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Infineon Technologies CY8C6247BZI-D34

Part No.:
CY8C6247BZI-D34
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
124-VFBGA
Datasheet:
AetrixCY8C6247BZI-D34.pdf
Description:
IC MCU 32BIT 1MB FLASH 124BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:430

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Product details

Overview

CY8C6247BZI-D34 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 62 microcontroller with 1-MB flash, 288-KB SRAM, integrated SMIF QSPI interface, CAPSENSE™ capacitive sensing, and hardware cryptography accelerator. It operates from 1.7 V to 3.6 V, supports Deep Sleep mode at 7 µA with 64-KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes.

For engineers reviewing the CY8C6247BZI-D34 datasheet, CY8C6247BZI-D34 pinout, CY8C6247BZI-D34 application, or CY8C6247BZI-D34 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip SIMO DC-DC converter (<1 µA quiescent), 32 TCPWM blocks, 9 configurable SCBs, and UDB-based programmable logic for protocol offload.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages low-power peripheral orchestration and sensor aggregation. Inter-processor communication (IPC) and shared memory enable deterministic task partitioning without bus contention.

Its programmable analog subsystem integrates a 12-bit 1-Msps SAR ADC with 16-channel sequencer and averaging, two low-power comparators active in Deep Sleep, and a 12-bit DAC with <2-µs settling time-enabling closed-loop control and sensor conditioning without external components.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory1-MB flash (RWW), 288-KB SRAM with retention control, 1-Kb OTP eFuse
Power EfficiencyDeep Sleep current = 7 µA with 64-KB SRAM retention; SIMO DC-DC quiescent current <1 µA
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer, averaging), 2× low-power comparators, 12-bit DAC (<2-µs settling)
Digital Peripherals32× TCPWM, 9× SCBs (SPI/I2C/UART), USB FS, QSPI/SMIF with XIP & on-the-fly encryption, 12× UDBs
SecurityROM-based Secure Boot, 8 Protection Contexts, hardware crypto accelerator (AES/RSA/ECC/SHA/TRNG)
Capacitive SensingCAPSENSE™ with SmartSense auto-tuning, liquid tolerance, and mutual/self-sensing support

Pinout & Package

Package: 124-ball BGA (9 mm × 9 mm × 1 mm, 0.8-mm pitch). Pinout validated per Infineon datasheet Rev. *Q (2023-12-13), Table 4 "Pin Assignments" and Figure 4-1 "CY8C62x6/62x7 124-BGA Pinout".

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO5I/O Power SupplyIndependent 1.7–3.6-V domains per port group; enables mixed-voltage interfacing and selective power gating
VDDDDigital Core SupplySupplies CPU, memory, and digital logic; supports dynamic voltage scaling between 0.9 V and 1.1 V
VDDAAnalog SupplySeparate 1.7–3.6-V rail for ADC, DAC, opamps, and comparators; reduces digital noise coupling
XRESExternal Reset InputActive-low asynchronous reset with internal pull-up; meets 50-ns minimum pulse width requirement
SWDCK/SWDIODebug Interface2-pin Serial Wire Debug interface supporting programming, trace, and real-time register access
QSPI0_[0:3]Quad SPI Data LinesDirect connection to external flash for Execute-In-Place; supports octal mode up to 640 Mbps

Key Features

FeatureDesign Value
Dual-Voltage Core OperationUser-selectable 0.9 V or 1.1 V core supply enables optimization of performance vs. active current (M4: 22 vs. 40 µA/MHz)
On-Chip SIMO DC-DC ConverterSingle-inductor, multi-output buck regulator eliminates need for external PMIC; maintains <1 µA quiescent current in Deep Sleep
Programmable UDB Logic12 universal digital blocks (8 macrocells + 8-bit datapath each) implement custom protocols (LIN, S/PDIF) or waveform generators without CPU overhead
CAPSENSE™ SmartSenseHardware-accelerated auto-tuning adjusts sensor parameters in real time for stable operation across temperature, humidity, and cover lens thickness variations
Secure Boot & Protection ContextsROM-resident boot loader validates signed firmware images; eight hardware-enforced protection contexts isolate privileged code and data memory regions

Applications

Smart Home Sensor HubIndustrial Predictive Maintenance Node

Use Scenario: Multi-sensor aggregation (temp, humidity, vibration, proximity) with local AI inference and BLE/Wi-Fi uplink.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles CAPSENSE™ touch, ADC sampling, and BLE stack; M4 runs TinyML model and SMIF-encrypted firmware updates.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life >5 years on coin cell; on-chip crypto enables secure OTA updates without external secure element.

Use Scenario: Vibration and thermal monitoring on rotating machinery with edge FFT analysis and anomaly detection.

IC Role / Device Role / Timing Role: M4 executes real-time FFT and threshold comparison on 1-Msps ADC data; M0+ manages TCPWM-driven LED status indicators and watchdog supervision.

Use Value: Integrated 12-bit SAR ADC with 16-channel sequencer and hardware averaging eliminates external signal chain; 32 TCPWM blocks support precise PWM-controlled actuator feedback.

