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Infineon Technologies CY8C6245LQI-S3D62

Part No.:
CY8C6245LQI-S3D62
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C6245LQI-S3D62.pdf
Description:
IC MCU 32BIT 512KB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,998

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Product details

Overview

CY8C6245LQI-S3D62 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 512-KB flash, 256-KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography accelerator-designed for secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless protocol stack execution.

For engineers reviewing the CY8C6245LQI-S3D62 datasheet, CY8C6245LQI-S3D62 pinout, CY8C6245LQI-S3D62 application, or CY8C6245LQI-S3D62 equivalent, this MCU delivers verified low-power operation (7 µA Deep Sleep with 64-KB SRAM retention), on-chip DC-DC buck converter (<1 µA quiescent), and programmable analog/digital subsystems enabling rapid sensor fusion and human interface development.

Technical Context

The device implements a tightly coupled dual-CPU architecture: the 150-MHz Cortex-M4F handles complex firmware tasks (e.g., protocol stacks, signal processing) while the 100-MHz Cortex-M0+ manages real-time peripherals and low-power state coordination. Inter-processor communication (IPC) and shared memory enable deterministic task partitioning without bus contention.

Its programmable analog subsystem includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and hardware averaging, two deep-sleep-capable comparators, and an integrated temperature sensor-all routed through a unified I/O matrix supporting overvoltage-tolerant (OVT) pins and Smart I/O Boolean logic during system Deep Sleep.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory 512-KB application flash (RWW), 256-KB SRAM with programmable retention granularity, 1-Kb OTP eFuse
Low-Power Performance 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz M4 @ 0.9 V core voltage
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer, hardware averaging), 2x LP comparators active in Deep Sleep
Communication 7 configurable SCBs (SPI/I²C/UART), 1 Deep Sleep SCB, USB Full-Speed device, CAN FD block, QSPI/SMIF with XIP & encryption
Security ROM-based Secure Boot, hardware crypto accelerator (AES/SHA/RSA/ECDSA), TRNG, 8 protection contexts
Capacitive Sensing CAPSENSE™ CSD subsystem with SmartSense auto-tuning, liquid tolerance, and self/mutual sensing support

Pinout & Package

This device is packaged in a 100-pin TQFP (14 mm × 14 mm, 0.5-mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins and eight Smart I/O pins supporting Boolean operations in Deep Sleep.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO / Smart I/O Port 0 Supports Boolean logic (AND/OR/XOR) in Deep Sleep; configurable drive strength/slew rate
P1[0]–P1[7] GPIO / Smart I/O Port 1 Same Smart I/O capability as Port 0; enables wake-on-event from ultra-low-power state
VBAT Backup Domain Supply Powers RTC and 64-byte backup RAM during main power loss; supports coin-cell backup
VDDIO0–VDDIO3 I/O Power Domains Independent 1.7–3.6-V supplies per port group; enables mixed-voltage interfacing
SWDCLK / SWDIO JTAG/SWD Debug Interface 2-pin Serial Wire Debug; supports secure debug disable via eFuse lock
USB_DP / USB_DM USB Full-Speed PHY Differential pair compliant with USB 2.0 FS signaling; internal termination enabled
CAN_TX / CAN_RX CAN FD Transceiver Interface Direct connection to external CAN transceiver; supports ISO 11898-1 up to 5 Mbps

Key Features

Feature Design Value
Dual-Voltage Core Operation User-selectable 1.1 V or 0.9 V CPU supply enables dynamic trade-off between performance (150 MHz) and ultra-low active current (22 µA/MHz)
On-Chip DC-DC Buck Converter Integrated regulator with <1 µA quiescent current reduces external BOM count and improves battery life in portable IoT nodes
Execute-In-Place (XIP) from QSPI Enables direct code execution from external flash using 4-KB cache, eliminating SRAM footprint for firmware storage
Hardware-Accelerated CAPSENSE™ Dedicated CSD block delivers >100 dB SNR, supports proximity detection through glass/plastic, and auto-calibrates via SmartSense
Deep Sleep SCB One serial block remains operational in Deep Sleep mode, enabling I²C/SPI slave wake-up without CPU intervention

Applications

Smart Home Hub Industrial Sensor Node

Use Scenario: Central gateway aggregating BLE/Zigbee sub-devices while running local decision logic and OTA updates.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles radio MAC timing and interrupt-driven I/O; M4 runs protocol stacks and TLS encryption.

Use Value: 7 µA Deep Sleep with 64-KB retained SRAM allows fast wake-to-network-resume (<100 µs), minimizing latency in mesh rejoin sequences.

Use Scenario: Battery-powered vibration/temperature node deployed in predictive maintenance systems with 10-year field life.

IC Role / Device Role / Timing Role: SAR ADC samples accelerometer and thermistor at 1-kSPS; M0+ triggers wake-on-threshold via comparator; M4 processes FFT and compresses data.

Use Value: On-chip DC-DC buck and 22 µA/MHz M4 efficiency extend battery life by >3× versus discrete PMIC + MCU solutions.

