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Infineon Technologies CY8C6247BZI-D54

Part No.:
CY8C6247BZI-D54
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
124-VFBGA
Datasheet:
AetrixCY8C6247BZI-D54.pdf
Description:
IC MCU 32BIT 1MB FLASH 124BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,271

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Product details

Overview

CY8C6247BZI-D54 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 62 microcontroller with 1-MB flash, 288-KB SRAM, integrated SMIF QSPI interface, CAPSENSE™ capacitive sensing, and hardware cryptography accelerator. It operates from 1.7 V to 3.6 V, supports Deep Sleep mode at 7 µA with 64-KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and sensor processing.

For engineers reviewing the CY8C6247BZI-D54 datasheet, CY8C6247BZI-D54 pinout, CY8C6247BZI-D54 application, or CY8C6247BZI-D54 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip SIMO DC-DC converter (<1 µA quiescent), 32 TCPWM blocks, 9 configurable SCBs, and 12-bit 1-Msps SAR ADC with 16-channel sequencer.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles compute-intensive tasks (e.g., signal processing, crypto) while the Cortex-M0+ manages low-latency peripherals and system control-interconnected via IPC and shared memory. Both cores operate at independent voltages (0.9 V or 1.1 V) and support asymmetric power gating.

Its programmable analog subsystem integrates a 12-bit SAR ADC with differential input, on-die temperature sensor, two low-power comparators active in Deep Sleep, and two opamps with CTBm configuration. The digital fabric includes twelve UDBs for Verilog or drag-and-drop peripheral implementation, plus Smart I/O for Boolean logic during Deep Sleep.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse
Power Efficiency7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz M4 @ 0.9 V core
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer), two opamps, two Deep Sleep comparators, temp sensor
Digital Interfaces9 SCBs (SPI/I2C/UART), USB FS device, QSPI/SMIF with XIP & 4-KB cache, 32 TCPWM blocks
SecurityROM-based Secure Boot, crypto accelerator (AES/SHA/RSA/ECDSA), TRNG, 8 Protection Contexts
Capacitive SensingCAPSENSE™ with SmartSense auto-tuning, liquid tolerance, self/mutual sensing support

Pinout & Package

Package: 124-ball BGA (9 mm × 9 mm × 1 mm, 0.8-mm pitch). Pinout validated per Infineon datasheet Rev. *Q (2023-12-13), Table 4 "Pinouts" and Figure 4-1 "CY8C6247BZI-D54 Pinout (Top View)".

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]GPIO / Smart I/OProgrammable drive modes; Boolean logic execution possible in Deep Sleep
P12[0]–P12[7]GPIO / Analog InputSupports SAR ADC channel inputs and CAPSENSE™ sense lines
XTAL_IN / XTAL_OUTCrystal Oscillator InterfaceDrives external 32-kHz or 16–35-MHz crystal; enables FLL/PLL clock generation
VDDIO0 / VDDIO1I/O Power SupplyIndependent 1.7–3.6-V domains per port group; supports mixed-voltage interfacing
VDDD / VDDADigital/Analog Core SupplySeparate 1.7–3.6-V supplies; VDDA powers ADC, DAC, opamps, comparators
SWDCK / SWDIODebug Interface2-pin SWD for programming and debug; disableable for security lockdown

Key Features

FeatureDesign Value
Dual-Voltage CPU OperationCore voltage selectable between 0.9 V (ultra-low-power) and 1.1 V (performance); enables dynamic trade-off between latency and energy
On-Chip SIMO DC-DC ConverterSingle-inductor, multi-output buck regulator with <1 µA quiescent current; eliminates need for external PMIC in battery-powered designs
Execute-In-Place (XIP) over QSPIDirect code execution from external quad-SPI flash with on-the-fly AES decryption and 4-KB cache; reduces SRAM footprint by >40% in firmware-updatable systems
CAPSENSE™ SmartSenseHardware-accelerated auto-tuning of sensor parameters (IDAC, scan speed, resolution); achieves >100:1 SNR without host CPU intervention
UDB-Based Peripheral OffloadTwelve universal digital blocks implement protocol stacks (e.g., LIN, S/PDIF) or waveform generators in hardware; frees both CPUs from bit-banging overhead

Applications

Smart Home Sensor HubWearable Health Monitor

Use Scenario: Central node aggregating data from multiple environmental and motion sensors, performing local anomaly detection before cloud upload.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles CAPSENSE™ button scanning and BLE event scheduling; M4 runs ML inference on ADC/PDM streams.

Use Value: 7 µA Deep Sleep with 64-KB retained SRAM enables >1-year coin-cell operation; on-chip crypto ensures OTA update authenticity.

Use Scenario: Continuous ECG and SpO₂ monitoring with adaptive sampling and motion artifact rejection.

IC Role / Device Role / Timing Role: SAR ADC digitizes analog front-end at 1 Msps; PDM channels capture microphone audio for voice command wake-up; TCPWM generates precise LED drive timing for optical sensing.

