Infineon Technologies CY8C6245LQI-S3D42
- Part No.:
- CY8C6245LQI-S3D42
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C6245LQI-S3D42.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 68QFN
- Quantity:
- Payment:

- Shipping:

Inventory:740
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Product details
Overview
CY8C6245LQI-S3D42 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 512-KB flash, 256-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration-designed for secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless connectivity.
For engineers reviewing the CY8C6245LQI-S3D42 datasheet, CY8C6245LQI-S3D42 pinout, CY8C6245LQI-S3D42 application, or CY8C6245LQI-S3D42 equivalent, key selection considerations include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), Deep Sleep current (7 µA w/ 64-KB SRAM retention), QSPI XIP with on-the-fly encryption, and CAN FD + USB coexistence in a single die.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles complex signal processing and security tasks while the Cortex-M0+ manages low-latency peripherals and power-state coordination via IPC and shared memory. Both cores operate at independent voltages (0.9 V or 1.1 V) with dedicated DMA controllers and flash caches.
Its programmable analog-digital fabric includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer, two Deep Sleep-capable comparators, CAPSENSE™ sigma-delta CSD with SmartSense auto-tuning, and a dedicated CAN FD controller compliant with ISO 11898-1:2015 supporting data rates up to 5 Mbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent voltage scaling (0.9 V / 1.1 V) |
| Memory | 512-KB flash (RWW), 256-KB SRAM (programmable retention), 1-Kb OTP eFuse for secure boot keys |
| Low-Power Performance | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz active current @ 0.9 V on M4 core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), two LP comparators active in Deep Sleep |
| Digital Interfaces | CAN FD (5 Mbps), USB Full-Speed device, 7 SCBs (SPI/I²C/UART), QSPI/SMIF with XIP + AES decryption, SDIO/eMMC host |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES-256, ECC, SHA-256, TRNG), 8 protection contexts |
| Capacitive Sensing | CAPSENSE™ CSD with >100 dB SNR, liquid-tolerant mutual/self-sensing, hardware SmartSense tuning |
Pinout & Package
This device is housed in a 100-pin TQFP package (14 mm × 14 mm, 0.5 mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and two Smart I/O ports (8 total pins) enabling Boolean logic during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Bank 0 | Programmable drive modes, slew rates; supports Smart I/O Boolean operations in Deep Sleep |
| P1[0]–P1[7] | GPIO Bank 1 | Includes two OVT pins (P1[0], P1[1]) tolerant to 5.5 V in 1.7–3.6 V operation |
| USB_DP / USB_DM | USB Full-Speed Interface | Dedicated differential pair compliant with USB 2.0 FS; requires external 1.5-kΩ pull-up on DP |
| CAN_TX / CAN_RX | CAN FD Physical Layer | Differential signaling pair supporting ISO 11898-1:2015; internal termination enabled via register |
| QSPI_SCK / QSPI_SS / QSPI_IO0–IO3 | Quad-SPI Memory Interface | Supports XIP from external flash with 4-KB cache and on-the-fly AES-128 decryption |
| VDDIO / VDDD / VCCD / VBACKUP | Power Domains | VDDIO (1.7–3.6 V I/O), VDDD (core @ 0.9/1.1 V), VBACKUP (RTC domain, 1.1–3.6 V) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | Independent 0.9 V / 1.1 V supply for M4/M0+ enables dynamic trade-off between performance (150 MHz) and ultra-low active current (22 µA/MHz) |
| Secure Boot & Runtime Protection | ROM-based root of trust validates firmware signature before execution; execute-only memory prevents code extraction |
| Deep Sleep Intelligence | 64-KB SRAM retention at 7 µA; Smart I/O and LP comparators remain functional without waking CPUs |
| Hardware Crypto Acceleration | Dedicated engine for AES-256, SHA-256, ECC-256, and TRNG-offloads CPU, reduces latency, and avoids software-side channel leakage |
| Integrated CAN FD + USB | Single-chip support for automotive-grade diagnostics (CAN FD) and PC/host connectivity (USB FS) without external bridges or protocol translation |
Applications
| Smart Home Hub | Industrial Sensor Node |
|---|---|
|
Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices while bridging to cloud via Wi-Fi/Ethernet. IC Role / Device Role / Timing Role: Dual-core orchestrator: M0+ handles radio stack timing and low-power scheduling; M4 runs TLS, OTA updates, and local decision logic. Use Value: 7 µA Deep Sleep extends battery life >5 years in coin-cell-powered hubs; QSPI XIP + AES enables secure firmware updates from encrypted external flash. |
Use Scenario: Wireless vibration/temperature node deployed in factory machinery with predictive maintenance telemetry. IC Role / Device Role / Timing Role: Real-time sensor fusion hub: SAR ADC samples multi-axis accelerometer + thermistor; TCPWM triggers synchronized sampling; CAN FD reports alerts to PLC. Use Value: 2-Msps ADC with 16-channel sequencer captures transient events; CAN FD 5 Mbps ensures deterministic alarm delivery amid high-noise EMI environments. |
| Medical Wearable | Automotive Body Control Module |
|
Use Scenario: ECG/PPG patch monitoring heart rate variability and motion artifacts with onboard analytics. IC Role / Device Role / Timing Role: CAPSENSE™ CSD acquires dry-electrode biopotentials; M4 runs adaptive noise cancellation; M0+ manages Bluetooth LE advertising intervals. Use Value: >100 dB SNR CSD rejects motion artifact; SmartSense auto-calibration eliminates manual tuning; 22 µA/MHz M4 extends 7-day runtime on 100-mAh battery. |
Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN/CAN communication. IC Role / Device Role / Timing Role: CAN FD master for body network diagnostics; GPIOs drive H-bridge drivers; PWMs control LED dimming profiles. Use Value: Integrated CAN FD meets OEM timing jitter <100 ns; hardware crypto secures firmware updates per UNECE R155; OVT pins interface directly with 12-V automotive signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP LPC55S69 | Single Cortex-M33 core (no M0+ companion); lacks CAN FD, has no integrated SMIF/QSPI XIP | Better for cost-sensitive consumer devices without automotive comms; weaker security isolation (no ROM boot) | Select when CAN FD and dual-core power partitioning are non-critical, and USB + crypto suffice |
| Renesas RA6M5 | Single Cortex-M33 core; includes CAN FD and USB, but no hardware CAPSENSE™ or Smart I/O | Stronger real-time determinism for motor control; weaker capacitive sensing and ultra-low-power peripheral autonomy | Prefer when deterministic interrupt latency <100 ns is required, and touch UI is handled externally |
Compared with LPC55S69 and RA6M5, CY8C6245LQI-S3D42 uniquely delivers concurrent ultra-low-power peripheral autonomy (Smart I/O, LP comparators), integrated CAN FD + USB, and production-ready CAPSENSE™-enabling single-die solutions for battery-powered, sensor-rich, and automotive-connected edge nodes.
Availability
CY8C6245LQI-S3D42 is available at Aetrix Electronics and suitable for smart home gateways, industrial predictive maintenance sensors, medical wearables, and automotive body electronics requiring stable component supply across multi-year production cycles.
Supply support for CY8C6245LQI-S3D42 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive ICs, and secure microcontrollers, with global manufacturing and automotive-grade quality certification (IATF 16949).
This part belongs to the PSOC™ 62 product line-designed specifically for secure, energy-efficient IoT endpoints that demand concurrent wireless connectivity, real-time control, and robust hardware-rooted security in constrained form factors.
FAQ
Does CY8C6245LQI-S3D42 support true hardware-based secure boot with immutable root of trust?
Yes. It features ROM-based Secure Boot that performs cryptographic verification of the first-stage bootloader using hardware-accelerated SHA-256 and ECC-256 before any user code executes. The ROM code is unmodifiable and provides an immutable root of trust, preventing unauthorized firmware injection at power-on.
What is the maximum achievable CAN FD data rate and physical layer compliance for this device?
The integrated CAN FD controller complies fully with ISO 11898-1:2015 and supports bit rates up to 5 Mbps in the data phase. It includes configurable bit timing, automatic retransmission, error confinement, and built-in loopback mode for validation-requiring only an external CAN transceiver for physical layer interfacing.
Can the SAR ADC operate independently during Deep Sleep mode without waking either CPU core?
No-the SAR ADC itself cannot run autonomously in Deep Sleep. However, the device supports ADC-triggered wakeup: a comparator or TCPWM event can initiate conversion upon exit from Deep Sleep, and the result is placed into SRAM before full CPU wake. For continuous low-power sensing, use the two LP comparators, which remain fully operational in Deep Sleep.
Is QSPI XIP supported with on-the-fly decryption, and what encryption standard is used?
Yes. The SMIF block enables Execute-In-Place from external quad SPI flash with hardware-accelerated AES-128 decryption applied transparently to every fetched instruction. Decryption occurs in-line with zero software overhead, and the 4-KB SMIF cache maintains performance while minimizing active flash access time and power.
CY8C6245LQI-S3D42 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6245LQI-S3D42 FAQ
1.How can I place an order for CY8C6245LQI-S3D42 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6245LQI-S3D42 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6245LQI-S3D42 reliable?
The price and inventory of CY8C6245LQI-S3D42 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245LQI-S3D42 is usually 5 days.
3.What payment methods are accepted for CY8C6245LQI-S3D42?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245LQI-S3D42 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6245LQI-S3D42?
CY8C6245LQI-S3D42 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6245LQI-S3D42 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6245LQI-S3D42?
For technical support, including CY8C6245LQI-S3D42 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245LQI-S3D42 requirements.
6.How does Aetrix verify that CY8C6245LQI-S3D42 is sourced from the original manufacturer or authorized distributors?
All CY8C6245LQI-S3D42 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245LQI-S3D42 meets industry standards.
7.What is the process for return or replacement of CY8C6245LQI-S3D42?
All CY8C6245LQI-S3D42 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245LQI-S3D42, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6245LQI-S3D42 part is unused and in its original packaging.
Return procedure for CY8C6245LQI-S3D42:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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