Infineon Technologies CY8C6245LQI-S3D02
- Part No.:
- CY8C6245LQI-S3D02
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C6245LQI-S3D02.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 68QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,784
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Product details
Overview
CY8C6245LQI-S3D02 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 MCU with 512-KB flash, 256-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports XIP from external QSPI flash at up to 320 Mbps - deployed in battery-powered industrial IoT edge nodes requiring secure firmware updates and low-power sensor aggregation.
For engineers reviewing the CY8C6245LQI-S3D02 datasheet, CY8C6245LQI-S3D02 pinout, CY8C6245LQI-S3D02 application, or CY8C6245LQI-S3D02 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), on-chip DC-DC buck converter (<1 µA quiescent), CAN FD + USB coexistence, and hardware TRNG + Secure Boot for OTA update integrity.
Technical Context
The device integrates two independent CPU subsystems: a 150-MHz Cortex-M4F with FPU and MPU, and a 100-MHz Cortex-M0+ with MPU, both supporting dynamic voltage scaling between 1.1 V and 0.9 V. Inter-processor communication uses hardware IPC channels with doorbell interrupts and shared memory regions.
Its clock system combines an 8-MHz IMO (±2%), 32-kHz ILO, programmable PLL/FLL, and integer/fractional peripheral dividers - enabling precise timing control across TCPWMs, SCBs, and USB while maintaining sub-µA Deep Sleep operation with RTC backup domain active.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 512-KB flash (RWW), 256-KB SRAM (programmable retention), 1-Kb OTP eFuse for security keys |
| Low-Power Performance | 7 µA Deep Sleep with 64-KB SRAM retention; 22 µA/MHz M4 active current @ 0.9 V core |
| Connectivity | CAN FD block, USB Full-Speed device, 7 configurable SCBs (SPI/I2C/UART), SD Host/eMMC controller |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 LP comparators active in Deep Sleep, built-in temperature sensor |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES-256, ECC, SHA-256), TRNG, 8 protection contexts |
| Package | 100-pin TQFP (14 × 14 mm), 64 GPIOs, 2 Smart I/O ports, 2 overvoltage-tolerant pins |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 0.5-mm pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Bank 0 | Programmable drive modes, slew rates; supports CapSense™ self-capacitance sensing |
| P1[0]–P1[7] | GPIO Bank 1 | Smart I/O Boolean logic capability; retains function during Deep Sleep mode |
| VDDIO0, VDDIO1 | I/O Power Supply | Independent 1.7–3.6 V domains per bank; enables mixed-voltage interface design |
| VDDD | Digital Core Supply | Supplies CPU, memory, and digital peripherals; connects to on-chip DC-DC buck output |
| XRES | External Reset Input | Active-low asynchronous reset; internal pull-up; compatible with open-drain reset supervisors |
| SWDCK/SWDIO | Debug Interface | 2-pin SWD interface for programming and real-time debug; supports secure debug disable |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Voltage Scaling | User-selectable 1.1 V or 0.9 V core operation - reduces active current by >45% on M4 at 0.9 V vs. 1.1 V |
| QSPI SMIF with XIP | Execute-in-place from external flash at up to 320 Mbps with 4-KB cache and on-the-fly AES decryption |
| CapSense™ CSD | Capacitive sigma-delta sensing with hardware SmartSense tuning - achieves >100:1 SNR and liquid-tolerant touch |
| Deep Sleep SCB | One serial block remains functional in Deep Sleep - enables I2C/SPI wake-up without CPU intervention |
| On-Chip DC-DC | Integrated buck converter with <1 µA quiescent current - eliminates need for external PMIC in space-constrained designs |
Applications
| Industrial Sensor Node | Secure OTA Gateway |
|---|---|
|
Use Scenario: Battery-powered wireless vibration and temperature monitor in predictive maintenance systems. IC Role / Device Role / Timing Role: Dual-core coordination: M0+ handles CapSense™ and ADC sampling; M4 processes FFT and encrypts data before CAN FD transmission. Use Value: 7 µA Deep Sleep extends 2-AA battery life to >5 years; on-chip TRNG ensures unique session keys per firmware update. |
Use Scenario: Edge gateway aggregating BLE/Zigbee sensor data and forwarding via cellular to cloud. IC Role / Device Role / Timing Role: M4 runs TLS stack and USB CDC ACM for host diagnostics; M0+ manages CAN FD fieldbus polling with hardware timestamping. Use Value: Hardware crypto accelerator offloads 95% of AES-256 operations; Secure Boot prevents unsigned firmware execution. |
| Smart Building Controller | Medical Wearable Hub |
|
Use Scenario: HVAC zone controller with capacitive touch UI, LCD display, and environmental sensing. IC Role / Device Role / Timing Role: Segment LCD driver operates in Deep Sleep; Smart I/O implements debounced button logic without waking CPUs. Use Value: Integrated LCD driver eliminates external display controller; 64 GPIOs support multi-sensor expansion headers. |