Medical Wearable Automotive Body Control Module

Use Scenario: ECG patch with capacitive touch UI, motion sensing, and Bluetooth LE telemetry.

IC Role / Device Role / Timing Role: CAPSENSE™ CSD drives dry-electrode touch interface; ADC digitizes analog front-end; crypto engine signs biosensor data.

Use Value: Smart I/O ports perform button debouncing and LED PWM in Deep Sleep, reducing average system power to <15 µA.

Use Scenario: Door module managing window lift, mirror fold, and interior lighting with LIN/CAN FD communication.

IC Role / Device Role / Timing Role: CAN FD block handles high-speed body bus messaging; TCPWMs generate precise motor control waveforms; OVT pins interface with 12-V switches.

Use Value: 64 GPIOs with per-port VDDIO domains allow direct 5-V/12-V peripheral interfacing without level shifters, simplifying PCB layout.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RGV Single-core Cortex-M4 + dedicated Cortex-M0+ radio coprocessor; no integrated CAN FD; 256-KB flash Lacks native CAN FD and hardware CAPSENSE™; optimized for Bluetooth LE + Zigbee coexistence, not automotive or industrial CAN networks Select when BLE/Zigbee radio integration outweighs need for CAN FD or analog subsystem depth
NXP KW45B41Z ARM Cortex-M0+ only; 512-KB flash but no M4 core; integrated 2.4-GHz radio; no CAN FD or USB Targeted at simple wireless sensor endpoints-not suitable for compute-intensive edge AI or multi-protocol gateways Choose for cost-sensitive, radio-centric designs where dual-core processing and peripheral richness are unnecessary

Compared with STM32WB55RGV and KW45B41Z, CY8C6245LQI-S3D62 uniquely combines CAN FD, USB FS, hardware crypto, and programmable analog/digital fabric in a single die-enabling consolidated BOMs for complex IoT edge controllers without external ASICs or PMICs.

Availability

CY8C6245LQI-S3D62 is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, medical wearables, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and qualified traceable sourcing.

Supply support for CY8C6245LQI-S3D62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and embedded controllers-with global manufacturing, qualification, and automotive-grade reliability certification.

This part belongs to the PSoC™ 62 product line, engineered specifically for secure, ultra-low-power IoT endpoints that demand concurrent real-time responsiveness, wireless connectivity, and hardware-enforced trust anchors.

FAQ

What is the maximum operating frequency of each CPU core in CY8C6245LQI-S3D62?

The Cortex-M4F core operates up to 150 MHz with single-cycle multiply and floating-point unit; the Cortex-M0+ core runs at up to 100 MHz with single-cycle multiply. Both include memory protection units (MPUs) and support independent voltage scaling (0.9 V or 1.1 V) to optimize performance versus active current draw.

Does CY8C6245LQI-S3D62 support hardware encryption acceleration?

Yes-it integrates a dedicated cryptography accelerator supporting AES-128/256, SHA-1/224/256, RSA up to 4096-bit, ECC NIST P-256/P-384, and true random number generation (TRNG). All cryptographic operations execute in protected memory space with execute-only permissions enforced by hardware.

Can the SAR ADC operate during Deep Sleep mode?

No-the 12-bit SAR ADC requires active CPU clocking and cannot sample in Deep Sleep. However, two low-power comparators remain fully functional in Deep Sleep and can trigger wake events or drive Smart I/O logic without CPU involvement.

What package type and pin count does CY8C6245LQI-S3D62 use?

CY8C6245LQI-S3D62 uses a 100-pin TQFP package (14 mm × 14 mm, 0.5-mm pitch) with 64 GPIOs, including two overvoltage-tolerant (OVT) pins, eight Smart I/O pins, and dedicated USB/CAN FD/SMIF interface signals mapped to fixed ballouts per the datasheet pinout diagram.

CY8C6245LQI-S3D62 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Number of I/O:
53
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6245LQI-S3D62 FAQ

1.How can I place an order for CY8C6245LQI-S3D62 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6245LQI-S3D62 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6245LQI-S3D62 reliable?

The price and inventory of CY8C6245LQI-S3D62 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6245LQI-S3D62 is usually 5 days.

3.What payment methods are accepted for CY8C6245LQI-S3D62?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6245LQI-S3D62 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6245LQI-S3D62?

CY8C6245LQI-S3D62 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6245LQI-S3D62 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6245LQI-S3D62?

For technical support, including CY8C6245LQI-S3D62 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6245LQI-S3D62 requirements.

6.How does Aetrix verify that CY8C6245LQI-S3D62 is sourced from the original manufacturer or authorized distributors?

All CY8C6245LQI-S3D62 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6245LQI-S3D62 meets industry standards.

7.What is the process for return or replacement of CY8C6245LQI-S3D62?

All CY8C6245LQI-S3D62 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6245LQI-S3D62, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6245LQI-S3D62 part is unused and in its original packaging.

Return procedure for CY8C6245LQI-S3D62:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6245LQI-S3D62 Tags

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