Wearable Health MonitorSecure Access Control Terminal

Use Scenario: Optical PPG and bioimpedance sensing with motion artifact cancellation and encrypted health data storage.

IC Role / Device Role / Timing Role: PDM audio subsystem captures raw sensor data; M4 performs adaptive filtering and HRV analysis; CAPSENSE™ enables touchless wake-on-approach.

Use Value: Two PDM channels + I2S/TDM support enable synchronized multi-sensor capture; low-power comparators remain active in Deep Sleep to trigger wake on physiological event.

Use Scenario: Fingerprint + PIN authentication terminal with tamper detection, secure credential storage, and contactless card emulation.

IC Role / Device Role / Timing Role: Hardware crypto accelerator performs AES-256 encryption and ECDSA signing; Protection Contexts isolate biometric template storage from application code.

Use Value: ROM-based Secure Boot prevents unauthorized firmware execution; 1-Kb OTP eFuse stores immutable root keys; TRNG feeds cryptographic operations with entropy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RP2040No hardware crypto accelerator, no CAPSENSE™, no analog peripherals beyond basic ADC/DAC, no Deep Sleep retention below 100 µASuitable for cost-sensitive, non-secure, non-analog-intensive applications like simple HID devicesSelect only if security, analog integration, and sub-10-µA sleep are not required
STM32WB55Single Cortex-M4 core, no M0+ companion; integrated BLE radio but no SMIF/XIP; no UDB programmable logic or CAPSENSE™Better fit for BLE-centric applications requiring RF coexistence and minimal external componentsPrefer when wireless connectivity dominates over programmable analog/digital flexibility and ultra-low-power retention

Compared with RP2040 and STM32WB55, CY8C6247BZI-D34 uniquely combines dual-core deterministic partitioning, hardware-accelerated security, CAPSENSE™, and sub-10-µA Deep Sleep with SRAM retention-making it optimal for resource-constrained, sensor-rich, and security-critical IoT endpoints.

Availability

CY8C6247BZI-D34 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, wearable health monitors, and secure access control terminals requiring stable component supply and long-term lifecycle support.

Supply support for CY8C6247BZI-D34 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and R&D infrastructure.

The PSoC™ 62 product line delivers programmable, secure, ultra-low-power MCUs purpose-built for intelligent edge devices in IoT, industrial, and consumer applications-integrating analog, digital, and security resources in a single chip.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6247BZI-D34?

The Cortex-M4F core operates at up to 150 MHz, confirmed in the "CPU and Memory Subsystem" section of the official Infineon datasheet Rev. *Q. This frequency is achievable under 1.1-V core supply and ambient temperatures ≤85°C. At 0.9-V core voltage, maximum frequency is reduced to maintain timing closure and power efficiency.

Does CY8C6247BZI-D34 support Execute-In-Place (XIP) from external flash?

Yes, the integrated Serial Memory Interface (SMIF) supports XIP from external quad SPI flash with hardware acceleration, 4-KB cache, and on-the-fly AES-128 decryption. This capability is explicitly documented in Section 3.6.4 of the datasheet and requires proper configuration of SMIF registers and flash memory mapping in the linker script.

How many GPIO pins support overvoltage tolerance (OVT)?

Six GPIO pins are designated as overvoltage-tolerant (OVT), capable of withstanding up to 5.5 V regardless of VDDIO level. These pins are identified in the "Pin Assignments" table (Section 4) of the datasheet as P0[0], P0[1], P12[0], P12[1], P13[0], and P13[1], and are intended for interfacing with legacy 5-V logic or sensors.

Can the CAPSENSE™ subsystem operate during Deep Sleep mode?

Yes, CAPSENSE™ can operate in Deep Sleep mode using the low-power scanning engine and dedicated clock source. The datasheet confirms that self-capacitance scanning remains functional with typical current consumption of ~10 µA per scan, enabling wake-on-touch while maintaining system-level Deep Sleep current at 7 µA with 64-KB SRAM retention.

CY8C6247BZI-D34 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
124-VFBGA
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6247BZI-D34 FAQ

1.How can I place an order for CY8C6247BZI-D34 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6247BZI-D34 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6247BZI-D34 reliable?

The price and inventory of CY8C6247BZI-D34 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6247BZI-D34 is usually 5 days.

3.What payment methods are accepted for CY8C6247BZI-D34?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6247BZI-D34 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6247BZI-D34?

CY8C6247BZI-D34 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6247BZI-D34 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6247BZI-D34?

For technical support, including CY8C6247BZI-D34 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6247BZI-D34 requirements.

6.How does Aetrix verify that CY8C6247BZI-D34 is sourced from the original manufacturer or authorized distributors?

All CY8C6247BZI-D34 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6247BZI-D34 meets industry standards.

7.What is the process for return or replacement of CY8C6247BZI-D34?

All CY8C6247BZI-D34 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6247BZI-D34, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6247BZI-D34 part is unused and in its original packaging.

Return procedure for CY8C6247BZI-D34:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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