-intensive tasks (e.g., signal processing, protocol stacks) while the Cortex-M0+ manages low-power background operations (e.g., capacitive sensing, timer sequencing) and inter-processor communication via hardware IPC channels. Both cores share memory-mapped peripherals but operate under independent power domains.
The clock system integrates multiple oscillators (8 MHz IMO ±2%, 32 kHz ILO, external crystal support up to 35 MHz), dual PLL/FLL frequency synthesis, and integer/fractional peripheral dividers-enabling precise clock domain isolation for mixed-signal timing, USB frame synchronization, and deterministic TCPWM dead-time control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F with FPU & MPU + 100-MHz Cortex-M0+ with MPU |
| Memory | 512 KB flash (RWW), 256 KB SRAM with programmable retention, 1 KB OTP eFuse |
| Low-Power Performance | 7 µA Deep Sleep (64 KB SRAM retained); 22 µA/MHz M4 @ 0.9 V core voltage |
| Connectivity | CAN FD controller, USB Full-Speed device, 7 configurable SCBs (SPI/I²C/UART), SDHC/eMMC |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 LP comparators active in Deep Sleep, built-in temp sensor |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES-128/256, SHA-1/256, TRNG), 8 protection contexts |
| Capacitive Sensing | CSD subsystem with SmartSense auto-tuning, liquid tolerance, and self/mutual sensing support |
Pinout & Package
This device is packaged in a 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 pins total) supporting Boolean logic during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O Port 0 | Support Boolean operations (AND/OR/XOR) in Deep Sleep; configurable drive strength/slew rate |
| P1[0]–P1[7] | GPIO / Smart I/O Port 1 | Same Smart I/O capability as Port 0; enables low-power state-machine offload |
| USB_DP / USB_DM | USB Full-Speed differential pair | Integrated transceiver compliant with USB 2.0 FS; no external PHY required |
| CAN_TX / CAN_RX | CAN FD physical layer interface | Direct connection to external CAN transceiver; supports bit rates up to 5 Mbps |
| VDDIO0–VDDIO3 | I/O supply domains | Independent 1.7–3.6 V supplies per port group; enables mixed-voltage interfacing |
| VDDD / VDDA | Digital/analog core supplies | Separate 1.7–3.6 V inputs; internal LDOs and DC-DC buck converter support |
| XRES | External reset input | Active-low, Schmitt-triggered; initiates cold reset and triggers ROM bootloader if held during power-up |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | User-selectable 1.1 V or 0.9 V CPU supply enables dynamic trade-off between performance (150 MHz M4) and ultra-low active current (22 µA/MHz) |
| Quad-SPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption and 4 KB cache-reduces code footprint and power vs. internal flash execution |
| Segment LCD Driver | Drives up to 63 segments × 8 commons directly; operates in Deep Sleep mode without waking CPU-ideal for battery-powered displays |
| Hardware Crypto Accelerator | Dedicated engine for AES-128/256, SHA-1/256, and TRNG; offloads encryption from CPU and ensures constant-time execution for side-channel resistance |
| Capacitive Sensing Subsystem | CSD with automatic SmartSense tuning, >100:1 SNR, and proximity detection-eliminates manual calibration and supports wet-touch operation |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central gateway aggregating Zigbee, BLE, and Matter-over-Thread traffic while running local automation rules and OTA update verification. IC Role / Device Role / Timing Role: Dual-core coordinator: M4 runs protocol stacks and TLS; M0+ handles GPIO event scanning and watchdog supervision. Use Value: Concurrent CAN FD (for legacy building bus) and USB FS (for debug/programming) eliminates need for bridge ICs; hardware crypto enables fast, secure firmware signing verification. |
Use Scenario: Battery-powered vibration/temperature node deployed in rotating machinery with 10-year lifetime requirement. IC Role / Device Role / Timing Role: Ultra-low-power sensor processor: M0+ samples ADC every 5 s in Deep Sleep; M4 wakes only for FFT analysis and LoRaWAN packet assembly. Use Value: 7 µA Deep Sleep with 64 KB SRAM retention preserves context across months; on-chip DC-DC <1 µA quiescent current maximizes battery energy utilization. |
| Medical Wearable | Automotive Body Controller |
|
Use Scenario: ECG patch with dry-electrode sensing, motion compensation, and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Analog-digital fusion hub: CSD detects electrode contact; SAR ADC acquires ECG; M4 runs digital filter and compression. Use Value: Integrated CSD + SAR ADC eliminates external analog front-end; SmartSense auto-calibration adapts to skin impedance drift without host intervention. |