Use Scenario: Clinical-grade wearable hub collecting ECG, SpO₂, and motion data for remote patient monitoring. IC Role / Device Role / Timing Role: SAR ADC samples analog front-end at 2 Msps with hardware averaging; temperature sensor calibrates gain drift in real time. Use Value: 12-bit ADC with differential input and sequencer reduces BOM cost vs. external precision ADC; medical-grade temp sensor traceable to NIST standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247LQI-D52 | Same package and core architecture; adds 1-MB flash and 384-KB SRAM; no CAN FD block | Better suited for local data logging or audio buffering; lacks fieldbus interface for industrial control | Select when extended memory is critical and CAN FD is unnecessary |
| STM32WB55RGV | Single Cortex-M4 core (64 MHz), integrated Bluetooth LE radio, no hardware crypto accelerator beyond AES-128 | Optimized for BLE endpoint devices; lacks dual-CPU isolation for RTOS + security partitioning | Select for Bluetooth-centric endpoints where dual-core separation is not required |
Compared with CY8C6245LQI-S3D02, CY8C6247LQI-D52 trades CAN FD for higher memory density, while STM32WB55RGV replaces dual-core deterministic partitioning with integrated BLE - making CY8C6245LQI-S3D02 uniquely suitable for secure, low-power industrial gateways requiring concurrent real-time control and encrypted communications.
Availability
CY8C6245LQI-S3D02 is available at Aetrix Electronics and suitable for industrial IoT sensor nodes, secure OTA gateways, smart building controllers, and medical wearable hubs requiring stable component supply and long-term lifecycle assurance.
Supply support for CY8C6245LQI-S3D02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with R&D centers across Europe, Asia, and the Americas.
This device belongs to the PSoC™ 62 product line - designed specifically for ultra-low-power, secure, and sensor-rich IoT endpoints that demand hardware-enforced trust boundaries and flexible analog/digital reconfigurability.
FAQ
Does CY8C6245LQI-S3D02 support JTAG debugging?
No - it uses Serial Wire Debug (SWD) only, with dedicated SWDCK and SWDIO pins. JTAG is not implemented; debug access requires CMSIS-DAP or Segger J-Link with SWD protocol support. The SWJ-DP interface supports full halt-mode debugging, memory inspection, and flash programming without requiring external debug probes with JTAG pins.
What is the maximum operating frequency of the CAN FD peripheral?
The CAN FD block supports bit rates up to 5 Mbps in fast-phase mode, with programmable timing registers compliant with ISO 11898-1:2015. It operates independently of CPU clocks and can run concurrently with USB Full-Speed and TCPWM timers without resource contention.
Can the on-chip DC-DC buck converter power external circuitry?
No - the integrated buck converter supplies only internal VDDD and VDDIO rails. Its output is not accessible externally; external loads must be powered from separate regulators. The converter's <1 µA quiescent current and high light-load efficiency are optimized solely for internal power domain regulation.
Is the 12-bit SAR ADC capable of simultaneous sampling across multiple channels?
No - it features a single ADC core with a 16-channel hardware sequencer and result averaging, but no true simultaneous sampling. Channel switching occurs in <1 µs, enabling pseudo-simultaneous acquisition for motor control or multi-sensor correlation when synchronized to TCPWM triggers.
CY8C6245LQI-S3D02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6245LQI-S3D02 FAQ
1.How can I place an order for CY8C6245LQI-S3D02 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6245LQI-S3D02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6245LQI-S3D02 reliable?
The price and inventory of CY8C6245LQI-S3D02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245LQI-S3D02 is usually 5 days.
3.What payment methods are accepted for CY8C6245LQI-S3D02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245LQI-S3D02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6245LQI-S3D02?
CY8C6245LQI-S3D02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6245LQI-S3D02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6245LQI-S3D02?
For technical support, including CY8C6245LQI-S3D02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245LQI-S3D02 requirements.
6.How does Aetrix verify that CY8C6245LQI-S3D02 is sourced from the original manufacturer or authorized distributors?
All CY8C6245LQI-S3D02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245LQI-S3D02 meets industry standards.
7.What is the process for return or replacement of CY8C6245LQI-S3D02?
All CY8C6245LQI-S3D02 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245LQI-S3D02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6245LQI-S3D02 part is unused and in its original packaging.
Return procedure for CY8C6245LQI-S3D02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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