Use Value: Integrated opamps and comparators condition analog signals in hardware; 12-bit DAC calibrates reference voltages without external components.

Industrial Wireless NodeSecure Access Control Terminal

Use Scenario: Battery-powered vibration and temperature monitor in predictive maintenance systems, transmitting alerts via LoRaWAN.

IC Role / Device Role / Timing Role: M0+ manages LoRa transceiver SPI interface and watchdog supervision; M4 executes FFT-based spectral analysis on accelerometer data buffered in SRAM.

Use Value: 22 µA/MHz M4 efficiency at 0.9 V extends field life; hardware AES-128 encrypts sensor payloads before transmission.

Use Scenario: Tamper-resistant door controller using fingerprint matching, NFC card read, and encrypted audit logging.

IC Role / Device Role / Timing Role: ROM-based Secure Boot validates signed firmware; crypto accelerator performs ECDSA signature verification; eFuse stores unique device keys.

Use Value: Eight Protection Contexts isolate biometric processing, NFC stack, and log storage; debug ports permanently disabled post-deployment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP LPC55S69-JBD100Single Cortex-M33 core (no M0+ companion); TrustZone instead of Protection Contexts; no integrated SIMO DC-DCLacks hardware CAPSENSE™ and Smart I/O; requires external PMIC for sub-10-µA Deep SleepPrefer when Arm TrustZone ecosystem integration outweighs need for ultra-low-power analog integration
Renesas RA6M5Single Cortex-M33 core; 2-MB flash; no on-chip capacitive sensing; different crypto IP (AES-GCM, SHA-256)No native CAPSENSE™ or Smart I/O; uses external touch controller; higher active current (45 µA/MHz)Prefer when larger flash and Ethernet MAC are required over capacitive sensing and sub-µA DC-DC

Compared with LPC55S69-JBD100 and RA6M5, CY8C6247BZI-D54 uniquely combines dual-core asymmetry, on-die SIMO regulation, CAPSENSE™, and Smart I/O-enabling single-chip sensor fusion and UI in space-constrained, battery-operated endpoints without external analog or power components.

Availability

CY8C6247BZI-D54 is available at Aetrix Electronics and suitable for smart home sensor hubs, wearable health monitors, industrial wireless nodes, and secure access control terminals requiring stable component supply across multi-year production cycles.

Supply support for CY8C6247BZI-D54 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security ICs, with global manufacturing and R&D infrastructure.

The PSoC™ 62 product line delivers programmable, secure, ultra-low-power MCUs purpose-built for intelligent edge devices in IoT, wearables, and industrial automation-integrating analog, digital, and security resources on a single die.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6247BZI-D54?

The Cortex-M4F core operates at up to 150 MHz, confirmed in the datasheet's "CPU and Memory Subsystem" section. This frequency is achievable under 1.1-V core supply with appropriate thermal and voltage margining. At 0.9-V core, the maximum rated frequency is 100 MHz to maintain timing closure and power efficiency.

Does CY8C6247BZI-D54 support external memory execution via QSPI?

Yes-it supports Execute-In-Place (XIP) directly from external quad-SPI flash using the Serial Memory Interface (SMIF), with hardware-accelerated AES encryption/decryption and a dedicated 4-KB cache to reduce latency and power. XIP is enabled via SMIF configuration registers and requires no host CPU intervention during instruction fetch.

How many GPIO pins support overvoltage tolerance (OVT)?

Six GPIO pins are explicitly designated as overvoltage-tolerant (OVT), as specified in Section 6.2.4 "GPIO" of the datasheet. These pins tolerate up to 5.5 V regardless of VDDIO supply level, enabling direct interfacing with legacy 5-V logic or sensors without level shifters.

Can the CAPSENSE™ subsystem operate during Deep Sleep mode?

Yes-CAPSENSE™ can perform low-power scanning in Deep Sleep mode using the dedicated low-power comparators and IDACs. The SmartSense auto-tuning engine remains functional, and results are stored in retained SRAM. Full-resolution scans require waking the M0+ core, but baseline tracking and gesture detection run autonomously.

CY8C6247BZI-D54 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
124-VFBGA
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6247BZI-D54 FAQ

1.How can I place an order for CY8C6247BZI-D54 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6247BZI-D54 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6247BZI-D54 reliable?

The price and inventory of CY8C6247BZI-D54 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6247BZI-D54 is usually 5 days.

3.What payment methods are accepted for CY8C6247BZI-D54?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6247BZI-D54 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6247BZI-D54?

CY8C6247BZI-D54 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6247BZI-D54 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6247BZI-D54?

For technical support, including CY8C6247BZI-D54 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6247BZI-D54 requirements.

6.How does Aetrix verify that CY8C6247BZI-D54 is sourced from the original manufacturer or authorized distributors?

All CY8C6247BZI-D54 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6247BZI-D54 meets industry standards.

7.What is the process for return or replacement of CY8C6247BZI-D54?

All CY8C6247BZI-D54 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6247BZI-D54, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6247BZI-D54 part is unused and in its original packaging.

Return procedure for CY8C6247BZI-D54:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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