Infineon Technologies CY8C6246BZI-D04
- Part No.:
- CY8C6246BZI-D04
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6246BZI-D04.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 124BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C6246BZI-D04 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 62 microcontroller with 1-MB flash, 288-KB SRAM, integrated SIMO DC-DC converter, CAPSENSE™, and hardware crypto accelerator. It operates from 1.7 V to 3.6 V, supports Deep Sleep at 7 µA with 64-KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless connectivity.
For engineers reviewing the CY8C6246BZI-D04 datasheet, CY8C6246BZI-D04 pinout, CY8C6246BZI-D04 application, or CY8C6246BZI-D04 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), QSPI XIP with on-the-fly encryption, 32 TCPWM blocks for motor timing, and UDB-based programmable logic for protocol offload in resource-constrained embedded systems.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles compute-intensive tasks (e.g., sensor fusion, crypto) while the Cortex-M0+ manages low-latency I/O and peripheral orchestration via IPC and shared memory. Both cores operate at independent voltages (0.9 V or 1.1 V) with dedicated 8-KB flash caches and DMA controllers.
Its programmable analog/digital architecture integrates a 12-bit 1-Msps SAR ADC with 16-channel sequencer, two opamps, two low-power comparators active in Deep Sleep, twelve UDBs for Verilog or drag-and-drop logic, and Smart I/O for Boolean operations during system sleep-enabling hardware-accelerated signal conditioning and protocol bridging without CPU wake-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with retention control |
| Power Efficiency | Deep Sleep current = 7 µA with 64-KB SRAM retention; M4 active slope = 22 µA/MHz @ 0.9 V |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), 2 opamps, 2 Deep Sleep comparators, 12-bit DAC (<2 µs settling) |
| Digital Peripherals | 32 TCPWM blocks, 9 SCBs (8 configurable as SPI/I2C/UART, 1 Deep Sleep SCB), USB FS, QSPI/SMIF with XIP & encryption |
| Security | ROM-based Secure Boot, 8 Protection Contexts, hardware crypto accelerator (AES/RSA/ECC/SHA/TRNG) |
| Package | 124-ball BGA (9 mm × 9 mm × 1 mm, 0.8-mm pitch) |
Pinout & Package
CY8C6246BZI-D04 is housed in a 124-ball BGA package (9 mm × 9 mm × 1 mm, 0.8-mm pitch) with exposed thermal pad. Pin functions are defined per the Infineon CY8C62x6 pinout diagram (Rev. *Q, pages 31–36), supporting dual-voltage I/O banks (1.7–3.6 V), six overvoltage-tolerant pins, and dedicated debug/SWJ interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply Banks | Independent 1.7–3.6 V supplies per bank; enable mixed-voltage interfacing with external sensors/peripherals |
| VDDD / VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V domains; decoupling required per datasheet layout guidelines to maintain ADC SNR & clock stability |
| XRES | Active-Low Reset Input | Asynchronous reset with internal pull-up; asserts full chip reset including both CPUs, memories, and peripherals |
| SWDIO / SWCLK | Debug Interface Signals | Two-pin SWJ interface for programming, debugging, and boundary scan; supports secure debug disable via Protection Contexts |
| QSPI0_D0–QSPI0_D3 | Quad SPI Data Lines | Support XIP from external flash; enable 640 Mbps octal interface mode with on-the-fly AES decryption of fetched instructions |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | Runtime-selectable 0.9 V or 1.1 V core voltage per CPU-reduces active power by up to 45% vs. fixed 1.1 V operation |
| Smart I/O Boolean Logic | 16 GPIOs grouped into two Smart I/O ports; execute AND/OR/XOR on pin states during Deep Sleep without waking CPUs |
| CAPSENSE™ with SmartSense | Hardware-accelerated self/mutual capacitive sensing with auto-tuning-enables robust touch buttons/sliders under water or glove use |
| UDB Programmable Logic | Twelve universal digital blocks (8 macrocells each); implement custom protocols (LIN, S/PDIF) or waveform generators without firmware overhead |
| On-chip SIMO DC-DC | Single-inductor, multi-output buck converter with <1 µA quiescent current-eliminates external PMIC in battery-powered designs |
Applications
| Smart Home Sensor Hub | Industrial Predictive Maintenance Node |
|---|---|
Use Scenario: Battery-powered hub aggregating temperature, humidity, vibration, and gas data from multiple sensors before BLE/Wi-Fi transmission. IC Role / Device Role / Timing Role: Dual-core coordinator: M0+ handles CAPSENSE™ button input and sensor polling; M4 runs FFT-based vibration analysis and AES-128 encryption. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends 2-AA battery life beyond 5 years; on-chip SIMO DC-DC eliminates discrete PMIC area and BOM cost. | Use Scenario: Edge node mounted on rotating machinery, sampling accelerometer data at 10 kHz and triggering local alarm on threshold breach. IC Role / Device Role / Timing Role: Real-time controller: TCPWM blocks generate precise PWM for actuator feedback; low-power comparators detect analog threshold crossings in Deep Sleep. Use Value: Comparator-triggered Kill signals halt PWM within 100 ns-prevents mechanical damage; 32-KB SFlash stores field-upgradable safety firmware. |
| Medical Wearable Patch | Secure Asset Tracker |