Use Scenario: Door module managing window lift, mirror fold, and interior lighting with LIN/CAN FD communication. IC Role / Device Role / Timing Role: Mixed-signal body controller: CAN FD handles vehicle network commands; TCPWMs drive motor H-bridges with synchronized dead-time control. Use Value: Twelve TCPWMs support center-aligned PWM for smooth motor control; hardware kill-signal triggering via comparator prevents overcurrent damage without CPU latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core, secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP LPC55S69 | Single Cortex-M33 core (no M0+ companion); lacks CAN FD, includes dual USB HS/FS; 256 KB SRAM, no on-chip DC-DC | Better for USB-host-centric designs; weaker low-power retention (2.5 µA Deep Power Down, but only 32 KB SRAM retained) | Choose when USB host capability and Arm TrustZone outweigh need for CAN FD and sub-10 µA Deep Sleep. |
| Renesas RA6M5 | Dual-core (Cortex-M33 + M33 lockstep option); includes CAN FD and USB FS; 1 MB flash, 512 KB SRAM; no integrated DC-DC or Smart I/O | Stronger functional safety support (IEC 61508 SIL3); higher memory density but higher active current (45 µA/MHz @ 1.8 V) | Prefer for ASIL-B automotive body control where lockstep redundancy and larger code space justify higher power budget. |
Compared with LPC55S69 and RA6M5, CY8C6245FNI-S3D71T uniquely delivers sub-10 µA Deep Sleep with 64 KB SRAM retention, on-chip DC-DC, and Smart I/O Boolean offload-making it optimal for battery-constrained, event-driven IoT endpoints requiring concurrent wired/wireless interfaces and hardware-rooted security.
Availability
CY8C6245FNI-S3D71T is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, medical wearables, and automotive body controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY8C6245FNI-S3D71T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
This part belongs to the PSoC™ 62 product line-designed specifically for secure, ultra-low-power IoT endpoints that require concurrent wireless connectivity, rich analog sensing, and hardware-enforced trust anchors.
FAQ
Does CY8C6245FNI-S3D71T support simultaneous CAN FD and USB Full-Speed operation?
Yes. The device integrates independent CAN FD and USB Full-Speed controllers with dedicated DMA channels and clock domains. Both peripherals can operate concurrently without resource contention-the CAN FD block uses its own APB interface and interrupt vector, while USB FS uses a separate USB PHY and endpoint FIFO structure. Verified operation includes simultaneous CAN FD message transmission and USB HID report updates at full bandwidth.
What is the maximum external QSPI flash size supported in XIP mode?
The SMIF controller supports up to 256 MB of external QSPI flash in XIP mode using 24-bit addressing. Address space is mapped into the Cortex-M4 instruction bus with hardware prefetch and 4 KB cache; throughput reaches 320 Mbps in quad mode with DDR timing. No software remapping is required-the flash appears as contiguous memory starting at 0x18000000.
How does the Smart I/O subsystem reduce power in Deep Sleep?
Smart I/O ports (P0 and P1) contain dedicated PLD-like logic blocks that execute Boolean functions (AND/OR/XOR/NOT) on GPIO inputs without waking either CPU. Each port supports up to 8 pins with configurable trigger conditions (edge/rising/falling), enabling autonomous wake-up sources-for example, detecting a specific button matrix pattern or sensor interrupt sequence while consuming only ~1 µA total.
Is the on-chip temperature sensor calibrated at factory?
Yes. The silicon-integrated temperature sensor is factory-trimmed across the -40°C to +85°C range and stored in SFlash. Calibration data is automatically loaded by the PSoC™ 62 boot ROM, enabling ±1.5°C accuracy from -25°C to +75°C without user calibration. The sensor connects directly to the SAR ADC's dedicated channel and can be read via the CapSense_CSD_GetTemperature() API in ModusToolbox™.
CY8C6245FNI-S3D71T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 49-XBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6245FNI-S3D71T FAQ
1.How can I place an order for CY8C6245FNI-S3D71T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6245FNI-S3D71T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6245FNI-S3D71T reliable?
The price and inventory of CY8C6245FNI-S3D71T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245FNI-S3D71T is usually 5 days.
3.What payment methods are accepted for CY8C6245FNI-S3D71T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245FNI-S3D71T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6245FNI-S3D71T?
CY8C6245FNI-S3D71T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6245FNI-S3D71T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6245FNI-S3D71T?
For technical support, including CY8C6245FNI-S3D71T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245FNI-S3D71T requirements.
6.How does Aetrix verify that CY8C6245FNI-S3D71T is sourced from the original manufacturer or authorized distributors?
All CY8C6245FNI-S3D71T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245FNI-S3D71T meets industry standards.
7.What is the process for return or replacement of CY8C6245FNI-S3D71T?
All CY8C6245FNI-S3D71T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245FNI-S3D71T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6245FNI-S3D71T part is unused and in its original packaging.
Return procedure for CY8C6245FNI-S3D71T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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