Use Scenario: Disposable ECG patch with dry electrodes, Bluetooth LE telemetry, and onboard arrhythmia detection. IC Role / Device Role / Timing Role: Signal processor: SAR ADC oversamples at 1 Msps; M4 executes QRS detection algorithm; CAPSENSE™ detects electrode contact quality. Use Value: 12-bit ADC with result averaging achieves >70 dB SNR for clinical-grade waveform fidelity; OTP eFuse stores unique device identity for HIPAA-compliant pairing. | Use Scenario: GPS-enabled logistics tracker powered by solar cell + supercapacitor, reporting location only on motion or geofence breach. IC Role / Device Role / Timing Role: Low-power orchestrator: Smart I/O monitors accelerometer interrupt; M0+ wakes M4 only for GNSS fix and encrypted LTE-M upload. Use Value: Dual-core voltage scaling reduces average current to 3.2 µA in motion-detect mode; hardware TRNG seeds TLS handshake for zero-touch cloud onboarding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core, secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55RGV6 | Single Cortex-M4 core + dedicated Cortex-M0+ radio controller; no UDBs or Smart I/O; BLE 5.0 radio integrated | Built-in BLE stack reduces host MCU firmware complexity but lacks programmable analog/digital logic for sensor preprocessing | Choose when wireless SoC integration outweighs need for hardware-accelerated signal conditioning or custom protocol offload |
| nRF52840 DK | 64-MHz Cortex-M4F only; no second CPU; 1-MB flash but only 256-KB RAM; no on-chip DC-DC or CAPSENSE™ | BLE-focused; requires external ADC/opamp for analog sensing; lacks hardware crypto acceleration for asymmetric algorithms | Prefer for pure wireless edge nodes where RF performance and Nordic SDK ecosystem are primary drivers |
Compared with STM32WB55RGV6 and nRF52840 DK, CY8C6246BZI-D04 uniquely combines dual-voltage dual-core processing, programmable analog/digital fabric, and on-chip SIMO DC-DC-enabling lower system-level power, reduced BOM count, and hardware-defined signal paths in mixed-signal IoT endpoints.
Availability
CY8C6246BZI-D04 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, medical wearable patches, and secure asset trackers requiring stable component supply across multi-year production cycles.
Supply support for CY8C6246BZI-D04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security solutions, with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.
CY8C6246BZI-D04 belongs to the PSoC™ 62 product line-designed specifically for secure, ultra-low-power IoT endpoints that demand concurrent real-time control, sensor fusion, and wireless connectivity without external PMICs or programmable logic ICs.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6246BZI-D04?
The Cortex-M4F core operates at up to 150 MHz, confirmed in the Infineon datasheet (Rev. *Q, Section 3.1.1). This frequency is achievable when the core voltage is set to 1.1 V and the PLL is configured to multiply the IMO or crystal oscillator source. At 0.9 V, the maximum frequency is reduced to maintain timing closure and power efficiency.
Does CY8C6246BZI-D04 support Execute-In-Place (XIP) from external flash?
Yes, it supports XIP via the QSPI/SMIF interface with hardware-accelerated on-the-fly AES-128 decryption. The 4-KB SMIF cache improves instruction fetch efficiency, and the interface supports single/dual/quad/dual-quad/octal modes-achieving up to 640 Mbps throughput when using octal DDR signaling.
How many GPIOs are available, and what drive capabilities do they offer?
CY8C6246BZI-D04 provides up to 100 programmable GPIOs, with 16 assigned to two Smart I/O ports. Each pin supports multiple drive modes (OD, PP, Hi-Z, resistive pull-up/down), configurable slew rate and output strength, and six pins are overvoltage-tolerant up to 5.5 V-enabling direct interfacing with legacy 5-V peripherals.
Is the CAPSENSE™ subsystem capable of liquid-tolerant operation?
Yes, CAPSENSE™ supports liquid-tolerant operation through mutual capacitance sensing and automatic hardware tuning (SmartSense). The subsystem dynamically adjusts scan parameters to reject false touches caused by water films, enabling reliable touch control on devices exposed to splashes or condensation-validated per Infineon's CAPSENSE™ design guidelines.
CY8C6246BZI-D04 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6246BZI-D04 FAQ
1.How can I place an order for CY8C6246BZI-D04 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6246BZI-D04 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6246BZI-D04 reliable?
The price and inventory of CY8C6246BZI-D04 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6246BZI-D04 is usually 5 days.
3.What payment methods are accepted for CY8C6246BZI-D04?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6246BZI-D04 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6246BZI-D04?
CY8C6246BZI-D04 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6246BZI-D04 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6246BZI-D04?
For technical support, including CY8C6246BZI-D04 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6246BZI-D04 requirements.
6.How does Aetrix verify that CY8C6246BZI-D04 is sourced from the original manufacturer or authorized distributors?
All CY8C6246BZI-D04 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6246BZI-D04 meets industry standards.
7.What is the process for return or replacement of CY8C6246BZI-D04?
All CY8C6246BZI-D04 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6246BZI-D04, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6246BZI-D04 part is unused and in its original packaging.
Return procedure for CY8C6246BZI-D04:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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